Advanced Material Conference(AMC)


Date: Wednesday, March 26, 2025
Time: 09:00-12:00
Venue: Grand Shanghai Ballroom 3, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

Attendee Registration   Previous Review

The Advanced Material Conference-AMC is a valuable, productive blend of learning, and networking with global industry leaders, experts, and colleagues.

As the cornerstone of electronics and AI revolution, semiconductor material industry has gained a lot of investments and achieved rapid development in the past decade. The global semiconductor material market size is expected to reach $70 billion in 2024, mainland China is the second-largest semiconductor materials market in the world. What's the development status for fab and packaging materials? How about the upstream supply chain? How to adapt to the uncertainties in the following years and seize the opportunity? Join us in this years' AMC to get insights on current developments and future industrial trends in advanced materials.

Key topics：
♦ Advanced semiconductor material
♦ Packaging material development
♦ Demands from AI and HBM
♦ Market and Economic Trends

Agenda / 议程
   
09:00-09:30 Registration 来宾登记
   
09:30-09:45
 Opening Remark 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
   
09:45-10:10 Foundry Keynote Speech（Reserved）
代工厂主题演讲
   
10:10-10:30 Dr. Lijun Yao, President and CTO, KFMI
姚力军，宁波江丰电子材料股份有限公司董事长兼首席技术官
   
10:30-10:50 Hubei Dinglong Holding Co., Ltd.
湖北鼎龙科技
   
10:50-11:10
Development Trends of Semiconductor Packaging Materials
半导体封装材料发展趋势
Dr. Tim Chen, CEO, Darbond Technology Co.,Ltd.
陈田安，烟台德邦科技总经理
   
11:10-11:30 TBD
   
11:30-11:50 TBD
   
11:50-12:10
Market and Technology Trends of Semiconductor Process Materials
Michel Walden, Head of Market Research & Analytics, TECHCET LLC
Michel Walden, TECHCET LLC市场研究首席分析师
   
12:10-12:15 Closing remark 闭幕致辞
   
* 议程以最终版为准
* Please refer to the final version of Agenda.
   

CONTACT US:
Hannah zhao 021-60278571 [email protected]