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Changze Liu (Member, IEEE) received his Ph.D. degree in electronics engineering from Peking University, Beijing, China, in 2013. Then, he joined the Semiconductor Division, Samsung Electronics, where he involved in the development of 14/10/7-nm processes. In 2017, he joined Huawei, Shenzhen, China, as technical expert for product R&D in advanced technology node. From 2020, he served as the CEO of Huawei Technologies Research and Development Belgium NV, Leuven, Belgium. Currently he serves as director of research in Huawei semiconductor division. He has authored and coauthored over 60 scientific papers, including IEEE IEDM, VLSI, and IRPS. Dr. Liu served for the Technical Program Committee of IEEE IEDM, EDTM, IRPS, ISCAS, IPFA, ESSERC and ESREF.
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