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Dr. Liyi Li is a Professor at the School of Integrated Circuits, Southeast University. He has long been engaged in research on advanced packaging processes, materials, and reliability. He has authored over 40 SCI-indexed papers and more than 10 conference papers, including those presented at IEEE ECTC. He holds one U.S. patent as the first inventor. Dr. Li has 5-year experience as a core member in 3D integration processes from a world-renowned semiconductor company. His current research focuses on hybrid bonding and through-silicon via (TSV) technologies. He has led several national-level research projects, including key projects funded by the National Natural Science Foundation of China (NSFC).
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