International Advisory Committee Members
       
Dr. Minhwa Chi
Co-Chair
SVP/TD, SiEn (Qingdao) Integrated Circuits
Dr. Philip Wong
Co-Chair
Professor, Stanford University, USA
       
Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland
Dr. Qingyuan Han
Member
Hans Consulting International, USA
       
Dr. Kinam KIM
Member
Vice Chairman & CEO, Samsung Electronics, Korea

Mrs. Ying Shi
Member
ICMTIA, China

       
Dr. Hailing Tu
Member
GRINM, China
Dr. Shichang Zou
Member
Chinese Academy of Sciences, China

       
Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
Dr. Shaojun WEI
Member
Professor, Tsinghua Universtiy, China

       
Dr. Chenming HU
Member
Professor, UC Berkeley, USA

   
       
       
Steering Committee Advisors
       
Mr. Lung Chu
President,SEMI China
Vice President,SEMI
Dr. Hanming Wu
Member
Dean of the School of Micro-nano-Electronics, Zhejiang University, China
       
Dr. Hiroshi IWai
Member
Tokyo Institute of Technology, Yokohama, Japan
Dr. Tomi T. Li
Member
National Taiwan Central University
       
       
Conference Executive Committee Members
       
Dr. Beichao Zhang
Conference Chair,
VP of Hangzhou HFC, China
Prof. Bin Yu
Conference Executive Co-Chair,
Professor, Zhejiang University, China
       
Prof. Ru Huang
Symp-I Chair, Conference Co-Chair
Professor and President, Southeast University, China
Dr. Cor Claeys
Conference Co-Chair and Award Selection Chair
Professor, KU Leuven, Belgium
       
Dr. Linyong (Leo) Pang
Symp-II Chair
VP, D2S Inc., USA
Dr. Ying ZHANG
Symp-III Chair
Consultant
       
Dr. Xiaoping Shi
Symp-IV Chair
CTO, Beijing Naura Microelectronics, China
Dr. Xinping Qu
Symp-V Chair
Professor, Fudan University, China
       
Dr. Xiaowei Li
Symp-VI Chair
Deputy Director, ICT, CAS, China
Dr. Steve X. Liang
Symp-VII Chair
       
Prof. Jianshi Tang
Symp-VIII Chair
Tsinghua University, China
Prof. Pingqiang Zhou
Symp-IX Chair
Shanghai Tech University
       
Prof. Cheng Zhuo
Symp-X Chair
Zhejiang University, China
Dr. Hsiang-Lan Lung
Poster Chair
Director MXIC, Taiwan, China
       
       
Symposium I: Device Engineering and Technology
       
Prof. Ru Huang
Chair
Southeast University, China
Dr. Cor Claeys
Co-Chair
KU Leuven, Belgium
       
Dr. Minhwa Chi
Co-Chair
SiEn (Qindao) Integrated Circuits Co.
Dr. Chung Lam
Co-Chair
Jiangsu Advanced Memory Technology Co. Ltd., China
       
Prof. Jong-Ho Lee
Co-Chair
Seoul National University, Korea
Prof. Ming Liu
Co-Chair
Fudan University, China
       
Prof. Yuchao Yang
Co-Chair
Peking University, China
Dr. Wensheng Qian
Member
HHGrace
       
Dr. Huiling Shang
Member
TSMC
Dr. Zhiqiang Wei
Member
Avalanche Technology
       
Dr. Hong Wu
Member
Technology R&D, SMIC, China
Prof. Huaqiang Wu
Member
Microelectronics, Tsinghua University, Beijing, China
       
Dr. Frank Bin Yang
Member
Qualcomm, USA
Prof. Mario Lanza
Member
the King Abdullah University of Science and Technology (KAUST), Saudi Arabia
       
Prof. Xinran Wang
Member
Nanjing University, China
Prof. Qianqian Huang
Member
Peking University, China
       
Prof. Peng Zhou
Member
Fudan University, China
Prof. Bin Yu
Member
Zhejiang University, China
       
