Symposium II: Lithography and Patterning
Symposium Committee
Symposium II: Lithography and Patterning
Resist Material and Processing
• Resist fundamentals
• Resist Stochastic effects
• Cost effective photoresist for volume production
• High performance photoresist
• Resist adhesion control for advanced process
• Advanced processing technology
Optical & EUV lithography
• CD and overlay control in process
• Immersion Lithography
• Defectivity control
• Anti-reflection schemes for advanced process
• Advanced optical exposure tools and light source
• Mask Toporgaphy effects
Computational Lithography
• Cost effective RET techniques
• Advanced optical imaging modeling
• Advanced RET as in EUV, multiple patterning and polarization application
• Advanced OPC & Source mask optimization
• DFM solutions and Design Technology Co-optimization for 28nm node and beyond
• Applying Machine Learning and Artificial Intelligence in Computational Lithography
Emergent Technology
• Directed Self-assembly
• Direct-write E-beam and parallel E-beam
• Nanoimprint
• Other novel lithographic techniques and Complementary lithography
Metrology and inspection
• Overlay, CD, defect, and topography metrology
• Integrated metrology
• Advanced process control
• Computational Metrology and Inspection
• LWR/LER characterization
Mask technology
• Cost effective reticles for 28nm node and below
• Mask Defect inspection, repair and CD control
• Advanced mask blank and EMF effect
• MPC for mask for 28nm node and beyond
Symposium Committee
|
Dr. Linyong (Leo) Pang Chair |
D2S Inc. |
|
Dr. Kafai LAI Co-Chair |
IBM, USA |
|
Dr. Qiang Wu Co-Chair |
ICRD |
|
Dr. George Lu Co-Chair |
Dow Dupont |
|
Prof. Yayi Wei Member |
IMECAS, China |
|
Mr. Xiaoming Ma Member |
Dow Chemical |
|
Dr. Zhimin Zhu Member |
Brewer Science, USA |
|
Dr. Zhibiao Mao Member |
Nata Chemicals |
|
Mr. Motokatsu.Imai Member |
今井 基勝, 水戸工業（株） |
|
Dr. Hai Deng Member |
Fudan University |
|
Dr. Shiyuan Liu Member |
Huazhong University of Science and Technology , China |
|
Dr. Wang Yueh Member |
Intel, USA |
|
Dr. Ban-Ching Ho Member |
Nissan Chemicals |
|
Dr.Yuyang Sun Member |
Mentor Graphics,USA |
|
Dr. David H. Wei Member |
ASML Brion |
|
Dr. Chris Progler Member |
Photronics |
|
Dr. Weimin Gao Member |
ASML TDC |
|
|
|
|
Mr. Wenzhan Zhou Member |
Shanghai Huali Microelectronics Corp |
Symposium II: Lithography and Patterning
Resist Material and Processing
• Resist fundamentals
• Resist Stochastic effects
• Cost effective photoresist for volume production
• High performance photoresist
• Resist adhesion control for advanced process
• Advanced processing technology
Optical & EUV lithography
• CD and overlay control in process
• Immersion Lithography
• Defectivity control
• Anti-reflection schemes for advanced process
• Advanced optical exposure tools and light source
• Mask Toporgaphy effects
Computational Lithography
• Cost effective RET techniques
• Advanced optical imaging modeling
• Advanced RET as in EUV, multiple patterning and polarization application
• Advanced OPC & Source mask optimization
• DFM solutions and Design Technology Co-optimization for 28nm node and beyond
• Applying Machine Learning and Artificial Intelligence in Computational Lithography
Emergent Technology
• Directed Self-assembly
• Direct-write E-beam and parallel E-beam
• Nanoimprint
• Other novel lithographic techniques and Complementary lithography
Metrology and inspection
• Overlay, CD, defect, and topography metrology
• Integrated metrology
• Advanced process control
• Computational Metrology and Inspection
• LWR/LER characterization
Mask technology
• Cost effective reticles for 28nm node and below
• Mask Defect inspection, repair and CD control
• Advanced mask blank and EMF effect
• MPC for mask for 28nm node and beyond