SEMICON China - Symposium III: Dry & Wet Etch and Cleaning

Symposium Chair: Dr. Kaidong Xu, Leuven Instruments, China

**	to designate keynote talk - 30 min
*	to designate invite talk - 25 min
	to designate regular talk - 15 min

Sunday, March 22, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Pudong Ballroom 1

Session I: Joint Session Symp II & III
Session Chair: Leo Pang & Kaidong Xu

13:30-13:40	Openning Remarks

**13:40-14:10	Production-Ready Full-Chip Entirely Curvilinear ILT and Curvilinear Masks for DUV
	Leo Pang, D2S, Inc.
**14:10-14:40	Ion Beam Technology for Advanced Patterning of Logic and Memory Devices
	Cheng Li, Leuven Instruments
**14:40-15:10	The Challenge of Advanced Patterning in 3D-DRAM Technology
	Zhonghua Jin, SAMT
15:10-15:25	Break Time

Session II: Advanced Patterning - Part 1
Session Chair: Kaidong Xu

*15:25-15:50	Etch Solutions for Advanced Specialty
	Jim Zhang, Lam Research
*15:50-16:15	Sym3?Y for Superior Plasma Uniformity Control
	Sichao Zeng, Applied Materials China
16:15-16:30	Coffee Break
16:30-18:00	Panel Discussion (Meeting Room: Pudong Ballroom 1)

Monday, March 23, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Pudong Ballroom 1

Session III: Advanced Patterning - Part 2
Session Chair: Zuixin Zeng

**08:30-09:00	IBS Enhanced DRAM Technology: The New Patterning Revolution Brought About by New Tools
	Juhani Xiang, CXMT
*09:00-09:25	ICP Etch For Advanced Technology Node
	Tao Zhong, Beijing NAURA Technology Group
09:25-09:40	Comprehensive Etching Solution for Patterning Layer Profile Control and Titanium Residue Removal in Advanced Logic Trench Processes
	Chia Lin, Lu Applied Materials
09:40-09:55	An Automated Framework for Tem Image Analysis and Etching Performance Evaluation
	Huihui Wang, Beijing NAURA Technology Group
09:55-10:10	Coffee Break

Session IV: Memory Applications
Session Chair: Ke Jiang

**10:10-10:40	Tungsten-Doped Carbon Hard Mask Etch Profile Control for High-Selectivity Channel Hole Etching
	Nikky Shan, YMTC
*10:40-11:05	Synergy of Ion and Highly Reactive Species in Cryogenic Plasma Etching
	Yingxin Guan, Advanced Micro-Fabrication Equipment Inc.
11:05-11:20	Application of Advanced Pulsing and Novel Chemistry in High Aspect Ratio Etching Process
	Haoran Cao, Lam Research
11:20-11:35	The Investigation of Cryogenic High-Aspect-Ratio Trench Etch by Loop Function
	Bin Liu, Advanced Micro-Fabrication Equipment Inc.
11:35-11:50	Silicon Recess Etch Technology for Storage Contact in Memory Cell Manufacturing
	Pei Mei, Beijing NAURA Technology Group
11:50-13:30	Lunch Break

Session V: FEOL/MOL Etching
Session Chair: Zhijie Hao

*13:30-14:00	Plasma Etch and Defect Reduction
	Pengkai Xu, HLMC
14:00-14:15	SOC Precise Etch-Back Process for Future CFET Device Applications
	Xin Liu, Institute of Microelectronics of the Chinese Academy of Sciences
14:15-14:30	Optimizing Plasma Ignition in Inductively Coupled Plasma Reactors for Electronegative Chemistries at Low Pressure
	Jingsi Cui, Jiangsu Leuven Instruments Co. Ltd
14:30-14:45	Investigation the Effect of Chamber Wall Pre-Coating and Substrate on the HK-MG Dummy Polysilicon Removing Process
	Fanglin Huo, Advanced Micro-Fabrication Equipment Inc. China
14:45-15:00	Break Time

