Advanced Material International Conference
| Date: | Wednesday, March 25, 2026 |
| Time: | 09:30-12:10 |
| Venue: | Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
Attendee Registration Previous Review
In the era of advanced computing, AI, and 3D heterogeneous integration, materials innovation sits at the heart of semiconductor progress. As the industry pushes toward smaller nodes, higher performance-per-watt, and complex chiplet architectures, breakthroughs are needed not only in device design but across the entire materials ecosystem—from front-end process enablers to advanced packaging interfaces.According to SEMI, the global semiconductor materials market is on track to surpass $80 billion by 2027, driven by demand for high-purity, high-reliability materials in logic, memory, and advanced packaging. This growth underscores the strategic importance of securing resilient, diversified, and sustainable material supply chains.
The conference this year brings together global experts and leaders, and ecosystem partners to exchange insights, explore collaborative models, and jointly shape the future roadmap of semiconductor materials.
Diamond Sponsor:
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Sponsors & Supports
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CONTACT US:
Hannah Zhao 021-60278571 [email protected]