Onsite  
Date: Sunday-Monday, March 17-18, 2024
Venue: Shanghai International Convention Center 上海国际会议中心
  No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号


Distinguished Conference Keynote Speakers

         
Dr. Peng Bai
CEO,
Rong Semiconductor, China
Prof. John Robertson
Emeritus Professor of Electronic Engineering,
Cambridge University, UK
Dr. Michael Chudzik
VP of Technology,
IMS ICAPS & Packaging,
Applied Materials, US
Prof. Tobias Delbruck
Professor in Neuromorphic Engineering,
Institute of Neuroinformatics, Switzerland
Dr. Giorgio Allegato
MEMS Technology R&D Director, MEMS and Sensor Group,
STMicroelectronics, Italy


Plenary Session

08:45-12:10, Sunday, March 17, 2024
Meeting Room: 3rd Floor Auditorium
08:15-08:45 Registration 来宾登记
   
08:45-09:15 Opening Ceremony
  Opening Remarks by Conference Chair
  Opening Remarks by SEMI
  Presentation of the Best Student Paper Awards and the Best Young Engineer Paper Awards
   
09:15-09:50 Evolution of Moore's Law: a Perspective
  Dr. Peng Bai
  CEO, Rong Semiconductor, China
   
09:50-10:25 New Materials vs New Geometries in Electronic Devices
  Prof. John Robertson
  Emeritus Professor of Electronic Engineering, Cambridge University, UK
   
10:25-11:00 Integrated Module Approach to Solutions in the Specialty Device Market
  Dr. Michael Chudzik
  VP of Technology, IMS ICAPS & Packaging, Applied Materials, USA
   
11:00-11:35 50 Years of Silicon Retina History
  Prof. Tobias Delbruck
  Professor in Neuromorphic Engineering, Institute of Neuroinformatics, Switzerland
   
11:35-12:10 MEMS - Sustainable Technologies for a Sustainable World
  Dr. Giorgio Allegato
  MEMS Technology R&D Director, MEMS and Sensor Group, STMicroelectronics, Italy


Symposium Sessions

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post CMP Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems

Symposium X: AI & IC Manufacturing


Parallel Symposium Oral Sessions

Sunday, March 17, 2024
13:30-17:00 Parallel Symposium Oral Sessions
Coffee Break Conference Poster Session
   
Monday, March 18, 2024
8:30-17:00 Parallel Symposium Oral Sessions


Panel Discussion

17:05-18:15, Sunday, March 17, 2024
AI for IC Design & Manufacturing: The Hopes, Challenges, and Opportunities
       
Moderator: Panelists:
  Prof. Cheng Zhuo
Zhejiang University
  Prof. Daniele Ielmini
Politecnico Di Milano
Dr. Jun Yuan
Qualcomm
Prof. Yu Wang
Tsinghua University
Prof. Runsheng Wang
Peking University
Mr. Zusheng Yang
Empyrean


Training Courses

Monday, March 18, 2024
13:30-15:00 Workforce Development MEMS Enabled Liquid Biopsy
Speaker: Prof. Wei Wang, Peking University
15:30-17:00 Workforce Development Thin Film Deposition for IC Processing Technology
Speaker: Dr. Chao Zhao, Beijing Superstring Academy of Memory Technology (SAMT), China