Symposium Chair: Prof. Jianshi Tang, Tsinghua University, China


** to designate keynote talk - 30 min      
* to designate invited talk - 20 min      
  to designate regular talk - 15 min      

Sunday, March 22, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Pudong Ballroom 5


Session I: 2D Materials
Session Chair: TBD
**13:30-14:00 MoS₂ and WSe₂ Transistors for Next-Generation Electronics
  Lain-Jong (Lance) Li, National University of Singapore
*14:00-14:20 2D Materials in Post-Moore Electronics-Energy Devices: From Atomic Interfaces to Intelligent Systems
  Lin Jiang, Shanghai University
*14:20-14:40 Artificial Intelligence for 2D Materials and Devices
  Yong Xie, Xidian University/ICMM-CSIC
*14:40-15:00 Universal Mateials Integration for Cross Dimensional Devices
  Chen Wang, Tsinghua University
15:00-15:10 Coffee Break
   

Session II: Wide Bandgap Semiconductors and Emerging Technologies
Session Chair: TBD

**15:10-15:40 Opportunities for Energy Saving by Implementation of WBG Power Devices
  Mikael Östling, Royal Institute of Technology (KTH)
*15:40-16:00 Wide Bandgap Semiconductor for Power Management in Future Society
  Jin Wei, Peking University
*16:00-16:20  Wearable Ultrasound Technologies for Deep-Tissue Monitoring
  Hongjie Hu, Peking University
 
16:30-18:00 Panel Discussion (Meeting Room: Pudong Ballroom 1)
   

Monday, March 23, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Pudong Ballroom 5


Session III: MEMS
Session Chair: Kechao Tang
**08:30-09:00 Piezoelectric Micromachined Ultrasonic Transducers for Advanced Sensing Applications
  Yipeng Lu, Peking University
*09:00-09:20 Multisensor MEMS Approach to Structural Health Monitoring (SHM) for Liquid Hydrogen Tanks in Aviation — An Implementation Example
  Ray Saupe, Fraunhofer ENAS
*09:20-09:40 Next-Generation RF Filter Technologies for 6G and Wi-Fi 8
  Chengjie Zuo, University of Science and Technology of China
*09:40-10:00 Near Zero Power MEMS Sensors Enabled by a Phase Transition
  Kaichen Dong, Tsinghua University Shenzhen
*10:00-10:20 (Sc)AlN based Piezoelectric MEMS for Ultrasonic Sensing
  Bowen Sheng, Peking University
10:20-10:30 Coffee Break
   

Session IV: Sensors
Session Chair: TBD
*10:30-10:50 Multi-functional Sensing Technology for Self-Powered Microsystems
  Xiaosheng Zhang, University of Electronic Science and Technology of China
*10:50-11:10 3D-Structured Photodetectors based on 2D Materials
  Tao Deng, Beijing Jiaotong University
*11:10-11:30 Water Based Photodetector and Chips
  Shi-Sheng Lin, Zhejiang University
*11:30-11:50 1T FDSOI-based >1000fps Image Sensor with In-pixel Computing
  Peng Huang, Peking University
   

Session V: 3D Heterogeneous Integration
Session Chair: Chen Wang
*13:00-13:20 Wafer-Scale Heterogeneous Integration XOI for Power, Photonic, & Acoustic Devices
  Shibin Zhang, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
*13:20-13:40 Thermal Managenment of Chiplet
  Yunna Sun, Shanghai Jiao Tong University
*13:40-14:00 Batch EPI Technology for 3D DRAM Si/SiGe Superlattice
  Haoran Shi, Xingyuanchi Co Ltd
*14:00-14:20 An Ultra-High Vacuum (UHV) Device for Josephson Junction Fabrication
  Baosheng Du, Suzhou Youlun Vacuum Equipment Technology Co.,Ltd
*14:20-14:40 Wet Process Equipment and Temporary De-bonding Technology
  Liping Li, TAZMO Japan
14:40-14:45 Coffee Break
   

Session VI: Emerging Memory and Neuromorphic Computing
Session Chair: TBD
14:45-15:00 A Current Paths Based Performance Evaluation Method for 3D Resistive Random-Access Memory (RRAM) Arrays
  Zimeng Wu, Peking University
15:00-15:15 BEOL-Compatible MoS₂ Floating-Gate Optoelectronic Synaptic Array for In-Sensor Visual Computing
  Yuxin Li, Zhejiang University
15:15-15:30 Silicon-Based Artificial Hetero-Synapse with Light-Inhibition
  Qian He, Zhejiang University
15:30-15:45 Optogenetics-Inspired Dendritic Neuron with Nonlinear Integration and Filtering Functions
  Lixiang Jiang, Zhejiang University
15:45-16:00 Reconfigurable Neuronal-synaptic Transistors for Speech Signal Processing
  Zuqi Zhu, Zhejiang University
   
Poster Session: Monday, March 23, 16:00-18:00
  Effect of Quantum Well Thickness on the Recombination Efficiency in DUV LEDs
  Zijing Zhang, Jiangsu Normal University
  A Dual-Mode CMOS Stress Sensor with Interdigitated Electrodes and Graphene-Agarose Coating for Adaptive Precision-Power Scaling
  Shenzui Hu, Zhejiang University
  Co-Design of a Optimized De-Embedding TSV Test Structure and a High-Density Surrounding DTCAP for 3DIC Power-Signal Integrity
  Gang WANG, Hangzhou GHS Semiconductor Corporation
  A Novel Dopant-Segregated Device Architecture for High-Performance Schottky Barrier RFETs: A TCAD Simulation Study
  Senlin Wang, Zhejiang University
  CMOS Image Sensor WP Performance Optimization
  Zhiruo Shen, Shanghai Huali Integrated Circuit Corporation
  A TCAD-Based Thermal Analysis of Buried Power Rail and Backside Power Delivery Network at the 55nm Node
  Xiaonan Wu, Zhejiang University
  An Optoelectronic Artificial Synapse Based on IGZO/Cs₃Cu₂I₅ Heterojunction
  Biyun Fan, Zhejiang University
  Advanced Process Strategy to Improve White Pixel Performance by Implantation in CIS
  Liangcong Du, Applied Materials China
  High-Temperature Surface Smoothing in the SmartCutTM Process
  Xiaolong Wang, Applied Materials China
  Fully Printed Organic Electrochemical Transistor–Based Biomimetic Neuron
  Ziwei Liu, Nanjing University of Posts and Telecommunications
  Time-Domain Interface Trap Modulation for Discriminating Long- and Short-Term Plasticity in Ion-Gel-Gated IGZO FET
  Wenkai Tan, Nanjing University of Posts and Telecommunications
  Performance Optimization of Ultraviolet Organic PIN Photodetectors via Tuning of p/n Semiconductor Combinations
  Xianwang Chen, Nanjing University of Posts and Telecommunications
  Efficient Separation and Transport of Photogenerated Carriers in PEDOT:PSS/Si Heterojunctions
  Xiaoyu Zhang, Nanjing University of Posts and Telecommunications