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Conference Plenary Speakers (2027)
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Dr. Hanming Wu
Professor, Zhejiang University, China
Academician of Chinese Academy of Engineering, China
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DRAM Evolution and Challenges in Cloud Era
Dr. Chao Zhao
Senior Fellow and VP of CXMT
Fellow of the European Academy of Sciences (EurASc)
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Prof. Mikael Östling
Professor, KTH Royal Institute of Technology, Sweden
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3D Integration Technologies Enable Broad Innovations in Designs and Manufacturing of Advanced Chips and IC Systems
Dr. Andy Chen
Chairman, Piotech, Inc., China
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Partial List of Confirmed Distinguished CSTIC 2027 Keynote & Invited Speakers
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Stanley Seungchul (S.C) Song, Google, US
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Ghavam Shahidi, IBM, USA
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TBD
Guilei Wang, Beijing Superstring Academy of Memory Technology
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Peiwen Li, National Chiao-Tung University
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Chao Xiang, The University of Hong Kong
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Yaoyu Tao, Peking University
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Mott Memristors-based Spiking Neurons for Neuromorphic Sensory Electronics
Bowen Zhu, Westlake University
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Xiwen Liu, The Hong Kong University of Science and Technology (Guangzhou)
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Material Science of Ferroelectric HfxZr1-xO2 Thin Films for High Performance of Non-Volatile Memory Devices
Xiuyan Li, Shanghai Jiao Tong University
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Jiuren Zhou, Xidian University
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Oxygen-Mediated Atomic-Defect Healing for P-Type WSe2 Ballistic Transistor
Xuefei Li, Huazhong University of Science and Technology
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Qingzhu Zhang, Institute of Semiconductors, Chinese Academy of Sciences
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Jun-Wei Luo, Institute of Semiconductors, Chinese Academy of Sciences
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As Small as it Gets: Challenges and Strategies in EUV Photoresists for Future Technology Nodes
Ekinci Yasin, Paul Scherrer Institute (PSI)
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Peter Hu, KLA
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Robert Eklund, Mycronic
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First Analytical Defect Propagation Model in Grapho-Epitaxy of Directed Self-Assembly
Xianhe Liu, Fudan University
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Physical Model Based EUV and DUV Source-Mask co-Optimization with Built-in Hot Spot Evaluation and Mitigation
Qiang Wu, Fudan University
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The Use of 193 nm Immersion Lithography for 5 nm and more Advanced Technology Nodes, the Role of SMO
Yanli Li, Fudan University
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Plasma Etch and Advanced Pattering in Advanced DRAM Technology
Juhani Xiang, CXMT
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HAR Dielectric Etching: Challenges & Solutions
Jiankun Zhang, NAURA
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The Art of ICP Etch for 3D Era
Yuping Ren, AMEC
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Recent Advances in ICP Etching Systems for Next-Generation Advanced Node Device Fabrication
Zheng Tao, Leuven Instruments
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The Uniformity Control for Atomic Layer Deposition Technology
Dongmei Zhai, STIC
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AI-Driven Closed-Loop Manufacturing for High-Aspect-Ratio Plasma Etching: From Inverse Recipe Design to Nondestructive Virtual Metrology
Lang Chen, Peking University
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Advanced Plasma Diagnostics and Modeling: From Fundamental Plasma Physics to Plasma Etching
XinPei Lu, Huazhong University of Science and Technology
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AI and Atomic-Scale Simulation-Driven Optimization for Multi-Material Dry Etching
Zhigang Wang, MRDI
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HAR Dielectric Etching: Challenges & Solutions
Ying Guo, Donghua University
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Multi-Scale Modeling of Cryogenic Etching: From Plasma Kinetics to Surface Reaction Dynamics
Quanzhi Zhang, Dalian University of Technology
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A Mechanistic Study of HBr Etch-Gas Adsorption in a Plasma Etching Chamber
Qinzhen Hao, YMTC
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Sean Seutter, Applied Materials
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High-Mobility Indium-Based Oxide Thin Films: Process and Device Technology
Shen Hu, Fudan University
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Development of Low-Temperature Supercritical Fluid Processes for Silicon-Germanium Gate-All-Around Transistors
Dunbao Ruan, Fuzhou University
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Hf-Vased Ferroelectric Poly-Si Channel FET for NAND Application
Xiaolei Wang, IMECAS
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TBD
Peng Zhao, Peking University
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Investigation of Electron Transport in Subthreshold and Transition Regions of Oxide Semiconductor Transistors by Magneto-Transport Measurements
Mengwei Si, Shanghai Jiao Tong University
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AI-Enabled Digital Engineering for Process Development and Productivity Enhancement in Semiconductor Manufacturing
Weijun Luo, Lam Research
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Latest Progress, Prospects and Challenges on Bulk AlN Crystal Growth by PVT Method
Liang Wu, Ultratrend Technologies Co. Ltd
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TBD
Xiaona Zhu, Fudan University
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HKMG Key Process in SiGe Channel Device
Xiao Yu, Xian University of Electronic Science and Hangzhou Research InstituteTechnolog
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Indium Phosphide Membrane on Silicon (IMOS) Technology and Its Monolithic Integrated Optical Receiver
Jianou Huang, Zhejiang University
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Virtual Metrology and FDC Early Warning for Semiconductor Smart Manufacturing
Ningmu Zou, Nanjing University
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TBD
Shumin Wang, Anji Microelectronics
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Liming Zhang, ANST (Shenzhen) Co., Ltd.
