Heterogeneous Integration (Advanced Packaging) International Conference: AI & CPO
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Date:
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Tuesday, March 24, 2026
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Time:
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09:30-17:25
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Venue:
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Pudong Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
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Chinese and English Simultaneous Interpretation will be provided
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Attendee Registration Previous Review
Registration Deadline Notice:
Due to overwhelming demand, registration for this forum has reached maximum capacity. The online registration channel will be officially closed on March 18.
As AI computing power doubles every 3.5 months and HPC data center bandwidth needs exceed 100Tbps, traditional packaging can no longer meet next-gen industrial demands—making Heterogeneous Integration (HI) an inevitable choice. As a core forum of SEMICON China 2026, this summit, themed " Powering AI Innovations with Heterogeneous Integration Technology ", tackles the mismatch between demands and technologies head-on.
The 2026 global advanced packaging market will top $70 billion, with its growth rooted in technology’s precise response to demand: Chiplet and UCIe standards speed up to break computing bottlenecks; Co-Packaged Optics (CPO) and optical engines solve bandwidth congestion; GaN packaging iterates for automotive reliability; and HBM-HPC collaboration plus microchannel cooling breakthroughs address high-density computing challenges in data centers.
Bringing together global industry leaders and experts, the forum analyzes the inevitable path from demand pain points to technical solutions, and builds a platform for supply-demand communication and innovation collaboration.
SPONSORS
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Agenda / 议程
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09:30-09:40
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Moderator 主持人
凌峰，芯和半导体科技（上海）股份有限公司，创始人、董事长
Feng Ling, Founder & Chairman, Xpeedic Co. Ltd
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Welcome speech 欢迎致辞
冯莉，SEMI中国总裁
Lily Feng, President, SEMI China
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Keynote: Powering AI Innovation with HI
主旨演讲：异质异构集成赋能 AI 创新
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09:40-10:05
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2.5D 异构集成先进封装解决方案及发展趋势
Advanced Packaging Solutions and Trends in 2.5D Heterogeneous Integration
郭一凡，宏茂微电子， 首席技术专家
Yifan Guo, Chief Technical Fellow, Unimos
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10:05-10:30
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透过先进封装和能源效率提升人工智慧效能
Scaling AI Performance Through Advanced Packaging and Power Efficiency
张欣晴，日月光半导体，研发中心副总经理
Dr. Harrison Chang, VP, Corp. R&D, ASE
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10:30-10:55
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硅光子学和CPO的现状——产业展望与未来发展方向
Status of Silicon Photonics and CPO – Industry Perspective and Path Forward
卢国强，新加坡AMF，首席技术官
Guo-Qiang Lo, CTO, Advanced Micro-Foundry PTE LTD, Singapore
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10:55-11:20
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混合键合重塑AI算力边界
Hybrid Bonding: Reshaping the Future of AI Computing
郭晓超，武汉新芯集成电路股份有限公司，代工业务处市场总监
Flora Guo, Marketing Director, XMC
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11:20-11:45
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从UCIe到UALink：连接AI基础设施的未来
From UCIe to UALink: Wiring the Future of AI Infrastructure
陈健，阿里云计算有限公司，首席云服务器架构师，资深总监
Jian Chen, Chief Architect of Cloud Server Infrastructure, Senior Director, Alibaba Cloud
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11:45-12:10
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先进封装和Chiplets
Advanced Package and Chiplets
周妙文，安靠科技，大中华区-市场及销售，资深业务总监
Wendy Zhou, Senior Director, Sales & Marketing Greater China, Amkor Technology, Inc.
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Session 1: CPO & Silicon Photonics
专题演讲：CPO和硅光
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Moderator 主持人
姚力，封装设计工程部部长，紫光展锐
Li Yao, Head of Packaging Design Engineering Department, Unisoc
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13:30-13:50
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共封装光学器件与硅光子学：人工智能和高性能计算的新骨干
Co-Packaged Optics and Silicon Photonics: The New Backbone of AI and HPC
Dr. Patrick Poa，新加坡微电子研究院，总监
Dr. Patrick Poa, Director, Institute of Microelectronics (IME)
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13:50-14:10
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为何是现在的 CPO：硅光如何成为下一代 AI 基础设施的带宽引擎
Why CPO Now: Silicon Photonics as the Bandwidth Engine for Next-Gen AI Infrastructure
何晓溪，IDTechEx，首席研究顾问
Dr. Xiaoxi He, Principal Research Associate, IDTechEx
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14:10-14:30
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通过先进制造解决方案赋能硅光子技术
Enabling Silicon Photonics with Advanced Fabrication Solutions
David Haynes，泛林集团，特色工艺及战略营销副总裁
David Haynes, Vice President of Specialty Technologies and Strategic Marketing, Lam Research Corporation
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14:30-14:50
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在先进封装解决方案中实现精准与高效的关键要素
Key to Thrive Precision and Efficiency in Advanced Packaging Solutions
杨刚，通快中国区总裁
Dr. Gang Yang, President, TRUMPF China
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14:50-15:00
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Break
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Session 2: HBM & AI Packaging
专题演讲：HBM与AI算力封装
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Moderator 主持人
符会利，阿里巴巴，平头哥高级副总裁
Dr. Huili Fu, Senior VP of T-Head, Alibaba
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15:00-15:20
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面向算力芯片封装的玻璃基板技术进展与挑战
Progress and challenges of advanced glass core substrate for AI Chip packaging
于大全，厦门大学特聘教授，厦门云天半导体科技有限公司董事长
Daquan Yu, Distinguished Professor of Xiamen University, CEO of Xiamen Sky Semiconductor Co., Ltd.
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15:20-15:40
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最大化良率与性能：面向AI与HPC芯片的晶圆针测与先进封装解决方案
Maximizing Yield & Performance in Wafer Probing and Advanced Packaging Solutions for AI and HPC chips
Laurent Giai-Miniet，ERS electronic GmbH，首席执行官
Laurent Giai-Miniet, CEO, ERS electronic GmbH
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15:40-16:00
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下一代 AI 封装的挑战
Challenges for Next Generation AI Packages
Jan Vardaman, TechSearch International, Inc. 创始人兼总裁
Jan Vardaman, President of TechSearch International, Inc.
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16:00-16:20
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先进封装设备赋能异构集成新生态
Advanced Packaging Equipment: Eabling the Future of Heterogeneous Integration
耿波，北京北方华创微电子装备有限公司，POP事业单元总经理
Geng Bo, General Manager of the POP Business Unit, Beijing NAURA Microelectronics Equipment Co., Ltd.
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16:20-16:40
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技术融合赋能AI时代
Technology & Fusion, enabling AI innovation
松村贤人，TEL， 全球销售事业部高级总监
Norito Matsumura, Senior Director of Global Sales Division, Tokyo Electron
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16:40-17:00
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晶圆键合和先进载体的解决方案助力下一代人工智能(AI)设备实现全新集成流程
Enabling New Integration Flows Through Wafer Bonding and Advanced Carrier Solutions for Next Gen AI Devices
Dr. Ksenija Varga，EV Group(EVG)，业务拓展经理
Dr. Ksenija Varga, Business Development Manager, EV Group (EVG)
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17:00-17:20
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X射线硬件与AI软件融合：重构HBM封装三维检测
X-ray hardware meets AI software：rapid 3D inspection technology for HBM advance packaging
Isabella Drolz，Comet，市场营销与产品战略副总裁
Isabella Drolz, Global Head Division IXS & VP Commercial, Comet
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17:20-17:25
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Lucky Draw / 幸运抽奖，抽取iPhone大奖
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