
** | to designate keynote talk | Sponsored by: |
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* | to designate invite talk | ||
to designate regular talk |
Session I: Metrology I
Opening Remarks |
Peilin Song |
**OVL metrology trends in advanced nodes |
Efi Megged, KLA |
Study on Weighted Binary Classifier with Imbalanced SEM defect Data |
Hairong Lei, ASM |
Advanced Modeling Techniques Expand Applications of Picosecond Laser Acoustics for RF Process Monitoring |
Johnny Dai, Onto Innovation Inc., USA |
All side optical chipping and crack inspection of dice in a die attach machine at high throughput |
Norbert Ackerl, Besi Switzerland AG |
Session II: Metrology II
*Improving process control and efficiency through machine learning enhanced optical metrology |
Michael Shifrn, Nova LTD, USA |
*Advanced Applications of Picosecond Ultrasonic Technology in Semiconductor Manufacturing |
Cheolkyu Kim, Onto Innovation Inc. |
*Review of micro- and nanoprobe metrology for direct electrical measurements on-product wafers |
Benny Guralnik, KLA, Denmark |
*Advanced metrology techniques for MRAM production monitoring |
Alberto Cagliani, KLA, Denmark |
Session III: Test
*Faster Fault Isolation with Advanced Data Analysis and Computer Vision |
Franco Stellari, IBM Research, USA |
High inheritability and flexibility SmartTest8 TestMethod library on ultra-high-speed SerDes measurement |
Jiaying Xiang, Advantest (China) Co., Ltd. |
Best practices of extreme using 93K FVI16 and AVI64 to test automotive power system basis chip |
Kai Kang, Advantest (China) Co., Ltd. |
An Industry Example to Reduce the Test Time by Optimizing Data Extraction Method |
Xiaofeng Liang, NXP semiconductor (China) Ltd. |
Session IV: Test and Process Control
The flexible and inheritable SMT7 solution for High-Speed DDR PHY IP with IJTAG |
Yichen Xiao, Advantest (China) Co., Ltd. |
An ATE solution for high-performance AD/DA convertor |
Qin Feng, Advantest (China) Co., Ltd. |
A Failure of the 300 mm AMHS Design |
George W. Horn, Middlesex Industries SA, Switzerland |
SESSION V: Reliability
**Recent Advances in Statistical Modelling Methodology Development for ReRAM Applications |
Ernest Wu, IBM Research, USA |
Study on Stress Migration of FCQFN Package with unbalanced arrangement of bumps |
Shuanshe Chao, ZTE Corporation |
Machine Learning Based Aging Critical Path Selection |
Jiadong Yao, Sanechips Technology Co., Ltd. |
Session VI: Reliability and Root Cause Analysis
Digital Defect Traceability across Sapphire Processing: Case Study on Micro-LED Chain |
Ivan Orlov, Scientific Visual SA, Switzerland |
Research on Reliability Optimization Mechanism of 28HKMG Technology |
Weiwei Ma, Shanghai Huali Integrated Circuit Corporation |
Polarization and temperature dependence of Er emission in freestanding Er doped GaN bulk crystal |
Honglin Gong, Xiamen University, China |
Poster Session:
I3C Protocol Testing of Sensor Interface on the Advantest V93000 Tester |
Kaitao Liu, Advantest |
Effective usage of Attenuators on Production Test |
Hao Chen, Advantest |
MCU+ Test Solution on V93000 SmartTest8 |
Tianyu Zhang, Advantest |
Conditionally executed tests, branching and algorithmic binning - Getting it right |
Lai-Choon Chan, Teradyne Inc |
Study of Negative Charge Accumulation Mechanism and Removal Method on the Wafer Surface in Via Photo Development Process |
Haihua Chen, Shanghai IC R&D Center |
14 Bits current DAC testing with 16 Bits instruments |
Luffy Jin, Teradyne |
A Neural Network Approach to Analyze FDC Data in Semiconductor Manufacture |
Wei Yu, Shanghai Huali microelectronics corporation |
Impact of Hot-Carrier Degradation Due to Moisture Diffusion Based on 0.153um CMOS |
Zhengyu Lin, Southeast University |
A Voltage Screen Model and Method for Early Fail Screening |
Wen Ying, Semiconductor Manufacturing International Corporation |
Study and Improvement on measurement accuracy of Image Based Overlay |
Zhi-Feng Gan, Semiconductor Manufacturing International Corporation |
Tiny SADP Defect Detection and Reduction for 19nm Nand Flash Technology Semiconductor Manufacturing Engineering |
QiuFeng Cao, Shanghai Huali Microelectronics Corporation |
Optimization of ESD diode design for RF Applications in FinFET Technology |
Mingxin Zhou, Semiconductor Manufacturing International Corporation |
Different Module's Process Affect to Poly Pattern Etch Stick Particle |
Jiayi Fu, Shanghai Huali Microelectronics Corporation |
Classification of Wafer Backside Images via FasterRcnn-Based Neural Network |
Junjun Zhuang, Shanghai Huali Microelectronics Corporation |
WAT Throughput Improved by Algorithm Optimization |
Tong Chen, Shanghai Huali Microelectronics Corporation |
Anomaly detection of semiconductor processing data based on DTW and LOF algorithm |
Wang Yong, Shanghai Huali Microelectronics Corporation |
Reason Forecast with NLP on Test Result Alarm in Semiconductor Fab |
Meng Xue, Shanghai Huali Microelectronics Corporation |
The study of method to improve defect scan sensitivity post dummy poly remove in 14nm node |
Xingdi Zhang, Shanghai Huali Integrated Circuit Corporation |
Virtual Metrology of WAT value with Machine Learning Based Method |
Tao Zhou, Shanghai IC R&D Center |
Hybrid Solutions for Root Cause Tracing of Random Alarm on Etch Tool |
Xuling Diao, Shanghai IC R&D Center |
Reliability Study of 3D-TGV Vertical Interconnection |
Jin Zhao, Beijing University of Technology |
The type and solution of inline poly residue defect for 28 HK process improvement |
Min Wang, Shanghai Huali Microelectronics Corporation |
Study of the degradation in LDMOS with STI technology and improve the reliability with several methods |
Xiaoming Zhang, HuaHong Grace Semiconductor Manufacturing Corporation |