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Applications of Ion Beam Technology in Planarization for Advanced Nodes
Lei Guo, Leuven Instruments
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Weiye Zhang, Zhiren Polishing Material Company
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Precise Topography Control and Defect Mitigation in Advanced Cu Barrier Metal and Hybrid Bonding CMP
Yi Guo, Qnity Electronics
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AI-enabled Full-Lifecycle of CMP Materials: Assisted R&D, Quality Control and Troubleshooting in Manufacturing
Zilong Liu
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Comprehensive Strategy for Efficient Suppression of Copper Arc Defects in Wet Stripping and Cleaning Processes
Haibo Hu, ACM Microelectronics
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Advances in CMP Materials and Processes: A Data and Model Driven Approach
Yiran Liu, Shanghai Institute of IC Materials
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Critical Control of Hybrid Bonding Interface Quality: Surface Defect Evolution and Precision Cleaning Technology Post
Hong Yan, Hangzhou SemCleanLink Technology Co., Ltd
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From Photons to Heat: CMP Bridging the "Last Nanometer" of CPO-used Substrates and High-Thermal-Conductivity Heat-Dissipation Templates
Pinhui Hsieh, JINAN OPTOELECTRONICS CO., LTD.
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TBD
Leo Lin, KINIK Company
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Macro/Micro, Square/Circular: New Challenges of Chemical Mechanical Polishing
Lei Guo, Hwatsing Technology Co., Ltd
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A Noval Combined CMP‑Wet Planarization Process for EMC/DAF/Cu Composite Interfaces for 2.5D Bridge Chip
Xingchen Mu, JCET Group Co., Ltd.
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TBD
Jie Cheng, China University of Mining and Technology-Beijing
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Ceria-Mediated Photochemical Oxidation for Chemical Mechanical Polishing
Yuhang Qi, Hebei University of Technology
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Yu Huang, HUAWEI
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Challenges and Perspectives in Future LSI Logic Test Generation
Xiaoqing Wen, Kyushu Institute of Technology
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Building Trust in Hardware: From Security Threats to PUFs and TRNGs
Jiliang Zhang, Nanjing University of Posts and Telecommunications
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Gang Qu, University of Maryland, USA
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Jing Ye, CASTEST Co., Ltd.
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Cheng Liu, North China Electric Power University
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In-situ Electron and X-ray Microscopy - Imaging Reliability-limiting Processes in Interconnect Stacks
Ehrenfried Zschech, EurASc and ACATECH
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Jiang Xia, JCET China
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Peng Zhao, Peking University
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Shen Liu
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Wenzhong Bao, Fudan University
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Non-Invasive Single-Molecule Trapping and Analysis in Subattoliter Silicon Nanocavities
Zhen Zhang, Uppsala University, Sweden
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Field-Effect Transistor based Low-Abundance Biomarker Detection
Qitao Hu, Uppsala University, Sweden
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AI Drived Advanced IC Equipment and Fab Line Evolution
Chen Wang, Tsinghua University
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Deep-Level Defects and Defect-Enabled Property Engineering in Low-Dimensional Semiconductors
Penghong Ci, Institute of Semiconductors, CAS
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2D materials devices
Yee Sin Ang, Singapore University of Technology and Design (SUTD)
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Near Zero-Power MOEMS Sensors Enabled by a Phase Transition
Kaicheng Dong, Tsinghua University
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Nan Qi, IOSCAS
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Ming Hu, BOE
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Zhiqiang Xiao, BEMC
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Shichang Li, Shengjisheng Semiconductor Technology
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Yuyan Wang, Tsinghua University
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Peng Wu, Peking University
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Zhaoqiang Bai, Beijing Superstring Academy of Memory Technology
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Qingyang Du, Zhijiang Lab
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Advanced Semiconductor Bonding and Integration: Technologies and Applications
Chao Guo, ISABERS GROUP
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Improved Morphology Uniformity of High-Refractive-Index Slanted Gratings via One-Step LEUVEN Instruments RIBS Etching for Mass Production of AR Waveguides
Si Chen, Leuven Instruments
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Challenges of Silicon Photonics and Electronic-Photonic Integration Technology
Jin Guo, Chongqing United Microelectronics Center(CUMEC)
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Novel Metal and Dielectric Film Deposition Technologies for Advanced 3D Devices
Xun Gu, AMEC
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Spin Qubits based on Semiconductor Quantum Dot
Hai-Ou Li, University of Science and Technology of China
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Yujie Wang, Institute of Computing Technology, Chinese Academy of Sciences
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Yuanqing Cheng, Beihang University
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An Zou, Shanghai Jiao Tong University
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Zhe Jiang, Southeast University
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Shuyao Cheng, Chinese Academy of Sciences
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Agentic EDA: From Design Assistance to Autonomous Design
Cheng Zhuo, Zhejiang University
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Agentic DTCO/STCO in VirtualFab for Path-Finding and Design Space Exploration
Chen Shen, Shanghai Peifeng Tunan Semiconductor Co., Ltd.
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Machine Learning Applications in Semiconductor TCAD Simulation
Zhenhua Wu, Zhejiang University
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DTCO for High Performance CPUs at 3nm node using Monolithic 3D and Backside Interconnect Technologies
Rongmei Chen, Peking University
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Multi-Agent-Driven High-Speed Memory Design and Verification: From Specifications to Layout, SI/PI Analysis, and ECO
Jimin Wen, Xpeedic Co., Ltd.
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