Symposium Chair: Dr. Xiaowei Li, ICT, CAS, China
| ** | to designate keynote talk - 30 min | Sponsored by: |
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| * | to designate invite talk - 25 min | ||
| to designate regular talk - 15 min |
Sunday, March 22, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Function Room 2
Session I: Test
Session Chair: Xiaowei Li
| 13:30-13:35 | Opening Remarks |
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| **13:35-14:05 | Strategy and Demonstration of FPGA-based Automated Test above 100 Gbaud per Lane |
| David Keezer, Eastern Institute of Technology | |
| 14:05-14:20 | Best Implementation Strategy of PS5000 in Smart TV Chip Testing |
| Chelsea Zhou, Advantest | |
| 14:20-14:35 | High-Speed ADC CLK Optimization Using Advantest V93K Wave Scale Precision Source |
| Ya Gao, Advantest | |
| 14:35-14:50 | Oscillation Mechanisms in Laser-Sustained Plasma Light Sources for Semiconductor Inspection |
| Yangyang Fu, Tsinghua University | |
| 14:50-15:05 | Break Through the Test Challenges for the Satellite Terminal SoC Chips On V93000 |
| Bank Liu, Advantest | |
| 15:05-15:20 | Break Time |
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Session II: Test and Reliability
Session Chair: David Keezer
| *15:20-15:45 | Design for Testability and ATPG Based on Software-Defined LFSR |
| Dong Xiang, Tsinghua University | |
| 15:45-16:00 | The Impact of Drain Bias on Advanced High-k Metal-gate TDDB Reliability |
| HuaMeng Wang, Sanechips Technology Co., Ltd. | |
| 16:00-16:15 | A dual-mode X-ray Diffraction Metrology System with Parallel and Convergent-beam capabilities |
| Yankun Sun, Shenzhen Angstrom Excellence Semiconductor Technology Co. Ltd | |
| 16:15-16:30 | Cloud-IoT Enabled Real-time ML for Semiconductor Test Optimization in OSAT Environments |
| Fangmin Chu, Advantest | |
| 16:30-16:45 | Coffee Break |
| 16:30-18:00 | Panel Discussion (Meeting Room: Pudong Ballroom 1) |
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Monday, March 23, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Function Room 2
Session III: Reliability
Session Chair: Xiaowei Li
| *08:35-09:00 | Reliability and Test Challenges for Multi-Core Cyber-Physical Systems |
| Zebo Peng, Linkoping University | |
| 09:00-09:15 | Analysis of the Impact of SACQ Solder Balls and High-Reliability Solder Paste on Board-Level Temperature Cycle Life |
| Yunong Zhao, Sanechips Technology Co., Ltd. | |
| 09:15-09:30 | Failure Analysis and Localization of CDM Induced Micro Damage in High Speed I/O of Advanced FinFet Nodes |
| Caiyun Ren, Shanghai X-Ring Technology Co., Ltd. | |
| 09:30-09:45 | Analysis of Chip Failure Caused by Misoperation in HTOL Test |
| Haitao Liu, Sanechips Technology Co. Ltd. | |
| 09:45-10:00 | High sensitivity and quantitative differential interference contrast measurement and verification by using nm-scale shallow and smooth-shaped defects |
| Shogo Iguchi, Hitachi High-Tech Corporation, Japan | |
| 10:00-10:15 | Coffee Break |
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Session IV: Metrology
Session Chair: Dong Xiang
| *10:15-10:40 | AI 4 Sensors: On New Integration and Testing Paradigm of Sensing and Intelligence |
| Jia Li, Institute of Microelectronics, CAS | |
| 10:40-10:55 | Analysis of Metallic Contaminants on SiC wafer with Innovative Extraction Method |
| Lihua Tao, Huaying Research Co.,Ltd | |
| 10:55-11:10 | Nondestructive Depth Measurement of High-Aspect-Ratio Microstructures with Ultra-Small Linewidth |
| Zizheng Wang, Tianjin University | |
| 11:10-11:25 | Advanced Metrology for Backside Metallization Using Picosecond Laser Ultrasonics |
| Johnny Dai, ONTO Innovation | |
| *11:25-11:50 | Strategic Evolution of Metrology & Inspection (MI) in the AI Era: Transitioning to Intelligent, Data-Driven Process Control |
| Byoung-Ho Lee, Hitachi High-Tech Corporation, Japan | |
| 11:50-13:30 | Lunch Break |
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Session V: Advanced Technology
Session Chair: Zebo Peng, Yiping Xu
| **13:30-14:00 | Architecting for Jagged Intelligence |
| Qiang Xu, The Chinese University of Hong Kong | |
| *14:00-14:25 | AI-Assisted Full-Flow Digital Chip Design |
| Jing Ye, CASTEST Co., Ltd. | |
| 14:25-14:40 | Effect of Barrier Process on TDDB for Cu/ULK BEOL Structures |
| Yue Wu, GTA Semiconductor Co., Ltd. | |
| 14:40-14:55 | A Review of Recent Technological Advancements in Corona Noncontact Metrology Tools, CnCV, for Industrial WBG Wafer Testing and Electrical Defect Related Yield Prediction |
| Adam Wincukiewicz, ONTO Innovation | |
| 14:55-15:10 | Two-stage Threshold Voltage Shift Effects of ZnO Thin-film Transistors under Ultraviolet Irradiation |
