Advanced Material International Conference
| Date: | Wednesday, March 25, 2026 |
| Time: | 09:00-12:00 |
| Venue: | Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
In the era of advanced computing, AI, and 3D heterogeneous integration, materials innovation sits at the heart of semiconductor progress. As the industry pushes toward smaller nodes, higher performance-per-watt, and complex chiplet architectures, breakthroughs are needed not only in device design but across the entire materials ecosystem—from front-end process enablers to advanced packaging interfaces.According to SEMI, the global semiconductor materials market is on track to surpass $80 billion by 2027, driven by demand for high-purity, high-reliability materials in logic, memory, and advanced packaging. This growth underscores the strategic importance of securing resilient, diversified, and sustainable material supply chains.
The conference this year brings together global experts and leaders, and ecosystem partners to exchange insights, explore collaborative models, and jointly shape the future roadmap of semiconductor materials.
| Agenda / 议程 | |
| 09:00-09:30 | Registration 来宾登记 |
09:30-09:50
|
Opening Remark 欢迎致辞 Lily Feng, President, SEMI China 冯莉，SEMI中国总裁 |
09:50-10:15
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Dr. Wei Li, EVP of NSIG, Chairman of ZINGSEMI and SIMGUI 李炜，上海硅产业集团执行副总裁，上海新昇及新傲科技董事长 |
| 10:15-10:40 |
Dr. Rong Sun, Director of Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology，Chinese Academy of Sciences 孙蓉，中国科学院深圳先进技术研究院 先进材料科学与工程研究所所长 |
| 10:40-11:05 |
Shanghai Sinyang Semiconductor Materials Co., Ltd 上海新阳半导体材料股份有限公司 |
| 11:05-11:30 | SCHOTT AG肖特 |
| 11:30-11:55 | Slot TBD |
CONTACT US:
Hannah zhao 021-60278571 [email protected]