| Call for Papers (CSTIC 2023) |
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**Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements.
How To Write A Quality Abstract?
Abstract Submissions Deadline: November 1, 2022 (Extended to Nov. 15, 2022)
Author Notification Sent: December 1, 2022 (Extended to Dec. 15, 2022)
Final Paper Deadline: March 30, 2023
Scope of Paper Solicited: We aim to provide a platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology. It also offers opportunities for those who are interested in investing and collaboration in the semiconductor industry in Asia, particularly in China. We are soliciting papers from authors around the world on all aspects of semiconductor technology and manufacturing, including device engineering and technology, Front-End-of-Line (FEOL), Back-End-of-Line (BEOL), packaging, metrology and testing, as well as emerging semiconductor technologies and IC design.
Topics to be addressed at CSTIC 2023 include, but are not limited to the following:
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post-Polish Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
| Conference Questions | Sponsorship Contact | ||
| April Peng, SEMI China | Cheryl Qiu, SEMI China | Xianbo Sun, SEMI China | |
| Email: [email protected] | Tel: 86.21.6027.8552 | Tel: 86.21.6027.8569 | |
| Fax: 86.21.6027.8511 | Fax: 86.21.6027.8511 | ||
| Email: [email protected] | Email: [email protected] | ||