Symposium Chair: Dr. Steve X. Liang

** to designate keynote talk - 30 min      
* to designate invite talk - 25 min
  to designate regular talk - 20 min

Sunday, March 17, 2024 Shanghai International Convention Center
Meeting Room: 5B+5C

Session I: 3D and Advanced Packaging Technologies
Session Chair: Steve X. Liang
13:30-13:35 Opening Remarks
*13:35-14:00 Chiplets and Advanced Packaging for Future Computing
  Terry Wu, Samsung Electronics
14:00-14:20 Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect
  Yasuhiro Morikawa, ULVAC, Inc.
14:20-14:40 Comprehensive Investigation of Insufficient IMC in SOIC Through Advanced Statistical Analysis
  Jingwei Sun, NXP Semiconductors
**14:40-15:10 Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH)
  Eason Wang, ICLeague
15:10-15:30 Coffee Break

Session II: Novel Packaging Materials and Process
Session Chair:
15:30-15:50 Hybrid Wafer-to-Wafer and Die-to-Wafer Technology for Heterogenous Integration Applications
  Viorel Dragoi, EV Group


Glass As An Enabling Material for Advanced Packaging
  Jay Zhang, Corning Incorporated

Monday, March 18, 2024 Shanghai International Convention Center
Meeting Room: 5B+5C

Session III: Inspection, Test and Reliability
Session Chair: X. Wu
*09:00-09:25 Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations
  Jialin Zheng, Sanechips Technology Co., Ltd.
09:25-09:45 A Modularized Thermal Test Chip Design and Verification
  Jianjun Sun, Sanechips Technology Co., Ltd.
09:45-10:05 Evaluating 224G SI Performance of Vertical Interconnections on Package Substrate and PCB
  Kai Yuan, Sanechips Technology Co., Ltd.
10:05-10:20 Coffee Break

Session IV
Session Chair: M. Huang
10:20-10:40 Heat Transfer Improvement of Phase Change Material with Metal Foam
  Yan Zhang, Shanghai University
*10:40-11:05 Study of Defects in Advanced Packing at the Atomistic Scale by Using In Situ TEM
  Xing Wu, East China Normal University
*11:05-11:30 The Solution and Challenge of Glass Core Substrate Technology
  Tingyu Lin, Guangdong FoZhiXin (FZX) Microelectronics Technology Research Co., Ltd.
*11:30-11:55 Breaking Memory Wall with SeDRAM® Technology in Chip Level
  Fengguo Zuo, Xi'an UniIC Semiconductors Co., Ltd.
Poster Session:
  Thermal and Thermal Stress Simulation Analysis of Embedded Microchannel Cooling on Large-Size Packaging
  Fusheng Meng, Sanechips Technology Co., Ltd.
  Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package
  Yubo Wang, Sanechips Technology Co., Ltd.