亚洲化合物半导体大会 2026
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| 日期： | 2026年3月24-26日 周二-周四 | |
| 地点： | 上海浦东嘉里大酒店，三楼 | |
| 地址： | 上海市浦东新区花木路1388号 | |
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现场提供中英文同声传译 | |
The "CS Asia Conference 2026", which is one of the largest professional events about compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2026 on Mar 24-26, 2026, at Kerry Hotel in Shanghai.
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SPONSORS
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THANKS
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Featured Speakers / 特邀讲师：
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Dr. Russell Low President & CEO Axcelis Technologies |
Dr. Jeffrey Wang CEO Advanced Microsemi |
Dr. Johannes Schoiswohl SVP & GM of GaN Business Line Infineon Technologies |
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James LIU Founder and CEO RaySea Technology |
Francesco MUGGERI VP for Power Discrete & Analog Products, China STMicroelectronics |
MO Qingwei Chief Scientist ZJ Eagles Comsemi Technology |
| 13:00-16:30 | CS Asia Conference - Opening Keynote / 亚洲化合物半导体大会 - 开幕主题演讲 | |
| Day 1- Mar.24th, 2026 Shanghai Ballroom 3 / 上海厅 3 | ||
13:15-13:30
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Welcome Remark / 欢迎致辞 Lily Feng, President, SEMI China 冯莉，SEMI 中国总裁 |
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| 13:30-14:00 |
GaN: Driving Efficiency & Empowering Future 氮化镓：驱动高效，赋能未来 Dr. Jeffrey Wang 王庆宇 CEO of Advanced Micro Semiconductors Co., Ltd. 总经理，上海新微半导体有限公司 |
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| 14:00-14:30 |
Gallium Nitride: A Key Enabler for Next Gen AI Datacenters 氮化镓赋能未来：驱动新一代AI数据中心高效升级 Dr. Johannes Schoiswohl Senior Vice President and General Manager GaN Business Line Infineon Technologies |
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| 14:30-15:00 |
TBD Dr. Russell Low President & CEO Axcelis Technologies |
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| 15:00-15:30 |
TBD Dr. Sanjai Parthasarathi CMO Coherent |
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| 15:30-16:00 | Reserved | |
| 16:00-16:30 |
TBD Jonathan Liao Sr Director of Product Markeing Wolfspeed |
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| 09:00-11:30 | Session 1: Compound Semiconductors Power AI Era / 分会1：化合物半导体助力人工智能时代 | |
| Day 2- Mar.25th, 2026 Pudong Ballroom 1 / 浦东厅 1 | ||
| 09:15-09:45 |
VCSEL Applications in AI Generation VCSEL在人工智能时代的应用 Qingwei MO 莫庆伟 Chief Scientist of ZJ Eagles Comsemi Technology 首席科学家，浙江老鹰半导体技术有限公司 |
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| 09:45-10:15 |
Design and Fabrication of High-Performance AR Waveguide 高性能AR衍射波导设计与加工 Kaikai DU 杜凯凯 CEO of Moldnano (Hangzhou) Technology Co., Ltd 首席执行官，慕德微纳（杭州）科技有限公司 |
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| 10:15-10:40 |
Empowering Everything: When Advanced Power Meets Intelligent Semiconductors 赋能万物：当先进电源遇上智能半导体 Xinping YE 叶新平 Director of Product Marketing, DELTA 产品行销总监，台达 |
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| 10:40-11:05 |
Leverage Electrical to Physical Failure Analysis Workflows to Accelerate Semiconductor Development 依靠电性-物性失效分析流程 加速半导体制程研发 Michael Rauscher General Manager, XDB product line Thermo Fisher Scientific |
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| 11:05-11:30 | Reserved | |
| 13:00-16:30 | Session 2: SiC, GaN and Related WBG Materials, Equipment and Devices-1 | |
| 分会2：碳化硅、氮化镓及相关宽禁带半导体材料、设备及器件（1） | ||
| Day 2- Mar.25th, 2026 Pudong Ballroom 1 / 浦东厅 1 | ||
| 13:00-13:30 |
碳化硅技术演变及测试筛选 Haitao HUANG 黄海涛 Deputy GM of INVENTCHIP TECHNOLOGY 副总经理，上海瞻芯电子科技股份有限公司 |
