Design Innovation Forum: AI Intelligent Applications and Automotive IC's


Date: Thursday, March 26, 2026
Time: 15:30-17:25
Venue: Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

Attendee Registration   Previous Review

Artificial intelligence is rapidly reshaping the paradigms of integrated circuit (IC) design. From large-model training to edge inference, AI workloads demand unprecedented levels of compute efficiency, power optimization, and architectural flexibility—spurring innovations such as domain-specific architecture, heterogeneous integration, and AI-enhanced EDA flows. According to Yole, the global AI chip market is projected to exceed $100 billion by 2026, with design innovation at the core of competitive differentiation.

This forum brings together world-class chip leaders and experts to explore the future ecosystem of intelligent ICs. It serves as a vital platform for international dialogue on how AI is reshaping the future of chip design—and how the global industry can co-innovate to meet emerging technological and market demands.

Organizers
         
   
         

Sponsors
         
   
         

Agenda / 议程
   
15:00-15:30 Registration 注册
   
15:30-15:40
Welcome Speech 欢迎致辞
Lily Feng, President, SEMI China
冯莉，SEMI中国总裁
   
15:40-15:45
Opening Remark 开幕致辞
Moderator / 主持人
Dr. Xiaoning Qi, Vice President, Alibaba Group
戚肖宁，阿里巴巴集团副总裁
   
15:45-16:05
XuanTie RISC-V-Pioneering Architectures for the Future of Intelligent Computing
玄铁RISC-V—创新架构推动智算未来
ChunQiang Li, RISC-V Software Vice President, Alibaba DAMO Academy
李春强，阿里巴巴达摩院RISC-V 软件副总裁
   
16:05-16:25
Qing Chu, Chairman/CEO, NPC Tech
楚庆，智识神工董事长、首席执行官
   
16:25-16:45
 Scaling Intelligence: a platform led approach to scale AI-Driven analytics across the semiconductor ecosystem
智能规模化：平台驱动，赋能半导体全生态AI分析规模化落地
Dr. Michael Yu, VP of Solutions Engineering & Asia Enterprise, PDF Solutions
俞冠源，PDF Solutions亚太区副总裁
   
16:45-17:05
From Design to Test: How AI Chips Drive New DFT, Thermal, and Quality Requirements and Solutions
从设计到测试：AI芯片带来的挑战与解决方案
Fisher Zhang, Director & Auto Compute Business Unit Manager, Teradyne
张震宇，泰瑞达全球汽车与计算事业部总监
   
17:05-17:25
Wei-Han Lien, Sr. Fellow, Architecture, Tenstorrent
练维汉，Tenstorrent首席架构师
   
* 议程以最终版为准
* The agenda is subject to being updated.
   

CONTACT US:
Hannah Zhao 021-60278571 [email protected]