| Aoran Xu, Peking University | |
| 15:10-18:00 | Coffee Break |
| 16:00-18:00 | Poster Session: Monday, March 23 (3F, Kerry Hotel Pudong, Shanghai) |
| 6-3 | eFuse Test Implementation via Protocol Access on V93000 |
| Ying He, Advantest | |
| 6-4 | Using "Conditional Go To" on V93000 XPS256 for Trimming Test |
| Ying He, Advantest | |
| 6-5 | Thermo-Mechanical Analysis of CNT-Cu Filled TSVs with Varying Geometric and Material Parameters |
| Ziyao Luo, Shanghai University | |
| 6-6 | High Throughput and Low Cost Solution for NFC Device Testing On V93000 |
| Xiaoxiao Wei, Advantest | |
| 6-8 | MDL Variability in Semiconductor Wafer Analysis: The Critical Role of the Extraction Solution and the Contaminants States |
| Sophia Wen, Huaying Research Co.,Ltd | |
| 6-10 | New Bluetooth Channel Sounding production testing on V93000 |
| Daniel Sun, Advantest | |
| 6-11 | SmarTest8 Standard Trim Test Framework |
| Xiao Li, Advantest | |
| 6-12 | Testing SparkLink Low Energy(SLE) Access Mode on V93000 |
| Daniel Sun, Advantest | |
| 6-16 | ATPG of AI Test Program |
| Yaqiong Mao, Advantest | |
| 6-17 | Concurrent Testing of Functionally Independent Modules in SIP SoC on V93000 |
| Rong Tang, Advantest | |
| 6-19 | A Test Time-Optimized Multi-Lane SERDES Test Method Based on the 93000 ATE Platform |
| Ruiqiang Liu, Advantest | |
| 6-20 | Measurement of Wi-Fi 7 Transceivers Using a Combination of WSRF and WSMX Cards |
| Liuhao Chen, Advantest | |
| 6-21 | Common Test Solutions Realization of Auto-Calibration |
| Norris Wang, Advantest | |
| 6-23 | Study and Application of Probe Factor Calibration for Measuring Near-Field Electromagnetic Interference |
| Shangru Han, JCET Group Co., Ltd. | |
| 6-24 | Fault Isolation using FIB to Mitigate Interference in Failure Analysis Caused by OBIRCH |
| Jiwei Zhou, Beijing Xuanjie Technology Co., Ltd. Shanghai First Branch. | |
| 6-26 | Test Solution for 2M 24 bit High-Speed and High-Precision ADC Chip |
| Qinghua Qi, Advantest | |
| 6-27 | Automotive BMS Chip Testing: Key Test Items and ATE Implementation Case Study |
| Qingchuan Ma, Advantest | |
| 6-29 | A Machine Learning-Based Model for Predicting the Service Life of Short-Wave Light Sources in OCD Tools |
| Zhenhao Chen, Shanghai University | |
| 6-30 | EFUSE Test Specification |
| Zhenyan Cao, Advantest | |
| 6-31 | Prediction of Chip Aging-Induced Vmin Shift Based on SPICE Simulation |
| Haiyong Wang, Sanechips Technology Co., Ltd | |
| 6-32 | Advancing ATE Efficiency: Integration of EXA Scale and SmarTest 8 for APBB Applications |
| Felix Chen, Advantest | |
| 6-33 | BMS Metrology Consistency and In-Service Mutual Recognition: Type Evaluation and ATE Test Coverage Methodology Based on Beijing-Tianjin-Hebei Coordination |
| Yan Yang, Tianjin Institute of Metrological Supervision and Testing | |
| 6-35 | Full Process Control Solutions for High Precision Mass Production of SRG Optical Waveguides in AR/MR Applications |
| Hong Hong, Onto Innovation | |
| 6-36 | Outlier Screening for IC Based on Sparse Multi-Output Gaussian Process Regression |
| Haobin Qin, Zhejiang University | |
| 6-40 | Design and Implementation of DSI3 Interface Test Solution for Automotive Semiconductor Devices |
| Kaitao Liu, Advantest | |
| 6-44 | The Influence of via Over-Etch on the Electromigration of Copper Interconnects |
| Yaokai Tang, Shanghai Huali Integrated Circuit Corporation | |
| 6-45 | A Study on LDD Optimization for HCI Reliability Enhancement in 55nm 3.3v IO NMOS Devices |
| Wenfeng Ding, GHS Semiconductor Co., Ltd., Hangzhou, China | |
| 6-46 | Best Practice of RF Trim for Satellite Moblie Terminal RF Transceiver on V93000 |
| Bank Liu, ADVANTEST (China) | |
| 6-47 | Gate Oxide Process Optimization for NBTI suppression in NOR Flash Periphery Devices |
| Liyun Wu, GHS semiconductor | |
| 6-48 | Study of New Stress Migration Failure Modes in Nose Plate Structures of Cu/Low-k Interconnects |
| Yuexing Cheng, GHS Semiconductor Co., Ltd | |
| 6-49 | Combined Vramp and Modeling Analysis of IMD Reliability Assessment |
| Bo Yang, GHS | |
| 6-52 | Optimal Methodology for Chiplet Testing in SmarTest 8 |
| Haijing Wu, Advantest | |
| 6-56 | Investigation on the Failure Mechanism of THB Test for Recovering Short Circuit Problems |
| Zhonggen Zhang, Sanechips Technology Co., Ltd. | |
| 6-57 | Analysis of Zero-IF Architecture RF Self-Calibration Solutions Based on V93000 Platform |
| Dong Hao, Advantest | |
| 6-61 | BF2+ Recipes Optimization for High Performance CIS Device |
| Hui You, Applied Materials China | |
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