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| 13:30-14:00 |
Breakthroughs and Emerging Applications in Thin-Film Deposition Technology 薄膜沉积技术创新突破与应用发展 Xiaotian LI 李小天 VGM of Shenzhen Naso Tech Co.,Ltd 副总经理，深圳市纳设智能装备股份有限公司 |
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| 14:00-14:25 |
Reserved Axcelis Technologies |
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| 14:25-14:50 |
Technical Challenges and Breakthroughs in The Integration of Wide Bandgap Semiconductor Industry Chain 宽禁带半导体产业链贯通的技术挑战与突破 LIONSGATE SEMI 狮门微 |
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| 14:50-15:15 |
Laser Nano/Micro-Processing Technology Reshapes Semiconductor Manufacturing Process 激光微纳加工技术重塑半导体制造工艺 Wei HUANG 黄伟 事业部总经理，武汉华工激光工程有限责任公司 |
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| 15:15-15:40 |
Reserved 苏州华太电子技术有限公司 |
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| 15:40-16:05 |
化合物半导体技术发展趋势与装备创新 Xiaoliang GONG 巩小亮 总师办、技术总体部主任，中电科电子装备集团有限公司 |
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| 16:05-16:30 | Reserved | |
| 09:00-11:30 | Session 3: III-V Compound Semiconductors / 分会3：III-V 化合物半导体 | |
| Day 3- Mar.26th, 2026 Pudong Ballroom 1 / 浦东厅 1 | ||
| 09:15-09:45 |
Driving The Future: High-Performance Multi-Junction VCSELs for Cars and Robotics James Liu Founder and CEO RaySea Technology Co., Ltd |
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| 09:45-10:15 |
Recent Advances in GaAs and InP-based Epitaxial Material Technologies GaAs和InP基外延材料技术进展 Zhifa SHAN 单智发 CTO of Epihouse Optoelectronics Co., Ltd. 首席技术官，全磊光电股份有限公司 |
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| 10:15-10:40 |
Real-time Monitoring Solutions for Photoresist Coating Process 涂胶工艺的实时检测方案 Tao YANG 杨涛 R&D Manager of Beijing New Eastech Co., Ltd 研发经理，新毅东（北京）科技有限公司 |
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| 10:40-11:05 |
基于MBE技术的锑化物超晶格红外探测材料与器件 Zhicheng XU 徐志成 CEO of Zhongke ABCSTECH 首席执行官，中科爱毕赛思 |
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| 11:05-11:30 | Reserved | |
| 13:00-16:30 | Session 4: SiC, GaN and Related WBG Materials, Equipment and Devices-2 | |
| 分会4：碳化硅、氮化镓及相关宽禁带半导体材料、设备及器件（2） | ||
| Day 3- Mar.26th, 2026 Pudong Ballroom 1 / 浦东厅 1 | ||
| 13:00-13:30 |
Pushing the Technical Frontiers of GaN RF Devices Yi PEI 裴轶 CTO of Dynax Semiconductor 首席技术官，苏州能讯高能半导体 |
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| 13:30-14:00 |
Innovative Semiconductors: The Key to Power-Efficient and Cost-Effective Solutions (Pending) 创新半导体：实现高能效和高性价比解决方案的关键 （暂定） Francesco MUGGERI Vice President for Power Discrete and Analog Products, China, STMicroelectronics 亚太区功率分立和模拟产品器件部市场和应用副总裁，意法半导体 |
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| 14:00-14:25 |
Reserved AIXTRON SE 德国爱思强公司 |
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| 14:25-14:50 |
Progress of Large-scale and High-quality Gallium Oxide Single Crystal Semiconductor Materials (Pending) 大尺寸高质量第四代半导体氧化镓单晶衬底材料新进展（暂定） Jiwei JIANG 江继伟 Co-Founder, Hangzhou Garen Semiconductor Co., Ltd 联合创始人，杭州镓仁半导体有限公司 |
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| 14:50-15:15 |
An Ion Implanter for SiC Devices 碳化硅电力电子器件用离子注入机 Weijiang ZHAO 赵维江 VGM of Nissin Ion Equipment (Shanghai) Co., Ltd. 副总经理，日亚意旺机械（上海）有限公司 |
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| 15:15-15:40 |
Reserved NAURA |
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| 15:40-16:05 | Reserved | |
| 16:05-16:35 | Closing Keynote / 闭幕演讲 | |
三天会议注册费：
| 类型 | 提前注册并付费（3月6日之前） | 注册费（3月6日之后）及现场付费 |
| 听众 | RMB 1,000/位 | RMB 1,500/位 |
| 讲师 | Free | Free |
▶ 议程变化恕不另行通知
联系方式 / Contacts：
| 吴迪 / Ein Wu | 金禹梅 / Ella Jin |
| Tel: 021.6027.8509 | Tel: 021.6027.7648 |
| Email: [email protected] | Email: [email protected] |