Session VI: BEOL Etching
Session Chair: Zheng Tao

*15:00-15:25	RF Pulsing Technology for BEOL Etch Process
	Bo Wang, TEL
*15:25-15:50	Chamber-Matching Diagnosis Using In-Situ Deposition and OES Endpoint Metrology
	Xiaowei Li, Leuven Instruments
15:50-16:05	A comprehensive Study on LWR Improvement in Metal Hard Mask Etching
	Yun Xiao, Lam Research
16:05-16:20	Optimization of Dielectric Etch in Ultra Deep Via
	Ya Zhou, Advanced Micro-Fabrication Equipment Inc. China
16:20-16:35	Improve Al Etch Productivity Performance by Equipment Intelligence® Data Analysis (EI-DA)
	Chenchen Zhao, Lam Research
16:35-18:00	Coffee Break
16:00-18:00	Poster Session

Tuesday, March 24, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Function Room 3

Session VII: Wet Etch and Compound Etching
Session Chair: Zhongwei Jiang

*08:30-08:55	Wet Clean Optimization to Control the Cu Loss in BEOL AIO Process
	DongMei Zhai, STIC
08:55-09:10	Outgassing Evaluation of Cleaning Techniques Applied to Different Semiconductor Parts
	Ling Wang, Ferrotec Technology Development (Guangzhou) Co. Ltd
09:10-09:25	Atomic Layer Etching of (Al)GaN: Investigation and Characterization of Etching Damage
	Qiang Wang, State Grid Shanxi Electric Power Company Electric Power Research Institute
09:25-09:40	Deep SiC ICP Etching for Superjunctions
	Xiaoyu Tan, Beijing NAURA Technology Group
09:40-09:55	Ptimizing Scrubber Clean for TIN Residue after MHM TIN Deposition and ETCH in advance BEOL Technology
	Xinlong Zhao, SiEn (Qingdao) Semiconductor corporation Co. Ltd.
09:55-10:10	Coffee Break

Session VIII: Logic Applications
Session Chair: Zhongwei Jiang

*10:10-10:35	Study of Different Selective Etching Methods in Process of Gate-all-around FET
	Junjie Li, IMECAS
*10:35-11:00	TBD
	Andre Grede, COMET
11:00-11:15	Tunable High-K Profile Control in 28nm Metal Gate Etching
	Junming Wang, Lam Research
11:15-11:30	Development of Single Diffusion Break Fin Cut Etch Process for Logic FinFET Application
	Litian Xu, Beijing NAURA Technology Group

