Green High-Tech Facility International Innovation Forum
| Date: | Friday, March 27, 2026 |
| Time: | 09:30-12:35 |
| Venue: | Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
In the era of AI, coupled with the convergence of industries such as automotive electrification and digitalization, the semiconductor industry is undergoing a future-oriented capacity expansion. According to the global semiconductor fab (Fab) forecast report by SEMI, 18 new wafer factory construction projects had been initiated by 2025. The new project includes: three 200-millimeter and fifteen 300- millimeter wafer facility. Most of them are expected to start operating between 2026 and 2027. Meanwhile, the global spending on 300mm wafer fabrication equipment for the period from 2026 to 2028 is projected to reach as high as 374 billion US dollars. This means that, the current decision will directly determine the long-term competitiveness and environmental compliance of the massive assets that will be intensively produced in the coming years. Therefore, promote the transformation to “Semiconductor green plant operations”, it has escalated from an environmental protection issue to a strategic investment that concerns the core efficiency of future factories.As the "energy hub" and "environment guardian" of semiconductor production, the plant management system accounts for nearly 60% of the energy consumption and 80% of the water consumption in the factory, the depth and breadth of its green transformation, it is directly related to the sustainable development capacity of the semiconductor industry chain and the fulfillment of global carbon footprint commitments. The semiconductor factory achieves energy consumption reduction, pollution emission reduction, resource recycling and safe operation of the plant through technological and management means, a comprehensive solution aimed at reducing the high energy consumption and water usage characteristics of semiconductor manufacturing and minimizing its environmental impact.
This forum aims to establish a cross-disciplinary communication platform for environmental protection technologies、energy management in the global semiconductor industry, gather the strength of all parties involved in industry、academia、research and application, jointly breaking through technical bottlenecks、sharing practical experiences、and building a cooperative ecosystem, promote green factory management from "concept innovation" to "scale implementation", injecting the core driving force for a low-carbon future of the global semiconductor industry.
Diamond Sponsor：
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| Agenda / 议程 | |
| 09:00-09:30 | Registration 会议登记注册 |
09:30-09:35
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Opening Remarks/开幕致辞 Lily Feng, President, SEMI China 冯莉，SEMI 中国总裁 |
09:35-09:40
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Welcome Remarks/欢迎致辞 Ron R.T.Horng 洪荣聪 Vice President/Chief Environment Office,Foxconn Technology Group 富士康（鸿海）科技集团，环保长/副总经理 |
| 09:40-10:05 |
BOE Technology Group Co., Ltd 京东方科技集团股份有限公司 |
10:05-10:30
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Intelligent Energy: The AI-Powered Energy Efficiency Revolution in the Electronics Industry 智算能源：电子行业AI能效革命 Sunny JIN，Schneider Electric Digital Energy China，DPEC Director 靳艳萍， 施耐德电气（中国）有限公司，电气数字能效业务数字化交付团队总监 |
10:30-10:55
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Comprehensive solution for green smart factory, Assist in the high-quality development of advanced electronic manufacturing industry 绿色智能工厂全过程解决方案 助力先进电子制造业高质量发展 Guangming Yang 杨光明 CTO, China Electronics Engineering Design Institute Co., Ltd 首席技术官，中国电子工程设计院股份有限公司 |
| 10:55-11:20 |
Honeywell Building Automation 霍尼韦尔智能建筑科技集团 |
| 11:20-11:45 |
Linde (Shanghai) Specialty Gas Co., Ltd 林德（上海）特种气体有限公司 |
| 11:45-12:10 |
数字化低碳化助力半导体企业绿色转型 Siemens limited China 西门子（中国）有限公司 |
| 12:10-12:35 |
Closing Keynote/闭幕演讲 TBD |
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* 议程以最终版为准 * The agenda is subject to being updated. |
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联系我们：
Heidi Chen 021-60278561 [email protected]