| ** | to designate keynote talk | Sponsored by: |
|
| * | to designate invite talk | ||
| to designate regular talk |
Sunday, March 14, 2021 Shanghai International Convention Center
Meeting Room: 3B
Session I: Metrology I
Session Chair: Kelvin Xia
| 13:30-13:35 | Opening Remarks |
| Peilin Song | |
| **13:35-14:05 | Mass Metrology Solution for 3D Process-Monitoring |
| Jiangtao Hu, Lam Research, USA | |
| 14:05-14:20 | Implementation of Spectral Interferometry for Enhanced Critical Dimensions Optical Metrology |
| Roy Shtainman, Nova Measuring Instruments | |
| 14:20-14:35 | Advantages of Picosecond Ultrasonic Technology for Advanced RF Metrology |
| Johnny Dai, Onto Innovation Inc., USA | |
| 14:35-15:30 | Coffee Break |
Session II: Metrology II
Session Chair: Kelvin Xia
| *15:30-15:55 | Mid-Infrared Critical Dimension Ellipsometry and Advanced Machine Learning to Address Complex Semiconductor Manufacturing |
| Franklin Wong, Onto Innovation Inc., USA | |
| 15:55-16:10 | Inline Thickness Measurement for Thick Amorphous Silicon Film by Spectroscopic Ellipsometry Method |
| Bo Zhang, HHGrace | |
| 16:10-16:25 | OCD Signal Study under the Normal and Oblique Incidence Metrology Architectures |
| Aihua Yang, Shanghai IC R&D Center | |
| 16:25-16:40 | Mask Design method for Un-patterned Dark Field Defect Inspection System |
| Chao Liu, Wuhan University of Science and Technology | |
Monday, March 15, 2021 Shanghai International Convention Center
Meeting Room: 3B
Session III: Test
Session Chair: Kelvin Xia
| 8:30-8:45 | An Efficient Way of Developing 5G MIMO Transceiver Test on ATE |
| Hao Chen, Advantest (China) Co., Ltd. | |
| 8:45-9:00 | Complex Protocol Construct System on ATE Platform |
| Cecilia Cao, Advantest (China) Co., Ltd. | |
| 9:00-9:15 | Test challenges for 5G wireless base station application device |
| Xin Song, Advantest (China) Co., Ltd. | |
| 9:15-9:30 | Universal Semiconductor ATPG Solutions for ATE Platform under the Trend of AI and ADAS |
| Ziteng Xu, Advantest (China) Co., Ltd. | |
| 9:30-10:30 | Coffee Break |
Session IV: Diagnosis and Yield
Session Chairs: Kelvin Xia & Francis Jen
| 10:30-10:45 | PICA analysis of CMOS Circuits Using SIL Measurement |
| Lin Shang Chih, Gallant Precision Machining Co.,Ltd. | |
| 10:45-11:00 | Backside Defect Monitoring Strategy And Improvement In The Advanced Semiconductor Manufacturing |
| JianGang Zhou, Shanghai Huali Integrated Circuit Corporation | |
| 11:00-11:15 | Convolutional Neural Network (CNN) Based Automated Defect Classification (ADC) with Imbalanced DataCapability |
| Hairong Lei, ASML-HMI | |
| 11:15-11:30 | A Novel Wafer-map Similarity Search System with High Speed and Accuracy |
| Chang Xu, Fujian Jinhua Integrated Circuit Co., Ltd. | |
| 11:30-13:30 | Lunch Break |
SESSION V: Reliability
Session Chairs: Kelvin Xia & Francis Jen
| *13:30-13:55 | Full Chip Reliability Verification by Netlist Driven Layout Methodology |
| Jonathan White, Synopsys, USA | |
| 13:55-14:10 | Reliability Challenges and Inline Metrology - an Effective Approach to Implementation in Advanced Devices |
| Daniel Fishman, Nova Measuring Instruments, Israel | |
| 14:10-14:25 | The Gate Length Dependence of Single Event Upset in 14nm bulk and SOI FinFET SRAM Cells |
| Jingyi Liu, Peking University | |
| 14:25-14:40 | Board-level thermal cycle simulation and improvement of 2.5D large-size package |
| Shiyu Chen, ZTE Corporation | |
| 14:40-15:30 | Coffee Break |
Session VI: Fab Management
Session Chairs: Kelvin Xia & Francis Jen