16:00-18:00	Poster Session: Monday, March 23 (3F, Kerry Hotel Pudong, Shanghai)
	Process Optimization for the Prevention of Cu Void Defects In Damascus AIO Etching
	Xiaoyu Wang, Nexchip Semiconductor Corporation
	A Process Method for Improving Corrosion, Void and PR Residue Defects in Tm30k Structure
	Jiange Feng, Nexchip Semiconductor Corporation, Hefei, China
	Enhancements of High Throughput TSV Etching Repeatability in Mass Production
	Zheng Ruan, Lam Research
	Innovative Solution for Ta Pillar Metal Hard-mask Open in MRAM Technology
	Lin Shao, Lam Research
	High Open Ration BT Pad Residue Defect Impove
	Xu Chu, Nexchip Semiconductor Corporation, Hefei, China
	A Method to Minimize Total Thickness Variation with Dripping Reduction System Implementation
	Zhi Shen, Lam Research
	Metal Etch Particle Experiments and Improvements Reduce Defects and Scrap
	Renbao Kuai, Nexchip Semiconductor Corporation, Hefei, China
	Analysis of Gate Oxide Defect Formation Causes and Improvement Methods in Poly Gate Etching
	Cheng Fang, Nexchip Semiconductor Corporation, Hefei, China
	An Improved ICP Method in CMOS Image Sensors
	Jianfei Hu, Nexchip Semiconductor Corporation, Hefei, China
	Impact of Bias Power on Oxygen Radical Availability: Balancing In-Situ Resist Strip and Chamber Cleaning Efficiency Based on Radical Partitioning
	Xingnan Liu, Jiangsu Leuven Instruments Co. Ltd
	A Study of the Slot Effect in Dry Etch
	Chenxi Jiang, SiEn (QingDao) Integrated Circuits Co. Ltd.
	The Bulge Defect Formation and Reduction of BEOL Top Metal ETCH Process
	Qing Mao, Shanghai Huali Microelectronics Corporation
	A Novel Passivation Approach to Mitigate Si Showerhead Damage and Residue Defects in Low-k Etching Processes
	Weiming Liu, Advanced Micro-Fabrication Equipment Inc.
	Study of the Titanium Nitride Damage During the Wet Etch Process in Logic Device
	Yaofeng Liu, GHS semiconductor
	Further Performance Testing of P-Type Transistor with Dual-Curvature Cavity
	Ying Zhou, SiEn (Qingdao) lintegrated Circuits Co, Ltd
	Wet Process Design for Improving Backside Poly Etching Uniformity
	Jing Liu, SiEn (Qingdao) Semiconductor corporation Co. Ltd.
	Wet Process Control for Minimizing Key Pattern Lithography Rework Effects on CD
	Yanping Guo, SiEn (Qingdao) Semiconductor corporation Co. Ltd.
	Improvement of Gate Oxide Quality by Optimizing Wet Pre-Clean Process
	Shuang Cui, SiEn (Qingdao) Integrated Circuits Co., Ltd.
	Relationship Study of Wet Clean Process with via Recess for EM Improve
	Weijie Kong, SiEn (Qingdao) Semiconductor corporation Co.Ltd.
	Process Optimization of Silicon Pillar Array Etching for Metalenses Applications
	Enze Zhao, ZhejiangUniversity
	Effects of Deionized Water Cleaning Process on Wave Propagation Dynamics and Interfacial Bond Strength in Wafer Bonding
	Huibin Wu, Semiconductor Manufacturing North China (Beijing) Corp
	Peeling Defect Suppression and Yield Enhancement in CIS Device Fabrication
	Ling Liu, Semiconductor Manufacturing North China (Beijing) Corp
	A Study of Gas Distribution Influence on TSV Process
	Changhuo Liu, Peking University
	Photoresist Trim Control for 3D NAND Staircase Etching
	Han Wang, Advanced Micro-Fabrication Equipment Inc.
	Impact Of Plasma Induced Charging Damage Electric Property And Exploration On Plasma System
	Yang Wei, Nexchip semiconductor corporation
	The Etching of IZO/HfO2/IGZO in an Ion Beam Etching System and an Inductively Coupled Plasma Reactor
	Jiahui Sun, Beijing Superstring Academy of Memory Technology
	Mechanism and Mitigation of Ti Residue Formation in BEOL MHM AIO
	Weiming Liu, Advanced Micro-Fabrication Equipment Inc.
	The Profile Control of High Aspect Ratio Amorphous Carbon through Polymer Gas Distribution Optimization
	Hongqiu Wang, Advanced Micro-Fabrication Equipment Inc. China
	Plasma Characterization of Multi-Level Pulsing System in Advanced Node Etching Processes
	Jiahui Liu, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
	A New Technology for 3D DRAM Deep Silicon Trench Etch
