| ** | to designate keynote talk - 30 min | |||
| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Monday, June 26, 2023 Shanghai International Convention Center
Meeting Room:
Session I: Test I
Session Chair: Xiaowei Li
| **13:30-14:00 | TBD |
| *14:00-14:25 | Build-in Fault-Tolerant Computing Against Silent Data Corruptions |
| Huawei Li, Institute of Computing Technology, Chinese Academy of Sciences | |
| *14:25-14:50 | TBD |
| 14:50-15:05 | Innovation Test Technology for Ultra-High-Speed ADC on ATE |
| Yanyan Chang, Advantest (China) Co., Ltd | |
| 15:05-15:20 | Ultra-Wideband (UWB) Test Solution on V93000 |
| Kevin Yan, Advantest (China) Co., Ltd | |
| 15:20-15:35 | General Chip Digital Data Obtaining Solution on ATE |
| Steve Xie, Advantest (China) Co., Ltd | |
| 15:35-15:50 | An efficient protocol framework solution on V93000 |
| Jun Chen , Advantest (China) Co., Ltd | |
| 15:50-16:05 | BB-AP High Parallel Test Solution in V93000 ExaScale Platform |
| Tianyu Zhang, Advantest (China) Co., Ltd | |
| 16:05-16:35 | Coffee Break |
Session II: Reliability I
Session Chair:
| 16:35-16:50 | A Novel Model-Matching Based Scratch Tool Tracing System |
| Shi-Qiang He, Fujian Jinhua Integrated Circuit Co., Ltd | |
| 16:50-17:05 | Faster Au-Al IMC growth under chlorine environment |
| Lois Liao, WinTech Nano-Technology Services Pte. Ltd | |
| 17:05-17:20 | The Design-Based Inspection Strategy for CU Void Defects Reduction |
| Xingdi Zhang, Shanghai Huali Integrated Circuit Corporation | |
| 17:20-17:35 | Reliability Research on micro bump and c4bump in Large-Size 2.5D FCBGA |
| Xiang Li, Sanechips Technology Co., Ltd. | |
| 17:35-17:50 | Reliability analysis of metal thermal interface materials for ultra-large size FCLGA package |
| Zhuolun Wu, Sanechips Technology Co., Ltd. | |
Tuesday, June 27, 2023 Shanghai International Convention Center
Meeting Room:
Session III: Test II
Session Chair: Guihai Yan
| *8:30-8:55 | DPU (Data Processing Unit) enabling the Next-gen Computing System |
| Guihai Yan, Institute of Computing Technology, Chinese Academy of Sciences | |
| 8:55-9:10 | An Efficient Tool for Generating Test Program to Save Marginal Fail Chips |
| Hanyan Chen, Advantest (China) Co., Ltd | |
| 9:10-9:25 | A universal auto test program generation on ADVANTEST V93000 ATE platform |
| Xin Song, Advantest (China) Co., Ltd | |
| 9:40-10:00 | Early Fault-analysis using in-line Raman Spectroscopy |
| Roy Pinhassi, Nova Ltd. | |
| 10:00-10:15 | A Methdology for Testing Scan Chain with Diagnostic Enhanced Structure |
| Shuai Wang, Sanechips Technology Co., Ltd. | |
| 10:15-10:30 | A Novel Method to Achieve High Efficient Iteration of Mbist Pattern |
| Feilong Pan, Sanechips Technology Co., Ltd. | |
| 10:30-10:45 | Coffee Break |
Session IV: Reliability II
Session Chair:
| 10:45-11:00 | Impact of Interface Trap Density on the Endurance of HfO2/Si FeFETs |
| Jiaqi Zheng, Zhejiang University | |
| 11:00-11:15 | Impact of Interface Traps Generation on Flicker Noise Degradation in Si pMOSFETs |
| Yi Jiang, Zhejiang University | |
| 11:15-11:30 | Research on Hot Carrier Injection Optimization of 28HKMG Technology |
| Weiwei Ma, Shanghai Huali Integrated Circuit Corporation | |
| 11:30-11:45 | Applications of Picosecond Laser Acoustics to Power Semiconductor Device: IGBT and MOSFET |
| Johnny Dai, Onto Innovation | |
| 11:45-12:00 | RC-Triggered Silicon Controlled Rectifier-based ESD Clamp with Fast Transient Reaction |
| Lingran Pan, Zhejiang University | |
| 12:00-13:30 | Lunch Break |
Session V: Metrology
Session Chair: Lei Feng
| *13:30-13:55 | TBD |
| *13:55-14:20 | Ultra-high-throughput inline probe metrology and inspection |
| Lei Feng, Infinitesima Limited | |
| 14:20-14:35 | Innovations in Integrated Metrology |
| Ilya Osherov, Nova Ltd, Israel | |
| 14:35-14:50 | Computer Vision Technology Supported Rapid DRAM Capacitor Analyzing System Based on TEM Image |
| Chang Xu, Fujian Jinhua Integrated Circuit Co., Ltd | |
| 14:50-15:05 | Calibration of pitch standards of SEM for semiconductor dimension metrology application |
| Wei Li, National Institute of Metrology | |
