IC manufacturing Supply Chain International Conference - Wafer Process and Equipment
| Date: | Thursday, March 26, 2026 |
| Time: | 09:00-12:00 |
| Venue: | Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review Previous Review: Advanced Manufacturing
In the field of IC manufacturing, the performance of equipment and processes directly determine efficiency and product quality. This forum will showcase innovative manufacturing equipment technologies and explore how equipments bring revolutionary changes to IC manufacturing through optimized design, increased production efficiency, enhanced defect detection and routine maintenance, among other means. At the same time, the forum will also focus on how equipment can better adapt to process requirements to achieve higher production efficiency and product quality. With equipment and processes as its main content, this forum aims to promote the intelligent, efficient, and collaborative development of the IC manufacturing supply chain.Furthermore, the forum will invite leading companies and experts from various segments of the IC manufacturing supply chain to share their latest research findings and practical experiences in the field of equipment and processes. These presentations will cover various aspects, ranging from component supply, equipment manufacturing, system upgrades, to process optimization, providing participants with a comprehensive understanding of the IC manufacturing supply chain.
As one of the largest semiconductor exhibitions globally, SEMICON China's IC manufacturing forum boasts a rich history and extensive influence. Over the years, the forum has attracted a diverse audience from FAB representatives, process and equipment experts, scientific research institution personnel, and investment experts from around the world. The "IC manufacturing Supply Chain International Conference - Wafer Process and Equipment" in 2026 is expected to attract over 500 professional attendees to jointly discuss the future development of the IC manufacturing supply chain.
| Agenda / 议程 | |
| 09:00-09:25 | Registration 来宾登记 |
09:25-09:30
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Opening Remarks / 开幕致辞 Lily Feng, President, SEMI China 冯莉，SEMI中国 总裁 |
| 09:30-09:50 |
Beijing NAURA Microelectronics Equipment Co., Ltd. 北京北方华创微电子装备有限公司 |
| 09:50-10:10 |
Lam Research 泛林集团 |
| 10:10-10:30 |
Applied Materials 应用材料公司 |
| 10:30-10:50 |
ACM Research(Shanghai), Inc. 盛美半导体设备（上海）股份有限公司 |
| 10:50-11:10 |
Tokyo Electron Limited TEL |
11:10-11:30
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Xu Kaidong 许开东 博士 Chairman&CEO, Jiangsu Leuven Instruments Co., Ltd 董事长兼CEO，江苏鲁汶仪器股份有限公司 |
| 11:30-11:50 |
CHANGSHA BRANCH OF BEIJING SEMICORE ZKX ELECTRONIC EQUIPMENT CO.,LTD 北京烁科中科信电子装备有限公司 |
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* 议程以最终版为准 * Please refer to the final version of Agenda. |
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