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13:00-16:30
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CS Asia Conference - Opening Keynote / 亚洲化合物半导体大会 - 开幕主题演讲
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Day 1- Mar.24th, 2026 Shanghai Ballroom 3 / 上海厅 3
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13:15-13:30
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Welcome Remark / 欢迎致辞
Lily Feng, President, SEMI China
冯莉，SEMI 中国总裁
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Moderator / 主持人：
David Xiao, Board Chair of APT Electronics Co., Ltd./AscenPower
肖国伟，董事长，广东晶科电子股份有限公司/广东芯粤能半导体有限公司
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13:30-14:00
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GaN: Driving Efficiency & Empowering Future
氮化镓：驱动高效，赋能未来
Dr. Jeffrey Wang 王庆宇
CEO of Advanced Micro Semiconductors Co., Ltd.
总经理，上海新微半导体有限公司
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14:00-14:30
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GaN: Enabling the Next Generation of High-Density AI Powertrain
Dr. Johannes Schoiswohl
Senior Vice President and General Manager GaN Business Line
Infineon Technologies
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14:30-15:00
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Ion Implantation Innovations Driving Power and Compound Semiconductor Performance
Dr. Russell Low
President & CEO
Axcelis Technologies
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15:00-15:30
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TBD
Dr. Chao GAO 高超
CTO of SICC CO., LTD.
首席技术官，山东天岳先进
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15:30-16:00
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Reserved
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16:00-16:30
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TBD
Jonathan Liao
Sr. Director of Product Marketing
Wolfspeed
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16:30-16:40
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Lucky Draw / 幸运抽奖，抽取大奖iPad
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09:00-11:30
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Session 1: Compound Semiconductors Power AI Era / 分会1：化合物半导体助力人工智能时代
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Day 2- Mar.25th, 2026 Pudong Ballroom 1 / 浦东厅 1
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09:15-09:45
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VCSEL Applications in AI Generation
VCSEL在人工智能时代的应用
Qingwei MO 莫庆伟
Chief Scientist of ZJ Eagles Comsemi Technology
首席科学家，浙江老鹰半导体技术有限公司
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09:45-10:15
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Design and Fabrication of High-Performance AR Waveguide
高性能AR衍射波导设计与加工
Kaikai DU 杜凯凯
CEO of Moldnano (Hangzhou) Technology Co., Ltd
首席执行官，慕德微纳（杭州）科技有限公司
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10:15-10:40
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Empowering Everything: When Advanced Power Meets Intelligent Semiconductors
赋能万物：当先进电源遇上智能半导体
Xinping YE 叶新平
Director of Product Marketing, DELTA
产品行销总监，台达
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10:40-11:05
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Leverage Electrical to Physical Failure Analysis Workflows to Accelerate Semiconductor Development
依靠电性-物性失效分析流程 加速半导体制程研发
Michael Rauscher
General Manager, XDB product line
Thermo Fisher Scientific
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11:05-11:30
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Compound Semiconductors Empower The AI Era Technology Evolution
CHIU Poshun
Principal Analyst
Yole Group
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13:00-16:30
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Session 2: SiC, GaN and Related WBG Materials, Equipment and Devices-1
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分会2：碳化硅、氮化镓及相关宽禁带半导体材料、设备及器件（1）
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Day 2- Mar.25th, 2026 Pudong Ballroom 1 / 浦东厅 1
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Moderator / 主持人：
Gan FENG, General Manager of Epiworld International Co.,Ltd
冯淦，总经理，瀚天天成电子科技（厦门）有限公司
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13:00-13:30
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SiC MOSFET Technology Evolution and Screening Test
碳化硅技术演变及测试筛选
Haitao HUANG 黄海涛
Deputy GM of INVENTCHIP TECHNOLOGY
副总经理，上海瞻芯电子科技股份有限公司
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13:30-14:00
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Breakthroughs and Emerging Applications in Thin-Film Deposition Technology
薄膜沉积技术创新突破与应用发展
Xiaotian LI 李小天
VGM of Shenzhen Naso Tech Co.,Ltd
副总经理，深圳市纳设智能装备股份有限公司
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14:00-14:25
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Innovative Implant Solutions Empower SiC Super Junction Cost Reduction
Dr. Hongchen ZHAO
Worldwide Applications Director
Axcelis Technologies, Inc.