Prof. Ming He
Member
Peking University, China






Symposium II: Lithography and Patterning
       
Dr. Linyong (Leo) Pang
Chair
D2S Inc., USA
Dr. Kafai Lai
Co-Chair
IBM T.J. Watson Research Center, USA
       
Dr. Qiang Wu
Co-Chair
Fudan University
Dr. George Lu
Co-Chair
DuPont
       
Prof. Yayi Wei
Member
IMECAS, China
Mr. Xiaoming Ma
Member
Suzhou Runbang semiconductor material technology Co., Ltd
       
Dr. Zhimin Zhu
Member
Brewer Science, USA
  Dr. Zhibiao Mao
Member
Nata Chemicals
       
Mr. Motokatsu Imai
Member
Mito Kogyo CO., LTD, Japan
Dr. Hai Deng
Member
Fudan University, China
       
Dr. Shiyuan Liu
Member
Huazhong University of Science and Technology , China
Dr. Wang Yueh
Member
Intel, USA
       
Dr. Ban-Ching Ho
Member
Nissan Chemicals
Dr. Yuyang Sun
Member
Photronics




Dr. David H. Wei
Member
ASML Brion
Dr. Chris Progler
Member
Photronics




Dr. Weimin Gao
Member
ASML
Mr. Wenzhan Zhou
Member
Shanghai Huali Microelectronics Corp
       
Symposium III: Dry &Wet Etch and Cleaning
       
Dr. Ying ZHANG
Chair
Consultant
Mr. Hai Cong
Co-Chair
Advanced Micro-Fabrication Equipment Inc. (AMEC), China
       
Mr. Jinrong Zhao
Member
Naura, China
Dr. Steven Zhang
Member
SMIC, China
       
Dr. Kaidong Xu
Member
Leuven Instruments, China
Dr. Huiyuan Pei
Member
Lam Research, China
       
Dr. Kevin Zhou
Member
Naura, China
Dr. Ying Xiao
Member
TEL, China
       
Dr. Jianping Zhao
Member
TEL, USA
Dr. Yongyou (Clark) CAO
Member
Beijing Naura Microelectronics, China
       
Symposium IV: Thin film, Plating and Process Integration
       
Dr. Xiaoping Shi
Chair
Beijing Naura Microelectronics, China
Dr. Zhen Guo
Co-Chair
Microsoft, USA
       
Dr. Beichao Zhang
Co-Chair
VP of Hangzhou HFC, China
Dr. Chao Zhao
Co-Chair
Beijing Superstring Academy of Memory Technology (SAMT), China
       
Dr. Huang Liu
Co-Chair
HFC Semiconductor
Dr. Jiang Yan
Co-Chair
North China University of Technology, China
       
Dr. Chih-Chao Yang
Co-Chair
IBM Research
Dr. Ran Liu
Member
Fudan University, China
       
Prof. Yu-Long Jiang
Member
Fudan University, Shanghai
Dr. Li-Qun Xia
Member
Applied Materials, USA
       
Dr. Jianhua Ju
Member
HFC Semiconductor
Dr. Ganming Zhao
Member
Mattson
       
Dr. Larry Zhao
Member
Applied Materials, USA

Dr. Jiaxiang Nie
Member
Leadmicro, China

       

Dr. Xun Gu
Member
ASM
Dr. Sean Chang
Member
PIOTECH
       
Dr. Heng Tao
Member
AMEC, China
Dr. Chenyu Wang
Member
Applied Materials, China
       
Symposium V: CMP & Cleaning
       
Dr. Xinping Qu
Chair
Fudan University, China
Dr. Yuchun Wang
Co-Chair
Anji Microelectronics, China
       
Dr. Jingxun Fang
Co-Chair
Huali Microelectronics Corporation, China
Dr. Jin-Goo Park
Member
Hanyang University, Korea
       
Dr. Shoutian Li
Member
Anji Microelectronics, China
Dr. XinChun Lu
Member
Tsinghua University, China
       
