Plenary Session

Onsite  
Date: Sunday-Monday, March 14-15, 2021
Venue: Shanghai International Convention Center 上海国际会议中心
  No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号
   
Virtual  
Date: March 14-April 11, 2021
Website: SEMI Cloud Platform


Distinguished Conference Keynote Speakers

Mr. Allen Lee
Corporate Vice President
GM of China R&D Center
AMD
Dr. Burn J. Lin
CEO
Linnovation, Inc
Dr. Suman Datta
Professor
University of Notre Dame
Dr. Zheng Yuan
Vice President and General Manager, Specialty Products and Technology
Applied Materials, Inc


Sunday, March 14, 2021
Meeting Room: 3rd Floor Auditorium
08:30-09:00 Registration 来宾登记
   
09:00-09:40 Opening Ceremony
   
09:40-10:15 Driving and Delivering High Performance Compute and Graphics Solutions
  Mr. Allen Lee
  Corporate Vice President, GM of China R&D Center, AMD
   
10:15–10:50 Nanolithography Milestones and Future
  Dr. Burn J. Lin
  CEO, Linnovation, Inc
   
10:50–11:25 Ferroelectric Field Effect Transistor: A Novel Computational Memory
  Dr. Suman Datta

Professor, University of Notre Dame
   
11:25–12:00 Enabling Specialty Applications in the IoT Era
  Dr. Zheng Yuan
  Vice President and General Manager, Specialty Products and Technology, Applied Materials, Inc


Parallel Symposium Oral Sessions

Sunday, March 14, 2021
13:30-17:00 Parallel Symposium Oral Sessions
Coffee Break Conference Poster Session
   
Monday, March 15, 2021
8:30-18:00 Parallel Symposium Oral Sessions


Training Courses

Monday, March 15, 2021
Workforce Development Automated IP Platform Based on RISC-V Processor IPs
Workforce Development Automotive IC Trend and Test Solution
Workforce Development Reliability Test of Automotive IC


Parallel Symposium Oral Sessions

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems


Conference Banquet

Sunday, March 14, 2021
Banquet fee

900RMB/Person
Online Registration link;
(http://semi.expotec.com.cn/Visitor/Conference.aspx?lang=en&uid=)

18:30-20:30 Conference Banquet


Hotel Floor Layout