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14:25-14:50
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From Silicon IGBT to SiC MOSFET: Emerging Thermal Limitations in Power Semiconductor Devices
从Si IGBT 到 SiC MOSFET：功率半导体器件中逐渐显现的热限制
Domenico Lo Verde 多梅尼科 • 洛 • 威尔德
CTO of LIONSGATE SEMI
首席技术官，狮门微
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14:50-15:15
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Laser Nano/Micro-Processing Technology Reshapes Semiconductor Manufacturing Process
激光微纳加工技术重塑半导体制造工艺
Wei HUANG 黄伟
事业部总经理，武汉华工激光工程有限责任公司
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15:15-15:40
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Next-Generation RF Generator Empowered by Ultra-High-Voltage LDMOS Power Amplifier
超高压射频 LDMOS 功率放大芯片赋能下一代半导体射频电源
Haoyu LIU 刘昊宇
产品线CEO，苏州华太电子技术有限公司
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15:40-16:05
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Technology Trends and Equipment Innovation of Compound Semiconductor
化合物半导体技术发展趋势与装备创新
Xiaoliang GONG 巩小亮
Director of General Technical Department, CETC
总师办、技术总体部主任，中电科电子装备集团有限公司
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16:05-16:30
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TBD
Qiongying HU 胡琼颖
Corporate Strategic Marketing Director, Coherent
市场战略总监，Coherent
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16:30-16:40
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Lucky Draw / 幸运抽奖，抽取电动牙刷、iPad等精美奖品
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09:00-11:30
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Session 3: III-V Compound Semiconductors / 分会3：III-V 化合物半导体
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Day 3- Mar.26th, 2026 Pudong Ballroom 1 / 浦东厅 1
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Moderator / 主持人：
Shunfeng LI, Executive Director, Suzhou Everbright Institute of Semiconductor Lasers
李顺峰，执行总监，苏州长光华芯光电技术股份有限公司
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09:15-09:45
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Driving The Future: High-Performance Multi-Junction VCSELs for Cars and Robotics
James Liu
Founder and CEO
RaySea Technology Co., Ltd
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09:45-10:15
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Recent Advances in GaAs and InP-based Epitaxial Material Technologies
GaAs和InP基外延材料技术进展
Zhifa SHAN 单智发
CTO of Epihouse Optoelectronics Co., Ltd.
首席技术官，全磊光电股份有限公司
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10:15-10:40
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Real-time Monitoring Solutions for Photoresist Coating Process
涂胶工艺的实时检测方案
Tao YANG 杨涛
R&D Manager of Beijing New Eastech Co., Ltd
研发经理，新毅东（北京）科技有限公司
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10:40-11:05
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Antimonide Superlattice Infrared Detection Materials and Devices Based on MBE Technology
基于MBE技术的锑化物超晶格红外探测材料与器件
Zhicheng XU 徐志成
CEO of Zhongke ABCSTECH
首席执行官，中科爱毕赛思
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11:05-11:30
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Reserved
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13:00-16:30
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Session 4: SiC, GaN and Related WBG Materials, Equipment and Devices-2
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分会4：碳化硅、氮化镓及相关宽禁带半导体材料、设备及器件（2）
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Day 3- Mar.26th, 2026 Pudong Ballroom 1 / 浦东厅 1
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Moderator / 主持人：
Jiangbo WANG, CTO of BOE HC SemiTek Corporation
王江波，首席技术官，京东方华灿光电股份有限公司
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13:00-13:30
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Pushing the Technical Frontiers of GaN RF Devices
Yi PEI 裴轶
CTO of Dynax Semiconductor
首席技术官，苏州能讯高能半导体
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13:30-14:00
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TBD
Francesco MUGGERI
Vice President for Power Discrete and Analog Products, China, STMicroelectronics
亚太区功率分立和模拟产品器件部市场和应用副总裁，意法半导体
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14:00-14:25
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Leading Epitaxy Solutions for High Volume Manufacturing of Compound Semiconductor & Optoelectronic Devices
Nicolas Muesgens
Director Product Management GaN of AIXTRON SE
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14:25-14:50
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Progress of Large-scale and High-quality Gallium Oxide Single Crystal Semiconductor Materials (Pending)
大尺寸高质量第四代半导体氧化镓单晶衬底材料新进展（暂定）
Jiwei JIANG 江继伟
Co-Founder, Hangzhou Garen Semiconductor Co., Ltd
联合创始人，杭州镓仁半导体有限公司
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14:50-15:15
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An Ion Implanter for SiC Devices
碳化硅电力电子器件用离子注入机
Weijiang ZHAO 赵维江
VGM of Nissin Ion Equipment (Shanghai) Co., Ltd.
副总经理，日亚意旺机械（上海）有限公司
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15:15-15:40
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Reserved
NAURA
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15:40-16:05
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Reserved
HORIBA
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16:05-16:35
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Closing Keynote / 闭幕演讲
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16:35-16:45
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Lucky Draw / 幸运抽奖，抽取电动牙刷、iPad等精美奖品
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