       
Dr. Chao-Chang Arthur Chen
Member
NTUST, Taiwan, China
Dr. Baoguo Zhang
Member
Hebei University of Technology, China
       
Dr. Yonggen He
Member
GrandiT Co., Ltd., China
Dr. Jie Cheng
Member
China University of Mining and Technology-Beijing
       
Symposium VI: Metrology, Reliability and Testing
       
Dr. Xiaowei Li
Chair
Deputy Director, ICT, CAS, China
Dr. Peilin Song
Co-Chair
IBM, USA
       
Dr. Frank Feng
Member
Synopsys
Dr. Yiping Xu
Member
Raintree Technologies Corp
       
Dr. Yuhua Cheng
Member
Peking University, China
Dr. Francis Jen
Member
KLA Tencor, China
       
Dr. Kelvin Xia
Member
Huatek, China
Dr. Srinivas Raghvendra
Member
Synopsys, USA
       
Dr. Yu Huang
Member
Mentor Graphics, USA
Dr. Jian-fu Zhang
Member
Liverpool John Moores University, England
       
Dr. Houken Tseng
Member
Teradyne, Greater China, China
Dr. Yu Zhu
Member
Jiangsu Advanced Memory Semiconductor (AMS) Co., Ltd.
       
Dr. Tung-Yang Chen
Member
AIP Technology Corporation, Taiwan, China
Dr. Jianuo Shi
Member
KLA Corporation




Symposium VII: Packaging and Assembly
       
Dr. Steve X. Liang
Chair
Prof. Xing Wu
Co-Chair
East China Normal University
       
Dr. Yifan Guo
Co-Chair
Yibu Semiconductor
Dr. Huili Fu
Co-Chair
       
Dr. Mark Huang
Member
Shenzhen University, China
Prof. Mingliang Huang
Member
Dalian University of Technology, China
       
Prof. Kuan-Neng Chen
Member
National Chiao Tung University
Dr. Shin-Puu Jeng
Member
TSMC
       
Prof. Wenhui Zhu
Member
Central South University
  Mr. John Rowland
Member
Spreadtrum
       
Dr. John Yuanlin Xie
Member
Altera Corp., CA, USA
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
       
Dr. Yishao Lai
Member
ASE. Taiwan, China
Dr. Jing Shi
Member
Oracle, USA
       
Dr. Young Do Kweon
Member
Samsung, Korea
Dr. Renzhe Zhao
Member
Huawei, China
       
  Dr. Hong SHI
Member
Xilinx
Dr. Tim Bao
Member
Air Products and Chemicals, Inc
       
Dr. Tim Chen
Member
Yantai Darbond Technology Co., Ltd.
Dr. Daniel Lu
Member
Henkel
       
Dr. Wang Su
Member
Shanghai Sinyang Semiconductor Materials
Prof. Horng-Show (Frank) Koo
Member
University into Taipei University of Marine Technology (TUMT)
       
Dr. Daquan Yu
Member
Xiamen Sky Semiconductor Co., Ltd.
Dr. Minghai Wang
Member
Bonotec Electronic Materials
       
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
       
Prof. Jianshi Tang
Co-Chair
Tsinghua University, China
Prof. Wei Wang
Co-Chair
Peking University, China
       
Dr. Hsiang-Lan Lung
Co-Chair
Macronix International Ltd., Hsinchu, Taiwan, China
Prof. Chen Wang
Member
Tsinghua University, China
       
Prof. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
Dr. Chang Chen
Member
Shanghai Jiaotong University, China
       
Prof. Thomas Otto
Member
Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
Dr. Alex Gu
Member
Shanghai University and SITRI, China
       
Prof. Zhen Zhang
Member
Uppsala University, Sweden
Prof. Daniele Ielmini
Member
Politecnico Di Milano, Italy
       
Prof. Haifang Jian
Member
Institute of Semiconductor, Chinese Academy of Sciences, China
Prof. Kechao Tang
Member
Peking University, China
       
