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Chinese
2020年6月27-29日
上海新国际博览中心

Symposium VI: Metrology, Reliability and Testing


(** to designate keynote talk, * to designate invite talk)

Sunday, March 15, 2020 Shanghai International Convention Center
Meeting Room: 3B

Session I: Test I
Session Chair: Yu Zhu


13:30–13:35 Chairman Remarks
  Peilin Song
*13:35–14:00 Is Hardware the Next Dimension in Cybersecurity?
  Prof. Ramesh Karri, New York University, USA
14:00–14:15 Multi-granularity Reconfiguration Based Physical Unclonable Function Design
  Jianan Mu, Chinese Academy of Sciences, University of Chinese Academy of Sciences, Beijing, China
14:15–14:30 Low-Cost Solution for Ultra-Highspeed SerDes to RF Communication Test via on Board FPGA
  Tang Mingjie, Advantest (China) Co., Ltd.
14:30–14:45 A ProgrammingFframework of Concurrent Test on SMT7 for IPs which Share Same Access Port
  Tianyu Zhang, Advantest (China) Co., Ltd.
14:45–15:30 Coffee Break


Session II: Test II
Session Chair: Kelvin Xia


*15:30–15:55 Yield Learning in 5nm Semiconductor Technologies: Test Chip Design
  Prof. Shawn Blanton, Carnegie Mellon University, USA
15:55–16:10 Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuits

Shang-Chih Lin, Gallant Precision Machining(GPM), Taiwan, China
16:10–16:25 Unifying Yield Enhancement and Manufacturing Intelligence with Smart Sampling

Zhang Yan Qiu, Fujian Jinhua Integrated Circuit Co., Ltd.
16:25–16:40 An Adaptive De-noise System for Sub-nm Scale Failure Analysis Based on TEM Image

Xu Chang, Fujian Jinhua Integrated Circuit Co., Ltd.



Monday, March 16, 2020 Shanghai International Convention Center
Meeting Room: 3B

Session III: Metrology I
Session Chair: Ye Feng


**08:30–09:00 Machine and Deep Learning for Metrology of Process Control
  Dr. Shay Wolfling, Nova Measuring Instrument, USA
09:00–09:15 Wave Front Phase Imaging For Global Silicon Wafer Geometry
  Jan Gaudestad, Wooptix, Spain
09:15–09:30 Optical Scatterometry Modeling of 5 nm Logic Metal Gate Structures
  Qi Wang, Shanghai IC R&D Center
09:30–10:30 Coffee Break
   

Session IV: Metrology II
Session Chair: Yiping Xu


*10:30–10:55 E-Beam Inspection Challenge for New Technology Node and New Opportunity
  Dr. Wei Fang, ASML, USA
10:55–11:10 Full Metrology Solutions for Advanced RF by Picosecond Ultrasonic Metrology
  Johnny Dai, Onto Innovation, USA
11:10–11:25 Monitoring Critical Process Steps in 3D NAND using Picosecond Ultrasonic Metrology with both Thickness and Sound Velocity Capability
  Hui LI, Yangtze Memory Technologies Co.
11:25–11:40 Quality Control in Sapphire Growing: From Automated Defect Detection to Big Data Approach
  Ivan Orlov, Scientific Visual SA, Switzerland
11:40–13:30 Lunch Break
   

Session V: Reliability I
Session Chair: Peilin Song


*13:30–13:55 Towards Understanding Interaction Between Hot Carrier Aging and PBTI
  Prof. Jian Fu Zhang, Liverpool John Moores University, UK
13:55–14:10 Comprehensive Comparison of the Wire Bond Reliability Performance of Cu, PdCu and Ag Wires
  Lois Liao Jinzhi, WinTech Nano-Technology Services Pte. Ltd, Singapore
14:10–14:25 Practical Carrier Lifetime Analysis in In.53Ga.47As Hetero-epitaxial Layers
  Eddy Simoen, IMEC, Belgium
14:25–14:40 A Study of Low Temperature Al Sputter Process Electromigration Lifetime
  Jun Liu, Shanghai Huahong Grace Semiconductor Manufacturing Corporation
14:40–15:30 Coffee Break
   

Session VI: Reliability II
Session Chair: Jian Fu Zhang


*15:30-15:55 Transition Induced Internal CDM-ESD liked Damage inside the IC
  Dr. Tung-Yang Chen, AIP Technology Corporation, Taiwan, China
15:55-16:10 Reliability Improvement by 0.153um CMOS Using HDP-CVD at STI Edge SiN Liner
  WeiYang Zhang, Technology Development, Central Semiconductor Manufacturing Corporation (CSMC)
16:10-16:25 Non Linear Growth of Variance in the Process Gap
  George W Horn, Middlesex Industries SA, Switzerland
16:25-16:40 Research on WBP Product Stress to Improve Product Vr Yield
  Yang Chen, ZTE
16:40-16:55 A Novel Vertical Closed-loop Control Method for High-generation TFT Lithography Machine
  Dan Chen, Shanghai Micro Electronics Equipment (Group) CO., LTD.


Poster Session: Location: 5th Floor
  Probe Card Lifetime Control and Abrasion Coefficient Study
  Lei Wang, HHGrace
  Metal Trench Critical Dimension and Overlay Minor Variation Monitoring Method with Voltage Contrast Inspection
  Lijing Huang, HLMC
  The Inspection Solutions and Reduction of Extreme Tiny Poly Residue
  Jianye Song, HLMC
  An Application of Adaptive Genetic Algorithm Combining Monte Carlo Method
  Wei Yu, HLMC
  Investigation and reduction of Systematic defects by wafer backside process in nanometer semiconductor manufacturing
  Jiangang Zhou, HLMC
  Study of high-precision interferometer dynamic switching for TFT long-travel-range moving stage
  Dan Chen, Shanghai Micro Electronics Equipment (Group) CO., LTD.
  Fault Detection of sensor data in semiconductor processing with variational autoencoder neural network
  Wang Yong, Shanghai Huali Microelectronics Corporation
  New Precision Jitter Measurement Solution on TMU
  Kai Zhou, Advantest
  Investigation and discovery of the integration of FEOL process by electron beam inspections
  Fengjia Pan, Shanghai Huali Microelectronics Corporation
  One Comprehensive Method to Analyze Semiconductor Manufacturing Data by "Piecewise" Regression
  Lin Gu, Shanghai Huali Microelectronics Corporation
  The inspection solutions of 3bar structure Cu void in BEOL advanced semiconductor process
  Zhangxingdi, Shanghai Huali Microelectronics Corporation
  The inspection and solution of inline CT defect for 28nm process improvement
  Min Wang, Shanghai Huali Microelectronics Corporation
  The Study and Investigation of Inline E-beam Inspection for 28nm Process Window Monitor
  Yin Long, Shanghai Huali Integrated Circuit Corporation
  A Unified 4H-SiC MOSFETs TDDB Lifetime Model Based on Leakage Current Mechanism
  Hua Chen, Xidian University
  Study on wafer edge test with optimized test solution
  Yuxiang Zhang, Shanghai Huahong Grace Semiconductor Manufacturing Corporation