| 15:05-15:20 | Virtual Metrology Modeling for CVD Film Thickness with Lasso-Gaussian Process Regression |
| Sen Wang, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC) | |
| 15:20-15:35 | Coffee Break |
| Poster Session: | |
| Applications of IC Design Layout Information in the In-line E-beam Defect Inspections | |
| Fengjia Pan, Shanghai Huali Integrated Circuit Corporation | |
| The Improvement Study of UTS CIS Bevel Peeling Defect Based on the Application of SEM API | |
| Xianghua Hu, Shanghai Huali Microelectronics Corporation | |
| Study on E-Beam Induced Deposition with Gas Injection System | |
| Fan Zhang, Semiconductor Manufacturing International Corporation | |
| Methods for Fin Etching profile maintaining and measurement | |
| Xu Yun, Semiconductor Manufacturing International Corporation | |
| Investigation of Different Gate Bias on PMOS HCI Performance | |
| Lei Li, Semiconductor Manufacturing International (Shanghai) Corp. | |
| Research on TDDB physical mechanism of 28HKMG MOSFET | |
| Ting Wan, Shanghai Huali Integrated Circuit Corporation | |
| Reservoir Effect Study on Electro-migration Behavior of AlCu Interconnects | |
| Jizhou Li, Semiconductor Manufacturing International Corporation | |
| A Method to Study Probe Needle Behavior during Hot Wafer Test on PS1600 Platform | |
| Ruiyu Liu, NXP Semiconductor (China) Ltd. | |
| An optimization method for capacitance causing errors in WAT testing | |
| WeiGuo Zheng, Shanghai Huali Integrated Circuit Corporation | |
| Influence of Foup Environment On Defects in Semiconductor manufacturing | |
| Weiwei Zhao, Shanghai Huali Integrated Circuit Corporation | |
| The verification of TDDB acceleration model in ultrathin gate oxide | |
| Wen Ying, Semiconductor Manufacturing International Corporation | |
| Remaining Useful Lifetime Prediction for Parts in Semiconductor Manufacture | |
| Wei Yu, Shanghai Huali microelectronics corporation | |
| The Methodology to Reduce of Line Leaning Defect at 19nm Nand Flash Polygate Process | |
| Jianye Song, Shanghai Huali Microelectronics Corporation | |
| A study of the effect of post HK nitridation on the interfacial trap for reliability improvement | |
| YANG LI, Shanghai Huali Integrated Circuit Corporation | |
| Anomaly Detection of Non-normal Distribution Wafer Acceptance Test Data via GMM-Based Method | |
| Junjun Zhuang, Shanghai Huali Microelectronics Corporation | |
| Anomaly Detection of CDSEM Images | |
| Meng Xue, Shanghai Huali Microelectronics Corporation | |
| Design and optimization of RC triggered MV-NMOS for 28nm CMOS Technology ESD protection | |
| Jia Zhu, Semiconductor Manufacturing International Corporation | |
| Application of Picosecond Ultrasonic Technology for CMOS Image Sensor | |
| Johnny Mu, ONTO Innovation | |
| Neutron Irradiation Induced Carrier Removal and Deep Level Trap in n-GaN Schottky Barrier Diodes | |
| Jin Sui, Shanghaitech University | |
| MetaVit-Trans: A framework for mixed-type defect detection of wafers with Vision Transformer combined with meta-learning and transfer learning | |
| Junfeng Zhao, Northeastern University | |
| Imaging time series data to Achieve Better Anomaly Detection in semiconductor production | |
| Wang Yong, Shanghai Huali Microelectronics Corporation | |
| Multispectral infrared radiation temperature measurement based on multi-objective differential evolution and deep learning | |
| JianWei Yan, Northeastern University | |
| Lithography Hotspot Detection Based on Transfer Learning with High Resolution Networks | |
| Hongzhe Wang, Northeastern University | |
| An End-To-End Detection Approach for Micropipe Defect of Sic Wafers Via Fusing Multiple Hierarchical Features | |
| Wenxin Shi, Tsinghua University | |
| An Automated Microscope Inspection Platform SiC Wafer Defect Detection | |
| Tiangang Zhao, Tsinghua University | |
| A Real-Time Detection Method for Wafer Probe Reference Die Shift | |
| Xiaofeng Liang, NXP Semiconductor (China) Ltd. | |
| Novel Localization Approaches in Metal –Insulator-Metal Structure Failure Analysis | |
| Lvye Fang, Semiconductor Manufacturing International Corporation | |