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Chinese
2020年6月27-29日
上海新国际博览中心

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies


(** to designate keynote talk, * to designate invite talk)

Sunday, March 15, 2020 Shanghai International Convention Center
Meeting Room: 5A

Session I: MEMS and Sensors

Session Chair: Jingwei Bai

13:30-13:35 Chairman Remarks
   
**13:35-14:05 Monolithic integration of optical MEMS on CMOS
  Prof. Matthias Schulze, Fraunhofer IPMS
*14:05-14:30 Silicon based nanopore and its application potential
  Prof. Zewen Liu, Tsinghua University
*14:30-14:55 Integrated Photonics for Life Sciences – Cytometry and Microscopy
  Niels Verellen, IMEC
14:55-15:35 Coffee Break
   

Session II:
Session Chair: Huamao Lin


**15:35-16:05 Advanced Spectral Sensing Methods for Process Measuring Applications
  Ray Saupe, Fraunhofer ENAS
*16:05-16:30 Surface chemistry analysis of atomic layer deposition processes
  Prof. Bonggeun Shong, Hongik University
*16:30-16:55 TBD
  Bin Fu, Bosch Sensortec GmbH
   

Monday, March 16, 2020 Shanghai International Convention Center
Meeting Room: 5A

Session III: Novel Materials and Processes
Session Chair: Chang Chen

**08:30-09:00 Synthesis and applications of versatile 2-dimensional semiconductor materials
  Prof. Ji Hoon Ahn, Hanyang University
*09:00-09:25 Overview of Various Approaches Toward Area Selective Deposition
  Prof. Woo-Hee Kim, Hanyang University
09:25-09:45 Surface Analysis and Post Thermal Treatment Process Optimization of Graphene Oxide Thin Film for Humidity Sensor Application
  Xiaoxu Kang, Shanghai IC R&D Center
09:45-10:00 Coffee Break
   

Joint Session: Symposium VII and Symposium VIII-3D Heterogeneous Integration
Meeing Room: 5B+5C
Session Chair: Qinghuang Lin


**10:00–10:30 Diversity, Interconnect and Phase change: Semiconductor heterogenous integration and supper intelligence in the post Moore's Law era
  Hu Chuan, Guangdong Academy of Sciences
**10:30–11:00 3D Heterogeneous Integration
  Bill Bottoms, 3MTS
**11:00–11:30 Recent Achievements and New Technologies for High Performance Mems Sensors and Actuators
  Philippe Robert, CEA-LET
**11:30–12:00 3D Packaging Development for HPC and 5G Applications
  Chiang Shiuh-Kao, Prismark
12:00–13:30 Lunch Break
   

Meeting Room: 5A
Session V:
Session Chairs: Chang Chen & Huamao Lin


13:30-13:55 Characterization and Failure Analysis of High Electron Mobility Transistors using STEM-based Techniques
  Dr. Chunzhi Gu, EAG Laboratories
13:55-14:20 Development of stepper solutions for IoT devices
  TAO YUAN, CANON
14:20-14:35 Preparation of Fe-Mn-Ni-O Nano-Ceramics By Sol-gel auto combustion for Semiconductor Thermistor
  NamChol Yu, KimChaek University of Technology
14:35-14:50 Subsurface damage characteristics of monocrystal β-Ga2O3 in abrasive machining
  Shang Gao, Dalian University of Technology
14:50-15:20 Coffee Break
15:20-15:35 Arbitrarily Polarized CMOS Terahertz Detector with Silicon-Based Plasmonic Antenna
  Yiming Liao, Nanjing University of Science and Technology
15:35-15:50 Multiterminal Ultrathin Memristive Synapses based on monolayer molybdenum disulfide
  Meng Yan, Tianjin University of Technology
15:50-16:05 Air-stable and high on/off ratio near-infrared photodetector based on perovskite-treated PbS colloidal quantum dots
  Qingqing Wu, Shanghai IC R&D Center
16:05-16:20 Synthesis of Vertical MoS2/WS2 Heterostructure and its Photoelectric Properties
  Xin Lin, Tianjin University of Technology
   
Poster Session Location:5th Floor
Coffee Break  Effective Sparsity-Prior Image Denoising Algorithm for CMOS Image Sensor in Ultra-Low Light Imaging Applications
  Zhou Tao, Shanghai Integrated Circuits R&D Center Co., Ltd.