Design Innovation Forum: AI Intelligent Applications and Automotive IC's
| Date: | Thursday, March 26, 2026 |
| Time: | 15:30-17:30 |
| Venue: | Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai |
|
Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
Artificial intelligence is rapidly reshaping the paradigms of integrated circuit (IC) design. From large-model training to edge inference, AI workloads demand unprecedented levels of compute efficiency, power optimization, and architectural flexibility—spurring innovations such as domain-specific architecture, heterogeneous integration, and AI-enhanced EDA flows. According to Yole, the global AI chip market is projected to exceed $100 billion by 2026, with design innovation at the core of competitive differentiation.This forum brings together world-class chip leaders and experts to explore the future ecosystem of intelligent ICs. It serves as a vital platform for international dialogue on how AI is reshaping the future of chip design—and how the global industry can co-innovate to meet emerging technological and market demands.
| Agenda / 议程 | |
| 15:00-15:30 | Registration 注册 |
|
Opening Remark 欢迎致辞 Lily Feng, President, SEMI China 冯莉，SEMI中国总裁 |
|
Moderator / 主持人 Dr. Xiaoning Qi, Vice President, Alibaba Group 戚肖宁，阿里巴巴集团副总裁 |
| TBD | |
|
Fisher Zhang, General Manager, Complex SOC BU, Asia, Teradyne 张震宇，泰瑞达Complex SOC 事业部亚太区总经理 |
| TBD | |
|
* 议程以最终版为准 * Please refer to the final version of Agenda. |
|