Green High-Tech Facility International Innovation Forum
| Date: | Friday, March 27, 2026 |
| Time: | 09:30-12:35 |
| Venue: | Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
The report 《300mm Fab Outlook Report to 2027》released from SEMI points out，from 2025 to 2027, global spending on 300mm wafer fab equipment is expected to reach a record $400 billion, this is mainly benefit from the strong demand for artificial intelligence and related semiconductor components. In the course of this year, witnessed the wide application of silicon carbide (SiC) power devices in electric vehicles、innovative application of Chiplet technology in high-performance AI chip design、and the rapid rise of RISC-V architecture in automotive electronics and other fields. Besides, fourth generation semiconductor materials------ such as gallium oxide (Ga2O3) and aluminum nitride (AlN) are also beginning to emerge, shows great potential. According to SEMI's report, it will grow a further 24% by 2025, it exceeded $100 billion for the first time, achieve $123.2 billion. This growth is particularly significant, driven by the field of artificial intelligence, demand for Gpus and high bandwidth memory (HBM), further promote the prosperity of the semiconductor market.Semiconductor production processes typically have high energy consumption、high water consumption、characteristics of high frequency production and discharge of toxic and harmful pollutants. It mainly includes cleanroom system、mechanical system、specialty gas and bulk gas、water treatment system、exhaust system、vacuum system、power supply& automation system、construction、EHS system control and energy saving. This forum provides a exchange experience for global semiconductor companies、explore a platform for strategy resolution. Hope that through the holding of this forum to strengthen the semiconductor industry chain upstream and downstream synergy development, addressing environmental pollution (waste water, waste gas, waste) during semiconductor production, to realize the green and sustainable operation of semiconductor companies, and jointly promote the green transformation and upgrading of the industry.
SPONSORS
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| Agenda / 议程 | |
| 09:00-09:30 | Registration 会议登记注册 |
09:30-09:35
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Opening Remarks/开幕致辞 Lily Feng, President, SEMI China 冯莉，SEMI 中国总裁 |
09:35-09:40
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Welcome Remarks/欢迎致辞 Ron R.T.Horng 洪荣聪 Vice President/Chief Environment Office,Foxconn Technology Group 富士康（鸿海）科技集团，环保长/副总经理 |
| 09:40-10:05 |
BOE Technology Group Co., Ltd 京东方科技集团股份有限公司 |
| 10:05-10:30 |
Intelligent Energy: The AI-Powered Energy Efficiency Revolution in the Electronics Industry 智算能源：电子行业AI能效革命 Schneider Electric 施耐德电气（中国）有限公司 |
| 10:30-10:55 |
杨光明 CTO, China Electronics Engineering Design Institute Co., Ltd 首席技术官，中国电子工程设计院股份有限公司 |
| 10:55-11:20 |
Honeywell Building Automation 霍尼韦尔智能建筑科技集团 |
| 11:20-11:45 |
Linde (Shanghai) Specialty Gas Co., Ltd 林德（上海）特种气体有限公司 |
| 11:45-12:10 |
数字化低碳化助力半导体企业绿色转型 Siemens limited China 西门子（中国）有限公司 |
| 12:10-12:35 |
Closing Keynote/闭幕演讲 TBD |
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* 议程以最终版为准 * Please refer to the final version of Agenda. |
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联系我们：
Heidi Chen 021-60278561 [email protected]