Mr. Hai Cong

Vice President, GM of Etch Product and Business Group, Advanced Micro-Fabrication Equipment Inc. (AMEC)

• Approximately 30 years of experience in advanced technology, large-scale production, equipment R&D and management of international semiconductor manufacturers including Singapore Chartered Semiconductor, Global Foundries, US Lucent, Wafertech (TSMC overseas company).

• Mainly engaged in the R&D and management of Etch technology and equipment, involving diversified characteristic process platforms and multi-process technologies such as logic, embedded non-volatile memory, power, radio frequency devices, and 3D integrated circuits.

• Successfully developed a number of mass-produced products, including 40, 28 and 22nm FDSOI embedded magnetic memory etching process and integration technology (the world's first mass production), automotive-grade embedded Flash process (world-leading, customers include Apple, Volkswagen, etc.)

• Applied / authorized more than 50 both international and Chinese patents related to equipment and technology.

• Master degree of microelectronics, National University of Singapore, Singapore