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Prof. Heng Wu
Associate Professor, |
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Heng Wu is an Associate Professor in the School of Integrated Circuits at Peking University. He received the Ph.D. degree in Electrical and Computer Engineering from Purdue University. After graduation, he joined IBM T. J. Watson Research Center in Albany N.Y. USA as a research staff member. After that, He joined Peking University in early 2023. His research focuses mainly on high speed and low power CMOS devices and circuits, transistors architecture and design technology co-optimization (DTCO). Prof. Wu has published more than 100 papers and received 5 best paper awards (including VLSI symposium). He has filed more than 600 patents (with 300 patents granted). He is an IBM Master Inventor and recipient of IEEE Paul Rappaport Award. He has served on the technical committees of major conferences such as: IEEE EDTM, IEEE ISQED, IEEE ICSICT and SSDM. He is a member of IEEE Semiconductor Manufacturing Committee. |
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