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Chinese
2020年6月27-29日
上海新国际博览中心

Symposium VII: Packaging and Assembly


(** to designate keynote talk, * to designate invite talk)    

Sunday, March 15, 2020 Shanghai International Convention Center
Meeting Room: 5B+5C

Session I:
Session Chair: Huili Fu

*13:30–13:55 Developments in Packaging Technologies for Al Systems and Applications
  Yifan Guo, ASE
*13:55-14:20 3D Heterogeneous Advanced Packaging and Manufacturing
  Drink Wang, TSMC
14:20–14:35 Challenges and Opportunities in the Heterogeneous Integration

Fan Chun Ho, Nelson, ASM Pacific Technology Ltd
14:35–14:50 DESIGN AND DEVELOPMENT OF 3D WLCSP FOR CMOS IMAGE SENSOR USING VERTICAL VIA TECHNOLOGY

Tianshen Zhou, HuaTian Technology (Kunshan) Electronics Co., Ltd.
14:50–15:05 Soldering Material Evolution for Heterogeneous Integration Assembly
  Lim Sze Pei, Indium Corporation
15:05–15:20 Coffee Break



Session II:
Session Chair: Shin-Puu Jeng

*15:20–15:45 Commercialization of through glass via (TGV) technology for 3D packaging
  Daquan Yu, Xiamen University
*15:45–16:10 Control of graphene structure to achieve thermal conductivity for electronics packaging and cooling applications

Johan Liu, Shanghai University and Chalmers University of Technology
16:10–16:25 Laser Based Full Cut Dicing Evaluation for Thin Si wafers

Kees-Jan Leliveld, ASM Pacific Technology
16:25–16:40 A Single-Layer Solution with Laser Debonding Technology for Temporary Bond/Debonding Applications in Wafer-Level Packaging

Xiao Liu, Brewer Science
16:40–16:55 Etching Type Polymer Technology for Large Number of Small Via

Ica Han, Simmtech



Monday, March 16, 2020 Shanghai International Convention Center
Meeting Room: 5B+5C

Session III:
Session Chair: Daquan Yu

*08:30–08:55 High Temperature Packaging of IGBT and Modules
  Zhu Wenhui, Central South University
08:55–09:10 Hybrid Sintering Paste Formulation Workaround on ENIG Surface
  Kevin Tan, Henkel
09:10–09:25 Improvement of heat dissipation in IPM packaging structure
  Wenjie Xia, Huangshan University
09:25–09:40 Silver sintering for high reliability power electronics
  Ding Jia Pei, ASM Pacific Technology Co., Ltd.
09:40–10:00 Coffee Break
   


Joint Session: Symposium VII and Symposium VIII-3D Heterogeneous Integration
Session Chair: Qinghuang Lin

**10:00–10:30 Diversity, Interconnect and Phase change: Semiconductor heterogenous integration and supper intelligence in the post Moore's Law era
  Hu Chuan, Guangdong Academy of Sciences
**10:30–11:00 3D Heterogeneous Integration
  Bill Bottoms, 3MTS
**11:00–11:30 Recent Achievements and New Technologies for High Performance Mems Sensors and Actuators
  Philippe Robert, CEA-LET
**11:30–12:00 3D Packaging Development for HPC and 5G Applications
  Dr. Chiang Shiuh-Kao, Prismark
12:00–13:30 Lunch Break
   


Session V:
Session Chair: Xing Wu

*13:30–13:55 Packaging Impacts on Cell Reliabilityes in 3D NAND Flash Memories
  Chen Jiezhi, Shandong University
13:55–14:10 Low Cost Manufacturing for Through Glass Via and Wafer Level Packaging Technology
  Feng Jiang, Xiamen Sky Semiconductor Technology Co., Ltd.
14:10–14:25 Finite element analysis of high power press-pack insulated gate bipolar transistors packaging model
  Wang Zhao, CRRC Yongji Electric Co., Ltd.
14:25–14:40 Thermal properties of multi-scale nanosilver paste with SiC particles
  Ziwei Jiang, Shanghai University
14:40–15:00 Coffee Break
   


Session VI:
Session Chair: Wenhui Zhu

*15:00-15:25 Development and Commercialization of 5G NanoComposites
  Huang Mark
15:25-15:40 Investigation of bond pad crystal defect for different cover transmission rate
  Chengyang Sun, HLMC
15:40-15:55 Effect of Bonded Ball Shape on Gold Wire Bonding Quality based on ANSYS/LS-DYNA Simulation
  Weidong Huang, Wei Wu, Jacky Wu, Grass Dong, CF Oo, Diodes Shanghai Co., LTD.
15:55-16:10 Reliability simulation and life prediction of Sn63Pb37 BGA solder joint under thermal cycling load
  Liu Jiahao, School of Advanced Materials and Nanotechnology, Xidian University
16:10-16:25 Effects of Intermetallic Compounds on Reliability of CuNiSn Microbumps
  Yitong Xie, Shanghai Jiao Tong University
16:25-16:40 Yield Improvement and Cost of Test Reduction via Automated Socket Cleaning
  Jerry Broz, International Test Solutions
   
Poster Session: Location: 5th Floor
Coffee Break A New CIS Packaging Process and Structure to Improve Die Chipping
  Yuan Hu, SMIC
  Experimental and Simulation Study of Thermal Conductivity of 3D Graphene Network Filled Polymer Composites
  Yong Zhang, Shanghai University
  A Novel Die Sorter Based on Micro Tweezer for Terahertz Schottky Barrier Diodes
  Li He, Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP)
  A Novel dispensing head fabrication method for precise epoxy dispensing
  Zhang Jie, Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP)
  volume resistance of epoxy molding compound
  Hongjie Liu, Jiangsu HHCK Advance Materials Co., Ltd.
  A PROMISING EMBEDDED SILICON FAN-OUT WAFER LEVEL PACKAGE WITH LASER RELEASABLE TEMPORARY BONDING TECHNOLOGY
  Chengqian Wang, The 58th Research Institute of China Electronics Technology Group Corporation
  Warpage control method in epoxy molding compound
  Wei Tan, Jiangsu HHCK Advance Materials Co., Ltd.