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| Date: | Sunday-Tuesday, March 22-24, 2026 |
| Venue: | Kerry Hotel Pudong, Shanghai 上海浦东嘉里大酒店 |
| No.1388 Hua Mu Road, Pudong, Shanghai, 201204, China 中国上海浦东花木路1388号 |
Distinguished Conference Keynote Speakers
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| Plenary Session |
| Sunday, March 22, 2026 | |
| Meeting Room: | 3F, Pudong Ballroom |
| 08:15-08:45 | Registration |
| 08:45-09:25 | Opening Ceremony |
| Opening Remarks by Conference Chair | |
| Opening Remarks by SEMI | |
| Opening Remarks by IEEE | |
| Presentation of the Best Student Paper Awards and the Best Young Engineer Paper Awards | |
| 09:25-10:00 | Changing the Face of Silicon: Curvy Manufacturing Will Lead to Curvy Design |
| Mr. Aki Fujimura | |
| Chairman and CEO, D2S, Inc., USA | |
| 10:00-10:35 | Fundamentals of Thin-Film Transistors: From Structure to Applications |
| Prof. Arokia Nathan | |
| Bye-Fellow and Tutor at Darwin College, Cambridge University, UK | |
| 10:35-11:10 | Xtacking Architecture Assist Future Chip Innovation and Development |
| Dr. Zongliang Huo | |
| Chief Scientist, Yangtze Memory Technology, China | |
| 11:10-11:45 | Nondestructive 3D Imaging of ICs for Metrology, Defect Inspection and Reliability Engineering |
| Dr. Ehrenfried Zschech | |
| Member, EurASc and ACATECH, Germany | |
Symposium Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Advanced Packaging and Heterogeneous Integration
Symposium VIII: More than Moore and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Symposium X: AI & IC Manufacturing
Parallel Symposium Sessions
| Sunday, March 22, 2026 | |
| 13:30-16:20 | Symposium Oral Session |
| 16:30-18:00 | Panel Discussion |
| Monday, March 23, 2026 | |
| 08:30-16:00 | Symposium Oral Session |
| 16:00-18:00 | Conference Poster Session |
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| Tuesday, March 24, 2026 | |
| 08:30-12:00 | Symposium Oral Session |
Panel Discussion
| 16:30-18:00, Sunday, March 22, 2026 | |||||||
| Meeting Room: Pudong Ballroom 1 | |||||||
| Topic: What will shape the semiconductor landscape for the next decade? | |||||||
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Panelists: |
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Prof. Cor Claeys KU Leuven, Belgium |
Prof. Arokia Nathan Cambridge University, UK |
Dr. Changze Liu Huawei Semiconductor Division, China |
Mr. Aki Fujimura D2S, Inc., USA |
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Prof. Qianqian Huang Peking University |
Dr. Peng Bai HHGrace, China |
Dr. David Wang Renowned Executive and Innovator, USA |
Dr. Jun Yuan Qualcomm, USA |
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| 12:00-13:00, Monday, March 23, 2026 | ||
| Meeting Room: Pudong Ballroom 6 | ||
| Topic: Women in Electron Device/Young Professionals Panel Session (with Lunch Box and Lucky Draw) |
Training Courses
| Tuesday, March 24, 2026 | ||
| Meeting Room: Pudong Ballroom 5 | ||
| 08:45-10:15 | SEMI U Tutorial: Plasma Etch and Advanced Patterning | |
| 10:30-12:00 | SEMI U Tutorial: Computing-in-Memory Technology (CIM) | |
Floor Plan
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