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Chinese
2020年6月27-29日
上海新国际博览中心

Dr. Steven Zhang

Dr. Steven Zhang

SMIC, China


Steven Zhang(Haiyang Zhang), received his B.S., M.S. and Ph.D. degrees from Peiyang University, Tianjin, China, in 1991, 1994 and 1997, respectively and Ph. D degree in advanced process control of dry etching process from University of Houston, Texas, USA, in 2002, all in chemical engineering.
Since May, 2004, he has been with Technology R&D/micro-patterning/etch group of Semiconductor Manufacturing International (Shanghai) Corp, China. He spent more than seven years on start-up, development, optimization and transfer of 90nm logic spacer and contact etch on 200mm wafers at Shanghai (one year), 65nm logic Si-etch and 65nm logic BEOL etch on 300mm wafers at Beijing (three years) and 45/40nm logic BEOL etch on 300mm wafers at Shanghai (two years). He was ever involved in the crucial technique R&D of 90nm-65nm ultra-scale semiconductor manufacturing, the construction and verification of 65nm logic technology platform on 300mm semiconductor manufacturing tools, the R&D of 65-45-32nm semiconductor manufacturing processes and sub32nm double patterning technique.
Currently as a senior manager, he is focusing on the R&D of 32nm/28nm logic BEOL etch and SoC BEOL etch such as 45nm PC-RAM. He is presently the author and/or co-author of 50 patents and 20 dry etching related technical papers.