Symposium VI: Metrology, Defect Inspection, Reliability and Testing

Symposium Committee

Dr. Xiaowei Li
Chair 		ICT, CAS, China
   
Prof. David Keezer
Co-Chair 		Eastern Institute of Technology, Ningbo
   
Dr. Frank Feng
Member 		Synopsys, USA
   
Dr. Yiping Xu
Member 		Raintree Technologies Corp, China
   
Dr. Yuhua CHENG
Member 		Peking University, China
   
Dr. Francis JEN
Member 		KLA Tencor, China
   
Dr. Kelvin XIA
Member 		Huatek, China
   
Dr. Srinivas RAGHVENDRA
Member 		Synopsys, USA
   
Dr. Yu Huang
Member 		Mentor Graphics, USA
   
Dr. Jian-fu Zhang
Member 		Liverpool John Moores University
   
Dr. Houken Tseng
Member 		Teradyne, Taiwan, China
   
Dr. Yu Zhu
Member 		TSMC, Taiwan, China
   
Dr. Tung-Yang Chen
Member 		AIP Technology Corporation, Taiwan, China


Dr. Jianuo Shi
Member
 		KLA Corporation
   
Dr. Zhuo-Jie Wu
Member
 		GHS semiconductor



Symposium VI: Metrology, Defect Inspection, Reliability and Testing

1. Defect Analysis & Diagnosis
2. Silicon Debug & Field Monitoring
3. Yield Analysis & Optimization
4. Defect-Based Test and Defect Tolerance
5. Post-silicon Validation and Debug
6. AI algorithms for defect detection and classification
7. Spectroscopic imaging and Raman Spectroscopy
8. Mass spectrometry imaging and Infrared Thermography
9. Electrical characterization and analysis
10. Electron Beam Techniques and Optical Microscopy