Keynote & Invited Speakers(2022)
           
TBD
Dr. Martin van den Brink, President and Chief Technology Officer, ASML
 
TBD
Dr. Gerald Yin, Chairman and CEO, AMEC
 
           
TBD
Dr. Donghui Lu, Vice President, Co-General Manager, HVM Program Office, Intel Corpotation
 
TBD
Dr. Marvin Liao, Vice President, APTS, TSMC
 
           
Partial List of Confirmed Distinguished CSTIC 2022 Invited Speakers
           
Going where silicon cannot reach: Print-in-place and recyclable electronics from nanomaterials
Aaron Franklin, Duke University
    TBD
Dmitri Strukov, University of California, Santa Barbara
 
           
Nonvolatile-memory Based Compute-in-memory Technology for Energy Efficient DNN Accelerator
Wonbo Shim, Seoul National University of Science and Technology
    Study about self-heating effects in gate-all-around nanowire transistors
Sangwan Kim, Ajou University
 
           
Novel Thermal Material Properties for Post-CMOS Neuromorphic Computing
Suhas Kumar, Sandia National Lab
 
Low Frequency Noise of Advanced Memory and Logic Devices
Eddy Simoen, Imec, Belgium
 
           
Enabling 3D Monolithic Integration using Oxide-Semiconductor-based Transistors
Xiao Gong, National University of Singapore
 
The Road to Compatible with and Beyond Silicon Circuits for 2D Materials
Peng Zhou, Fudan University
 
           
Process Window Optimization of DRAM by Virtual Fabrication
Joseph Ervin, Coventor, a Lam Research company
 
System-technology co-optimization for 3D monolithic memory-centric computing
Bin Gao, Tsinghua University
 
           
High performance ferroelectric field effect transistor for embedded nonvolatile memory
Kechao Tang, Peking University
     
           
Update of >300W High Power LPP-EUV Source Challenge IV for Semiconductor HVM
Hakaru Mizoguchi, Gigaphoton
 
Patterning capability of surface plasmon imaging
Lihong Liu, Institute of Microelectronics, Chinese Academy of Sciences
   
           
EPE and CD performance enhancement by "GT66A", the next-generation immersion ArF lightsource
Takamitsu Komaki, Gigaphoton
    Thickness Dependence of Properties of EUV Underlayer Thin Films
Jae-Hwan Sim, DuPont Electronics and Industrial
 
           
Suppressing Stochastic Interaction to Improve EUV Lithography
Zhimin Zhu, Brewer Science, Inc.
 
Recent Aadvances in Extreme Ultravoliet Photoresists
Guoqiang Yang, Institute of Chemistry, Chinese Academy of Sciences
 
           
  Considerations in seting up industry standards for photolithography process, historical perspectives, methologies, and outlook
Qiang Wu, Fudan University
    Process window, stochastic defectivity, and process optimization in EUV lithography for advanced logic technologies nodes
Yanli Li, Fudan University
 
           
Nanoimprint Lithography Methods for Achieving sub-3nm Overlay
Keita Sakai, Canon Inc.
    Gan-based fast mask near-field calculation
Yijiang Shen, Guangdong University of Technology
 
           
Critical dimension metrology: from OCD to XCD
Xiuguo Chen, Huazhong University of Science and Technology
    A new generation cost-efficient laser mask writer, addressable up to the 90nm node
Youngjin Park, Mycronic Co., Ltd.
 
           
  Model-driven Deep Learning for Computational Lithography
Xu Ma, Beijing Institute of Technology
    Lithography simulation and its applications
Sikun Li, Shanghai Institute of Optics and Fine Mechanics
 
           
  Co-Optimization of Photoresist Development and Photolithography Process
Liwan Yue, Ningbo Nata Opto-electronic Materials Co. Ltd
 
Role of underlayers in novel patterning for EUV lithography
Douglas Guerrero, Brewer Science, Inc.
 
           
Inverse lithography technology: 30 years from concept to practical, full-chip reality
Leo Pang, D2S, Inc.
       
           
3D NAND Technology Cost Scaling Challenge and System Solutions
Richard Yang, Intel Corporation
 
The fast changing and advancing scaling technique and potential device infrastructure
David Xiao, Imec, Belgium
           
  TBD
Hua Chung, Mattson
    High aspect ratio etch challenges and proposed ICP etch solutions
Zhiqiang Liu, AMEC
 
           
Innovative Future Technology for High Aspect Ratio Contact Etch
Yoshihide Kihara, TEL, Japan
    TBD
Angelique Raley, TEL
 
           
  TBD
Qiushi Xie, Naura
    5nm fin SAQP patterning challenges and perspective solutions
Qingjun Zhou, Naura
 
           
TBD
Kaidong Xu, Leuven Instruments
       
           
  ALD applications in advanced nodes
Weiming Li, Jiangsu Leadmicro Nano-Equipment Technology Ltd.
 
