Smart Manufacturing Forum - Factory of the Future


Date: Thursday, March 26, 2026
Time: 13:30-17:40
Venue: Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

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Expanding from basic data to a plant-wide system is a monumental engineering feat. This system should be dynamic, continuously upgraded and innovative, possessing a certain degree of "thinking capability" to provide production planning and recommendations. It aims to facilitate the transition from a "smart factory" to a "thinking factory."

The integration of AI injects stronger momentum into smart factories. However, embedding AI requires factories to establish essential regulatory processes beyond transforming their production systems. These processes must be consistently implemented as a long-term strategic goal, ultimately fostering innovation and resilience in the semiconductor supply chain.

As mentioned at the 2025 Forum, the smart factory of the future is operated by multiple actors working together, including: pressure resistant supply chain, logistics automation, software visualization, factory digitization, control automation, smart decision-making, etc.

Beyond the discussions held at the March 2025 Forum, a new Smart Manufacturing Committee Working Group has been established. Under the leadership of this working group, a series of activities have been organized. At the upcoming March 2026 Forum, not only will the working group's achievements be showcased, but industry experts will also unveil the latest products and share insights into future trends.

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Agenda / 议程
   
13:30-13:35
 Welcome Remark / 欢迎致辞
Lily Feng, President, SEMI China
冯莉，SEMI 中国总裁
   
13:35-13:40
 Welcome Remark / 欢迎致辞
Raymond WEI，魏峥颖
Chairman of SEMI China Smart Manufacturing Committee
SEMI China智能制造委员会理事长
   
13:40-13:55 奖项颁发——“AI+Factory 2026 Award”

AI 应用奖
获奖项目：离子注入装备AI智能调优系统（AI Tune Beam）
获奖单位：埃克斯控股（北京）有限公司

自动化系统奖
获奖项目：End to End Lights Out Factory
获奖单位：晟碟半导体上海有限公司

良率提升奖
获奖项目：AI Agents驱动良率分析与预测的实践
获奖单位：合肥晶合集成电路股份有限公司+深圳智现未来工业软件有限公司

行业贡献奖
获奖项目：全自动生产线CIM解决方案
获奖单位：上扬软件（上海）有限公司
   
13:55-14:20
 CK Chin，陈治强
Managing Director, SanDisk Semiconductor(Shanghai) Co.,Ltd
总经理，晟碟半导体（上海）有限公司
   
14:20-14:45
 Bin Liu，刘斌
CTO，IKAS Industries Co., Ltd.
首席技术官，埃克斯工业有限公司
   
14:45-15:10
 Extreme Computing, Liquid Cooling : H3C High-Density Cabinet Computing system Empower Smart Factory in the Semiconductor Industry
极致算力•液冷护航 新华三高密整机柜算力系统赋能半导体未来工厂智变升级
Hongli Zhou，周弘立
Vice President of Cloud, Computing and Storage Product Line, New H3C Group
云与计算存储产品线副总裁，新华三集团
   
15:10-15:35
 从“+AI”到“AI+”：开启半导体智能制造新阶段——数据驱动决策，智能重写流程
Andrew Guan，管健
Chairman & CEO, Shenzhen FutureFab.AI Software Inc.
董事长&CEO，深圳智现未来工业软件有限公司
   
15:35-16:00
 Lawrence Fu，付斌
CEO & CTO，JIANGSU TOTA INTELLIGENT TECHNOLOGY CO.,LTD.
CEO & CTO，江苏道达智能科技有限公司
   
16:00-17:25 Panel Discussion：AI+Factory
   
Chiayen Li，黎家俨
Head of AI Research and Development，Nexchip Semiconductor
研发AI总负责人，合肥晶合集成电路股份有限公司
   
Dr. LU LINGZHI，吕凌志
Chairman & CEO MANAGING DIRECTOR, FA Software (Shanghai) Co., Ltd
董事长兼CEO MANAGING DIRECTOR，上扬软件 (上海) 有限公司
   
Ye Ying，叶莹
Chairman & CEO, Shanghai GoNa Semiconductor Technology Co., Ltd.
董事长&首席执行官，上海果纳半导体技术有限公司
   
Felix He，何少平
Vice President，Youibot Robotics
副总裁，优艾智合机器人
   
  TBD
   
17:25-17:40
 Closing remark / 闭幕致辞
Chiayen Li，黎家俨
Head of AI Research and Development，Nexchip Semiconductor
研发AI总负责人，合肥晶合集成电路股份有限公司
   
* The agenda is subject to being updated.
* 会议议程更新中，以会议现场资料为准。
   

CONTACT US:
Caroline Zhu 021-60278556 [email protected]