	Jingjing Luo, 中微半导体设备（上海）股份有限公司
	A Two-Step Dry Etching Process for Plating-Friendly, Large-Opening, Inverted-Trapezoid TSV
	Ruiting Zhang, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences
	High Aspect Ratio Deep Trench Isolation Etching for Advanced Memory Application
	Lei Lei, Advanced Micro-Fabrication Equipment Company Inc.
	Lam Spectral Reflectometer for Advanced Super-junction Deep Trench Etch Process Control and Yield Enhancement
	Shanshan(Sera) Nie, Lam research
	Organic Micro-lens Array Morphology Control by Plasma Etching
	Zhenqi Liu, Advanced Micro-Fabrication Equipment Inc. (AMEC)
	A Holistic Approach to Profile and Critical Dimension Control in High-Aspect-Ratio Silicon Nitride Pillar Etch
	Zhiping Shao, Advanced Micro-Fabrication Equipment Inc. (AMEC)
	Advanced DRAM Buried Wordline Trench Process Technology Development
	Yifei Luo, Advanced Micro-Fabrication Equipment Inc.
	Step Height Control of SiN Spacer in Contact Etch Progress
	Xue Li, Advanced Micro-Fabrication Equipment Inc. (AMEC)
	Effective Solution And Mechanism of Line Roughness Improvement In ICP Etch
	Leiting Jia, Advanced Micro-Fabrication Equipment Inc.
	A Study on TiN-Residue-Induced Partial Etch in Metal Hard Mask Etching Process
	Ting Yao, Zhejiang ICsprout Semiconductor Co., Ltd
	An Innovative ICP Solution for BEoL Passivation Etch
	Weipeng Jiang, Beijing E-town Semiconductor Technology Co.,Ltd.
	Semulator3D® Facilitates Fast and Precise STI Shoulder Profile Tunin
	Chenchen Zhao, Lam Research
	Dimple Defect Reduction in Wafer Thinning of Hybrid Bonding BSI Process
	Zhichao Niu, Lam Research
	Sym3™Y In-Situ ALD Solution for High Aspect Ratio Etch Profile Control
	Tianyuan Liu, Applied Materials China
	Bowing Profile Improvement Solution to HAR Carbon HMO on Sym3TM
	Xipeng Tong, Applied Materials China
	CD Uniformity Improvement by Thermal Pad Ring in Sym3®GT
	Ping Zheng, Applied Materials China
	Regulation of Line CD Imbalance in Reverse Self-Aligned Double Patterning
	Shun Yang, Beijing NAURA Technology Group
	BF₃-based Plasma Doping for Sidewall Boron Incorporation in CIS Deep Trench Isolation Structures
	Jie Wang, Beijing NAURA Technology Group
	Shrinkage of Pattern CD by using Inductively Coupled Plasma for Logic MOL Dielectric Layers Etch Application
	Junkai Yan, Beijing NAURA Technology Group
	Research on Control and Optimization Methods for Polymer Residue in Aluminum Etching Process
	Chao Ding, Beijing NAURA Technology Group
	Etching Characteristics of Indium Tin Oxide Thin Films Using Cl2-Based Plasma
	Yuan Deng, Beijing NAURA Technology Group
	Strategy to Clear the Etching by Product Residues in IGZO Etch Process with Inductively Coupled Plasma
	Yingjie Wang, Beijing NAURA Technology Group
	Solution and Mechanism for the Metal Line Corrosion Issue in Semiconductor BEOL Aluminum Etch Process
	Wangjian Liao, Beijing NAURA Technology Group
	Removal of Hydrogen-Containing Byproducts to Enhance Pre-Coating Quality in Etching Chamber
	Songmo Du, Beijing NAURA Technology Group
	Isotropic Etching Of SIGE Alloys With High Selectivity To SI
	Yiming Ma, Beijing NAURA Technology Group
	The Photoresist Trim Process in Advanced Packaging
	Zihan Dong, Beijing NAURA Technology Group
	Gas Cluster Ion Beam Aberration Correction in Wafer Level Total Thickness Variation Optimizing
	Tong Xin, Beijing NAURA Technology Group
	Optical Emission Spectroscopy Studies of NF3/H2/He Down Stream Inductively Coupled Plasmas
	Xingcun Li, Beijing NAURA Technology Group
	Top Bowing Optimization of High Aspect-ratio DTC with Low-Temperature Plasma Etching
	Zhaoxuan Zhang, Beijing NAURA Technology Group
	An In-Situ Real-Time Monitoring and Restoration System for Quartz Tube Damage in Ashing Machines
	Jiamin Deng, Beijing NAURA Technology Group
	Mechanism and Effect of Etchant Flow on SOH Mask Tri-Layer Plasma Etching
	Zinuo Chen, AMEC
	Selective Silicon Boride Etch to Form Titanium Nitride Pillar during Capacitor Memory Cell Manufacturing
	Xuehua Wang, Beijing NAURA Technology Group