Process Window Optimization of DRAM by Virtual Fabrication
Ervin Joseph, Coventor, a Lam Research company
 
           
  Advanced Transisitor Structure Exploration by DTCO method
Shaofeng Yu, Fudan University
 
Dielectric CVD to address Challenges for Logic, Memory and Packaging Integration
Terrance Lee, Applied Materials
 
           
Copper Metallization of Future Interconnects
Brogan Lee, Lam Research
 
Keys to Extending Cu Interconnect to 2nm and Shift to Alternative Conductor
Takeshi Nogami, IBM Research
 
           
  Contact resistance scaling
Nicolas Breil, Applied Materials
    Cutting-edge epitaxial processes for advanced technology nodes: application to nanosheet stacks and epitaxial wrap-around contacts
Andriy Hikavyy, Imec, Belgium
 
           
  Proliferation of ALD technology in the nano device era
Jerry Chen, ASM
    2D material and applications
Zhihong Chen, Purdue University
 
           
  A New Summit Heating Kinetic Model for Copper and Tungsten CMP
Ara Philipossian, Araca Inc.
 
Development of CMP Head-to-Head Compensation Function for Gate Height Uniformity Control
Yurong Que, Shanghai Huali Integrated Circuit Corporation
 
           
  Development of Post CMP Cleaning Chemistry
Cass Shang, GrandiT Co. Ltd
    Chemical Mechanical Planarization of Silicon Dioxide Film in Colloidal Silica based Alkaline Slurry
Chenwei Wang, Hebei University of Technology
 
           
  Recent Advances in Statistical Modelling Methodology Development for ReRAM Applications
Ernest Wu, IBM Research
    Faster Fault Isolation with Advanced Data Analysis and Computer Vision
Franco Stellari, IBM Research
 
           
Review of micro- and nanoprobe metrology for direct electrical measurements on-product wafers
Benny Guralnik, KLA
 
Advanced metrology techniques for MRAM production monitoring
Alberto Cagliani, KLA
 
           
OVL metrology trends in advanced nodes
Efi Megged, KLA
 
Advanced Applications of Picosecond Ultrasonic Technology in Semiconductor Manufacturing
Cheolkyu Kim, Onto Innovation
 
           
Improving process control and efficiency through machine learning enhanced optical metrology
Michael Shifrn, Nova Measuring Instruments
       
           
  Bio-inspired in-sensor vision adaptation for accurate perception
Yang CHAI, The Hong Kong Polytechnic University
 
Integrating 2D materials in silicon chips
Mario Lanza, King Abdullah University of Science and Technology (KAUST)
 
           
Emerging Layered Semiconductor Synthesis and Applicatoins on Next Generation Electronics and Optoelectronics
Chen WANG, Tsinghua University
    ICL heterogeneous system integration solution
Odd Hung, ICLeague
 
           
  Innovations of Industry IGBT technologies and products
Jianhua Liu, GTA Semiconductor
    Resonant piezoelectric MEMS sensors
Tianxiang Nan, Tsinghua University
 
           
Simple MEMS technique for wide clinical applications
Wei Wang, Peking University
    Sensors integrated with bio materials
Tie Li, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
 
           
  TBD
Ken-ya Hashimoto, University of Electronic Science and Technology of China
    TBD
Ting Hu, Shanghai University
 
           
  TBD
Hongbin Yu, Huazhong University of Science and Technolog
       
           
TBD
David Pan, University of Texas at Austin(UT Austin)
    TBD
Fan Yang, Fudan University
 
           
TBD
Wenjian Yu, Tsinghua University
 
Hybrid Memristor/CMOS neuromorphic circuits
Peng Lin, Zhejiang University
 
           
  TBD
Jianli Chen, Fudan University
    TBD
Yun Liang, Peking University
 
           
  TBD
Cong Hao, Georgia Institute of Technology
    TBD
Jingtong Hu, University of Pittsburgh
 
           
Design-for-Recovery Techniques for Combating Chip Aging Issues
Xinfei Guo, University of Michigan - Shanghai Jiao Tong University Joint Institute
 
Polynomial Formal Verification of General Tree-like Circuits
Rolf Drechsler, University of Bremen, Germany
 
           
TBD
Li Jiang, Shanghai Jiaotong University
    TBD
Dawei Wu, YEESTOR Microelectronics Co., Ltd
 
           
Research on key technologies of ultra-high speed data transmission in Big Data Era
Zhi-Qiang Guan, Suzhou Chiptel Microelectronics Co., Ltd
    TBD
Peixin He, Shanghai UniVista Industrial Software Group
 
           
A Survey of Domain Specific Architecture Innovations in AI Chip Industry
Yifan YangGong, CLTech
 
Dynamic stochastic computing and its applications
Siting Liu, Shanghai Tech University