Prof. Qiming Shao
Member
Hong Kong University of Science and Technology
Prof. Shijun Liang
Member
Nanjing University, China
       
Prof. Xiaodong Huang
Member
Southeast University of China
Prof. Zhuoqing Yang
Member
Shanghai Jiaotong University, China
       
Symposium IX: Design and Automation of Circuits and Systems
       
Prof. Pingqiang Zhou
Chair
Shanghai Tech University
Prof. Weikang Qian
Co-Chair
University of Michigan-Shanghai Jiao Tong University Joint Institute, China
       
Dr. Wen‐Hu Zhao
Co-Chair
Jiangsu Industrial Technology Research Institute, China
Prof. Xunzhao Yin
Co-Chair
Zhejiang University
       
Prof. Le Ye
Member
Peking University, China
Prof. Wenjian Yu
Member
Tsinghua University, China
       
Prof. Yiyu Shi
Member
University of Notre Dame, USA
Dr. Jinjun Xiong
Member
IBM T.J. Watson Research Center, USA
       
Prof. Yu-Guang Chen
Member
Yuan-Ze University, Taiwan, China
Prof. Baoyong Chi
Member
Tsinghua University, China
       
Prof. Yinhe Han
Member
Chinese Academy of Science, China
  Li Li
Member
Synopsys Inc., Shanghai
       
  Dr. Bing Li
Member
Technical University of Munich, Germany
Prof. Shaojun Wei
Member
Tsinghua University, China
       
  Prof. Xiaoyang Zeng
Member
Fudan University
  Prof. Chuan Zhang
Member
Southeast University
       
Dr. Jianli Chen
Member
Fuzhou University
  Dr. Changhao Yan
Member
Fudan University
       
Dr. Haibao CHEN
Member
Shanghai Jiaotong University
Dr. Jun TAO
Member
Fudan University
       
Dr. Zhufei CHU
Member
Ningbo University
He Li
Member
Southeast University
       
Dr. Aili WANG
Member
Zhejiang University, China
   
       
Symposium X: AI & IC Manufacturing
       
Prof. Cheng Zhuo
Chair
Zhejiang University, China
Prof. Bin Yu
Co-Chair
Zhejiang University, China
       
Prof. Jinfeng Kang
Co-Chair
Peking University
Prof. Feng Miao
Member
Nanjing University, China
       
Prof. Ye Lu
Member
Fudan University, China
Dr. Zhiqiang Su
Member
XTX Technology Inc., China




Dr. Genquan Han
Member
Xidian University, China
Dr. Tawfique Hasan
Member
University of Cambridge, UK




Prof. Bin Gao
Member
Tsinghua University, China
Prof. Feng Zhang
Member
Institute of Microelectronics of Chinese Academy of Sciences, China




Dr. Yu Han
Member
Empyrean Technology Co. LTD.
Dr. Liu Hongjie
Member
Shenzhen Reexen Technology Co., Ltd.





Prof .Yang Chai
Member
Hong Kong Polytechnic University
Dr. Zhenyu Huang
Member
Intel Dalian




Prof. Yang Xu
Member
Zhejiang University
Prof. Chang Gao
Member
Technische Universiteit Delft, Netherlands




Dr. Zhiliang Xia
Member
Yangtze Memory Technology Co., Ltd
Dr. Ni Dong
Member
Zhejiang University
       
Prof. John Paul Strachan
Member
Forschungszentrum Jülich and RWTH Aachen University
Dr. Zhu Yao
Member
Institute of Microelectronics (IME), A*STAR Singapore





Conference Questions   Sponsorship Contact  
       
April Peng, SEMI China Cheryl Qiu, SEMI China Xianbo Sun, SEMI China  
Email: [email protected] Tel: 86.21.6027.8552 Tel: 86.21.6027.8569  
  Fax: 86.21.6027.8511 Fax: 86.21.6027.8511  
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