Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)
| Date: | Tuesday, March 24, 2026 |
| Time: | 09:30-17:00 |
| Venue: | Pudong Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai |
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Chinese and English Simultaneous Interpretation will be provided |
Attendee Registration Previous Review
As AI computing power doubles every 3.5 months and HPC data center bandwidth needs exceed 100Tbps, traditional packaging can no longer meet next-gen industrial demands—making Heterogeneous Integration (HI) an inevitable choice. As a core forum of SEMICON China 2026, this summit, themed " Powering AI Innovations with Heterogeneous Integration Technology ", tackles the mismatch between demands and technologies head-on.The 2026 global advanced packaging market will top $70 billion, with its growth rooted in technology’s precise response to demand: Chiplet and UCIe standards speed up to break computing bottlenecks; Co-Packaged Optics (CPO) and optical engines solve bandwidth congestion; GaN packaging iterates for automotive reliability; and HBM-HPC collaboration plus microchannel cooling breakthroughs address high-density computing challenges in data centers.
Bringing together global industry leaders and experts, the forum analyzes the inevitable path from demand pain points to technical solutions, and builds a platform for supply-demand communication and innovation collaboration.
| Agenda / 议程 | |
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Welcome speech 欢迎致辞 冯莉，SEMI中国总裁 Lily Feng, President, SEMI China |
| 09:30-12:00 |
Keynote: Powering AI Innovation with HI 主旨演讲：异质异构集成赋能 AI 创新 |
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Keynote Speaker: 郭一凡，易卜半导体，常务副总裁 Yifan Guo, Yibu Semiconductor, EVP |
| ASE | |
| TBD | |
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郭晓超，武汉新芯集成电路股份有限公司，代工业务处市场总监 Flora Guo, XMC, Marketing Director |
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陈健，阿里云智能首席云服务器架构师，高级工程总监 Jian Chen, Alibaba Cloud, Chief Architect of Cloud Server Infrastructure, Senior Director of Engineering |
| TBD | |
| 13:30-15:30 |
Session 1: CPO & Silicon Photonics 专题演讲：CPO和硅光 |
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刘宏钧，苏州天孚光通信股份有限公司，子公司总经理 (TBD) Russell Liu, Suzhou TFC Optical Communication Co.,Ltd., Division GM |
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| TBD | |
| Dr. Xiaoxi He, Research Director, IDTechEx | |
| 15:40-17:30 |
Session 2: AI Packaging Ecosystem & Driving Technology 专题演讲：AI封装生态&技术驱动 |
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于大全，厦门大学特聘教授，厦门云天半导体科技有限公司董事长 Daquan Yu, Distinguished Professor of Xiamen University, CEO of Xiamen Sky Semiconductor Co., Ltd. |
| COMET | |
| TEL | |
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Jan Vardaman，TechSearch International，创始人兼总裁 Jan Vardaman, President, TechSearch International |
| TBD | |
CONTACT US:
Hannah zhao
021-60278571
[email protected]