New Technology Release Conference
| Date: | Thursday, March 26, 2026 |
| Time: | 10:00-16:30 |
| Venue: | M42, Hall N2, Shanghai New International Expo Centre |
Attendee Registration Previous Review
SEMI and ABKS have collaborated to host a prestigious New Technology Release Conference during SEMICON China 2026 on Mar. 26th 2026. This event stands as a brilliant showcase of the latest advancements in semiconductor technology and provides profound insights into the future trajectory of the industry.The event will feature a range of disruptive technologies and innovative solutions, encompassing advanced manufacturing processes, high-performance chip designs, intelligent production equipment, and sustainable materials science. Each new technology presented will serve as a powerful interpretation of the future direction of the semiconductor industry.
For attendees, this is not only an excellent opportunity for learning, exchange, and broadening horizons but also a premium platform for showcasing corporate technical prowess and enhancing brand image. Through the SEMICON China stage, your company can demonstrate its leadership in technological innovation to the global audience and establish valuable partnerships with peers from across the world, jointly driving the prosperity of the semiconductor industry.
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| Agenda / 议程 | |
10:10-10:20
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Welcome Remark / 欢迎致辞 Lily Feng, President, SEMI China 冯莉，SEMI 中国总裁 |
| 10:20-10:40 | TBD |
10:40-11:05
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磁悬浮技术———为半导体洁净工艺保驾护航 Magnetic Levitation Technology—— Ensuring Precision in Semiconductor Clean Processes 尹成科 博士，董事长，总经理，创始人 Yin Cheng ke, President, General Manager, Founder 苏州苏磁智能科技有限公司 Suzhou Supermag Intelligent Technology Co.,Ltd. |
| 11:05-11:30 |
山东美氟科技股份有限公司 Shandong Micflon Technology Co., Ltd. |
11:30-11:55
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《集成电路高精度薄膜沉积研发及产业化》 Research and Industrialization of High-Precision Thin Film Deposition for Integrated Circuits 杜寅昌，总经理 Yinchang Du, GM 合肥致真精密设备有限公司 Truth Equipment Co.,Ltd. |
11:55-12:20
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蒯多杰，副总裁兼集成电路科学家 Kuai Duojie, Vice President and Integrated Circuit Scientist 镁伽科技 Mega Robo Technologies Co.,Ltd. |
| 12:20-12:25 | 抽奖 |
| 13:30-14:00 |
TBD |
14:00-14:20
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新一代半导体具身智能移动操作机器人发布 Embodied Intelligent Robot, Reimagined 许瑨，联合创始人、首席产品官 Xu Jin, Co-founder and Chief Product Officer 深圳优艾智合机器人科技有限公司 Shenzhen Youibot Robotics Co., Ltd. |
14:20-14:40
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全氟醚橡胶新技术与应用拓展 赵荣朋，技术部长 Zhao Rongpeng, Technology Department Manager 四川弘芯氟醚科技有限公司 Sichuan hongxin FFKM Technology Co., Ltd. |
14:40-15:00
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磁悬浮无轴承泵在半导体湿法制程的应用和创新发展 The application and innovative development of magnetic levitation bearingless pumps in semiconductor wet processing. 崔庆文博士，创始人、董事长 Dr. Qingwen Li, Founder, President 磐石科技（深圳）有限公司 Panther Technology (Shenzhen) Co., Ltd. |
15:00-15:20
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自吸湿 • 超高阻隔：湿度敏感元件包装新革命 Self-moisture-absorbing & Ultra-high Barrier: Revolutionizing MSD Packaging 张瑾,总经理助理兼研发中心总监 Zhang Jin, Assistant General Manager & Director of the Research and Development Center 浙江博升新材料技术有限公司 Zhejiang Bosun New Material & Tech. Co., Ltd. |
15:20-15:40
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阿科玛高性能聚合物在半导体工业里的解决方案 Arkema High Performance Polymers Solutions for the Semiconductor Industry 李劲友，高性能聚合物部门大中华区业务开发负责人 JinYou Li, Greater China Business Development Leader, High Performance Polymers 阿科玛（中国）投资有限公司 ARKEMA（China）Investment Co., Ltd. |
15:40-16:00
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冯德民,日本工程院院士，国投集团首席专家，中国电子工程设计院 首席科学家 Feng Demin, Fellow of the Engineering Academy of Japan, Chief Expert of SDIC Group, and Chief Scientist of China Electronic Engineering Design Institute 中国电子工程设计院股份有限公司 CEEDI |
| 16:00-16:20 |
北京中电豫鑫科技有限公司 Beijing CEC-TECH Co., Ltd |
| 16:20-16:30 | 抽奖 |
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* The agenda is subject to being updated. * 会议议程更新中，以会议现场资料为准。 |
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联系方式 / Contacts:
孙贤波 / Xianbo Sun
021-60278569
[email protected]