| 15:30-15:45 | Throughput Improvements via Logistics in Current Semiconductor Factories |
| George W. Horn, Middlesex Industries Sa, Switzerland | |
| 15:45-16:00 | 350 kg Sapphire Inspection Facility Open Doors for Complete Defect Traceability across LED Manufacturing Process |
| Ivan Orlov, Scientific Visual, Switzerland | |
| 16:00-16:15 | R2R Based Alternating Direction Method of Multi-parameter Control Strategy |
| Huating Huang, Fujian Jinhua Integrated Circuit Co., Ltd. | |
| 16:15-16:30 | A Dynamic Sampling Algorithm based on Cost-Risk Assessment Model in Semiconductor Manufacturing |
| Sen Wang, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC) | |
| Poster Session: | |
| New Register Configuration Solution for High Speed IO Test | |
| Zhang Tianyu, Advantest | |
| EFFECTS OF DIFFERENT GATE STRESS CONDITIONS ON HOT CARRIER INJECTION IN HIGH VOLTAGE N-CHANNEL CMOS | |
| Lei Li, Semiconductor Manufacturing International Corporation | |
| A New Solution of Power Management IC One Time Programable Test | |
| Yong Liang, NXP Semicondoctors | |
| Reliability Investigation between 2-terminal and 4-terminal Kelvin Structure in Terms of WLR IsoEM and PLR EM for Metal Interconnection | |
| Dingrui Zhang, Semiconductor Manufacturing International Corporation | |
| The Failure Mechanism of Drain Bias TDDB and characterization of lifetime Modal for HV De-PMOS | |
| Weihai Fan, Semiconductor Manufacturing International Corporation | |
| Electro-migration Behavior Study on Metal Line Width and Length of AlCu Interconnects | |
| JiZhou Li, Semiconductor Manufacturing International Corporation | |
| Experimental Study on Void Growth and EM Performance under DC Reversal | |
| Dingrui Zhang, Semiconductor Manufacturing International Corporation | |
| Defect principle and improvement of 28nm germanium silicon epitaxial growth process | |
| Qu Yan, Shanghai Huali Integrated Circuit Corporation | |
| The Strong Effect of Spectral Mode and Directional Electrical Field for Nuisance Filtering in Defect Inspection | |
| Xingdi Zhang, Shanghai Huali Integrated Circuit Corporation | |
| Impact of the stress on reference voltage of power SIP chip applied in 5G based station | |
| Qiong Jin, ZTE Corporation | |
| A Method to Enhance the Hot Carrier Injection Effect of IONMOS device | |
| Shuang Jiao, Shanghai Huali Microelectronics Corporation | |
| ATE Test Solution for High Resolution and High Voltage DAC | |
| Tianyu Zhang, Advantest | |
| Machine Learning Based Prediction of aging caused path-delay degradation | |
| Qi Wei, ZTE Sanechips Corporation | |
| THE INVESTIGATION OF INLINE TINY BUBBLE DEFECT INSPECTION AND SOLUTION FOR 14NM PHOTOLITHOGRAPHY PROCESS | |
| Yin Long, Shanghai Huali Integrated Circuit Corporation | |
| WiFi6e Test on ATE | |
| Ping Wang, Advantest | |
| Next Generation Test Library for RF SOC on ATE | |
| Haocheng Yuan, Advantest | |
| Wafer Defect Classification Based On DCNN Model | |
| Pan Tian, Shanghai Integrated Circuits R&D Center Co., Ltd. | |
| Research on restoration of color object in Computational Holography based on Genetic Algorithm | |
| Yufei Liu, Shuang Xu, Cheng Liao, Chao Liu, Wuhan University of Science and Technology | |
| Design optimization of GaAs/AlGaAs lasers epitaxially grown on Si substrates with threading dislocation density in the range of ~106 cm-2 | |
| Yugeng Shi, Sun Yat-sen University | |
| FAULT DETECTION OF SENSOR DATA IN SEMICONDUCTOR PROCESSING USING NEURAL NETWORK WITH DYNAMIC TIME WRAPPING LOSS | |
| Wang Yong, Shanghai Huali Microelectronics Corporation | |