IC manufacturing Supply Chain International Conference - Wafer Process and Equipment
| Date: | Thursday, March 26, 2026 |
| Time: | 09:00-12:00 |
| Venue: | Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review Previous Review: Advanced Manufacturing
At the intersection where Moore's Law approaches physical limits and computing power demand explodes, IC manufacturing faces unprecedented challenges: How can deep equipment datafication break through yield bottlenecks? How can advanced predictive analytics mitigate the risks of unscheduled downtime? And under the constraints of complex process nodes, how can production efficiency achieve ultimate leaps?This Equipment and Process Forum will focus on the deep synergy of "Equipment + Data + Process." We will delve into:
1. Data-Driven Yield Management Innovation
Moving beyond traditional sampling inspection to holistic data analysis, utilizing advanced algorithmic models to precisely locate defect root causes, achieving yield "transparency" and "predictability."
2. The Paradigm Shift in Equipment Maintenance
Moving away from reactive repairs and embracing a predictive maintenance ecosystem based on Digital Twin technology. This maximizes Overall Equipment Effectiveness (OEE) and ensures 7x24-hour stable operation of production lines.
3. The Intelligent Co-Evolution of Process and Equipment
Facing the stringent requirements of advanced nodes and advanced packaging, we will explore how equipment can perfectly adapt to refined process windows through adaptive control and real-time feedback mechanisms.
We cordially invite global leaders in IC manufacturing, equipment and material suppliers, data analysis experts, and process R&D leaders to share cutting-edge insights and practical implementations. Here, you will gain insight into viable pathways for intelligent supply chain upgrades, explore a new ecosystem of efficient collaboration, and jointly drive the high-quality development of semiconductor manufacturing.
SPONSORS
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| Agenda / 议程 | |
| 09:00-09:25 | Registration 来宾登记 |
09:25-09:30
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Opening Remarks / 开幕致辞 Lily Feng, President, SEMI China 冯莉，SEMI中国 总裁 |
| 09:30-09:50 |
Beijing NAURA Microelectronics Equipment Co., Ltd. 北京北方华创微电子装备有限公司 |
| 09:50-10:10 |
Applied Materials 应用材料公司 |
10:10-10:30
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Johnson Cheng 程全森 VP, Hwatsing Technology Co.,Ltd. 副总经理 华海清科股份有限公司 |
| 10:30-10:50 |
Tokyo Electron Limited TEL |
10:50-11:10
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The Challenges and opportunity about the Electro-chemical plating technology for chips 3D integration 三维芯片集成领域电镀技术的挑战和机遇 Zhaowei Jia 贾照伟 Process Vice President, ACM Research(Shanghai), Inc. 工艺副总裁 盛美半导体设备（上海）股份有限公司 |
11:10-11:30
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Chen Xianglong 陈祥龙 VP，Qingdao SRI Intellectual Technology Co., Ltd. 副总 青岛思锐智能科技股份有限公司 |
11:30-11:50
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Xu Kaidong 许开东 博士 Chairman&CEO, Jiangsu Leuven Instruments Co., Ltd 董事长兼CEO，江苏鲁汶仪器股份有限公司 |
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* 议程以最终版为准 * The agenda is subject to being updated. |
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