论文征集/投稿

Call for Papers (CSTIC 2019)

**Full length manuscripts of accepted papers will be published in IEEE Xplore, and indexed by EI.
Outstanding papers will be recommended for publication in a special issue of a reputable SCI-indexed journal.

How To Write A Quality Abstract?

Abstract Submissions Deadline: September 30, 2018 (Extended to October 15, 2018)
Author Notification Sent: November 1, 2018 (Extended to November 15, 2018)
Final Paper Deadline: December 26, 2018

Scope of Paper Solicited: We aim to provide a platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology. It also offers opportunities for those who are interested in investing and collaboration in the semiconductor industry in Asia, particularly in China. We are soliciting papers from authors around the world on all aspects of semiconductor technology and manufacturing, including device engineering and technology, Front-End-of-Line (FEOL), Back-End-of-Line (BEOL), packaging, metrology and testing, as well as emerging semiconductor technologies and IC design.

Topics to be addressed at CSTIC 2019 include, but are not limited to the following:

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems

Conference Questions		Sponsorship Contact

April Peng, SEMI China	Cheryl Qiu, SEMI China	June Wu, SEMI China
Email: apeng@semichina.org	Tel: 86.21.6027.8552	Tel: 86.21.6027.8523
	Fax: 86.21.6027.8511	Fax: 86.21.6027.8511
	Email: cheryl.qiu@semichina.org	Email: jwu@semi.org