Dr. Huili Fu
Senior VP of T-Head, Alibaba


Dr Fu is the Senior VP of T-Head, Alibaba, in charge of IC Platform and Engineering. Previously, he was the senior technical advisor and the department director of IC Packaging Engineering, established the team and was in charge of all Huawei IC packaging activities. He led the team and developed packaging solutions for Huawei Kirin chipsets, networking chipsets, and all other consumable chipsets, including Cu pillar technology, PoP, HBPoP, Fan-out, TSV 2.5D, super performance heterogeneous packaging technology and other advanced IC packaging technologies. Before he joined Huawei, Dr Fu worked in universities and national research Institutes. Dr Fu obtained his PhD degree in Mechanical Engineering from HongKong University of Science and Technology.