IC manufacturing Supply Chain International Conference - Wafer Process and Equipment

IC manufacturing Supply Chain International Conference - Wafer Process and Equipment

Date:	Thursday, March 26, 2026
Time:	09:00-12:00
Venue:	Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai

Simultaneous Interpretation will be provided.

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In the field of IC manufacturing, the performance of equipment and processes directly determine efficiency and product quality. This forum will showcase innovative manufacturing equipment technologies and explore how equipments bring revolutionary changes to IC manufacturing through optimized design, increased production efficiency, enhanced defect detection and routine maintenance, among other means. At the same time, the forum will also focus on how equipment can better adapt to process requirements to achieve higher production efficiency and product quality. With equipment and processes as its main content, this forum aims to promote the intelligent, efficient, and collaborative development of the IC manufacturing supply chain.

Furthermore, the forum will invite leading companies and experts from various segments of the IC manufacturing supply chain to share their latest research findings and practical experiences in the field of equipment and processes. These presentations will cover various aspects, ranging from component supply, equipment manufacturing, system upgrades, to process optimization, providing participants with a comprehensive understanding of the IC manufacturing supply chain.

As one of the largest semiconductor exhibitions globally, SEMICON China's IC manufacturing forum boasts a rich history and extensive influence. Over the years, the forum has attracted a diverse audience from FAB representatives, process and equipment experts, scientific research institution personnel, and investment experts from around the world. The "International Forum on IC Manufacturing Supply Chain - Focus on Equipment and Processes" in 2025 is expected to attract over 500 professional attendees to jointly discuss the future development of the IC manufacturing supply chain.