Design Innovation Forum: AI Intelligent Applications and Automotive IC's
| Date: | Thursday, March 26, 2026 |
| Time: | 15:30-17:25 |
| Venue: | Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
Artificial intelligence is rapidly reshaping the paradigms of integrated circuit (IC) design. From large-model training to edge inference, AI workloads demand unprecedented levels of compute efficiency, power optimization, and architectural flexibility—spurring innovations such as domain-specific architecture, heterogeneous integration, and AI-enhanced EDA flows. According to Yole, the global AI chip market is projected to exceed $100 billion by 2026, with design innovation at the core of competitive differentiation.This forum brings together world-class chip leaders and experts to explore the future ecosystem of intelligent ICs. It serves as a vital platform for international dialogue on how AI is reshaping the future of chip design—and how the global industry can co-innovate to meet emerging technological and market demands.
Organizers
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| Agenda / 议程 | |
| 15:00-15:30 | Registration 注册 |
15:30-15:40
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Welcome Speech 欢迎致辞 Lily Feng, President, SEMI China 冯莉，SEMI中国总裁 |
15:40-15:45
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Opening Remark 开幕致辞 Moderator / 主持人 Dr. Xiaoning Qi, Vice President, Alibaba Group 戚肖宁，阿里巴巴集团副总裁 |
| 15:45-16:05 | TBD |
16:05-16:25
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Qing Chu, Chairman/CEO, NPC Tech 楚庆，智识神工董事长、首席执行官 |
| 16:25-16:45 | TBD |
16:45-17:05
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Fisher Zhang, General Manager, Complex SOC BU, Asia, Teradyne 张震宇，泰瑞达Complex SOC 事业部亚太区总经理 |
| 17:05-17:25 | Smiths Interconnect |
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* 议程以最终版为准 * The agenda is subject to being updated. |
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CONTACT US:
Hannah Zhao 021-60278571 [email protected]