Keynote & Invited Speakers(2024)
           
TBD
Dr. Peng Bai, Rong Semiconductor
 
TBD
Prof. John Robertson, Emeritus Professor of Electronic Engineering at Cambridge University, UK
 






MEMS - sustainable technologies for a sustainable world
Dr. Anton Hofmeister, Vice President, General Manager, MEMS and Sensors Group, STMicroelectronics

TBD
Prof. Tobias Delbruck, Professor in Neuromorphic Engineering, Institute of Neuroinformatics, Switzerland

           
Partial List of Confirmed Distinguished CSTIC 2024 Invited Speakers






Defect tolerant physics-inspired computing in memristor arrays
Can Li, University of Hong Kong




           
  The Progress and Challenges of Large Scale Integration of Silicon Photonics
Jin Guo, CUMEC
 
The effect of stress on HfO2-based ferroelectric thin films
Feng Luo, Nankai University
 
           
  do we need 300mm GaN?
Kai Cheng, Enkris Semiconductor,Inc
 
Thin Film Atomic Layer Deposition and Selective Processes
Rong Chen, Huazhong University of Science and Technology
 







Hetero-integration of Gallium Oxide Enabling Bipolar Design and Thermal Management
Jiandong Ye, Nanjin University


Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications
Zongbin Wang, Applied Materials







A Chemistry Perspective of ALD Precursors' Properties
Xiabing Lou, Origin Deposition Materials Co., Ltd


Design Technology Co-Optimization for Yield and Reliability Enhancement of RRAM Technology Platform
Zhichao Lv, Reliance Memory








Si based GaN HEMTs/System R&D and the perspective of the technological commercialization
Hongyu Yu, Southen University of Science & Technology

Advances and Reliability Challenges in Heterogeneous Integration in Chiplet Era: from Solder to Copper to Optical Interconnects
Zhuo-Jie Wu, HFC semiconductor








Orthorhombic-I (Pbca) Phase: Origin of Anti-ferroelectricity in HfZrO Films
Yi Zhao, School of IC, ECNU

Integrated Module Approach to Solutions in the Specialty Device Market
Michael Chudzik, Applied Materials








TBD
Xinchun Lu, Tsinghua University

Study on the Processing Characteristics and Polishing Technology of Easily Cleavable Gallium Oxide Crystals
Hai Zhou, Yancheng Institute of Technology








Research on the electro-fenton magnetorheological finishing technology for GAN wafer
Qiusheng Yan, Guangdong University of Technology

From Good to Great: The Power of Advanced ILD CMP Slurries in Boosting Performance
Juliane Hitzel, Angst Technology (Shenzhen) Co., Ltd







CMP Technology for More than Moore Innovation
Haedo Jeong, Pusan National University
 
CMP characteristics of IGZO thin film with a variety of process parameters
Zeng Ming, Beijing Superstring Academy of Memory Technology
 
           
Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH)
Eason Wang, ICLeague










Assessing the Power-Awareness of VLSI Testing
Xiaoqing Wen, Kyushu Institute of Technology, Japan

TBD
David Keezer, Eastern Institute for Advanced Study (EIAS) in Ningbo, China







Doping level detection in Si or SiGe via In-Line Raman Spectroscopy
Roy Pinhassi, Nova Ltd

Antimonide semiconductor material for infrared sensing
Donghai Wu, Institute of Semiconductors, CAS







Si based GeSn materials and devices
Chuanbo Li, Minzu University of China

A GHz Silicon-based Width Extensional Mode MEMS Resonator with high Q
Jinling Yang, Institute of Semiconductors, CAS

           
XOI materials
Xin Ou, Shanghai Institute of Microsystem and Information Technology, CAS
    Acoustic Devices
Songsong Zhang, Chengdu Xiansheng Technology/SITRI
 
           
Lamb Acoustic Wave Device for RF applications: Ready for Prime Time Challenges and Applications?
Songbin Gong, Spectron Tech/UIUC
    Photonics
Ting Hu, Shanghai University
 
           
Universal Materails and Device Integration Technology for Future Chips
Chen Wang, Tsinghua University
 
NEMS based on novel vdW heterostrucutres
Zheng HAN, Shanxi University
 
           
High-mobility 2D P-type semiconductor materials
Xiang Chen, Nanjing University of Science & Technology
 
Atomically sharp interface of van der Waals heterostructures enabled high-performance electronic devices
Lihong Bao, Institute of Physics, CAS
           
  Symmetry-Breaking-Induced Emergent Non-linear Phenomena at Van der Waals Heterostructures
Hongtao YUAN, Nanjing University
 
Controllable preparation of wafer-scale two-dimensional van der Waals heterostructures
Libo Gao, Nanjing University
 
           
Advancing 3D Nano-electronic Systems through Innovations in BEOL-Compatible Oxide Semiconductor Technology
Gong Xiao, National University of Singapore (NUS)
 
Spectral sensor devices for on-line measurement in the process industry
Ray Saupe, Fraunhofer ENAS
 
           
TBD
Xunzhao Yin, Zhejiang University
 
Algorithm and Hardware Codesign for Brain-inspired Neuromorphic Computing
Aili Wang, Zhejiang University
 
           
Ultra-broadband RF Front-end SoC using 0.18um CMOS Technology
Jianguo Ma, Zhejiang Lab
 
Logic Synthesis based on Semi-tensor Product of Matrices
Zhufei Chu, Ningbo University
 






Efficient and Robust Hardware for Neural Networks
Grace Li Zhang, Technical University of Darmstadt

TBD
Yu-Guang Chen, National Central University







Photonic-Electronic Design Automation
Jiang Xu, Hongkong University of Science and Technology

Design Technology Co-Optimization Methods for Advanced Logic Nodes
Xingsheng Wang, Huazhong University of Science and Technology

           
TBD
Yongfu Li, Shanghai Jiao Tong University

Machine Learning for Device Modeling (MLDM) in the DTCO Eco-system
Lining Zhang, Peking University







Diffusive/Quantum Carrier Transport and Multiphysics Simulation Methods of Advanced Electronic/Optoelectronic Device
Wenchao Chen, Zhejiang University

Ultra Low Power Connectivity SoC for IoT
Peter Gammel, UBILITE







TBD
Puneet Gupta, University of California at Los Angeles
 
In-memory Computing and Dynamic Vision Sensors: Recipes for tinyML in Internet of Video Things
Arindam Basu, Hongkong City University
 
           
Neuromorphic Audio Edge Intelligence
Shih-Chii Liu, University of Zurich and ETH Zurich

TBD
Mario Lanza, KAUST








TBD
Mark Lu, Semitronix Corporation

TBD
Dong Ni, Zhejiang University







TBD
Shaodi Wang, WITMEM Co. Ltd


TBD
Cimang Lu, Flash Billion







TBD
Daniele Ielmini, Politecnico Di Milano

TBD
Yu Han, Empyrean Technology Co., Ltd.








TBD
Xiangshui Miao, Huazhong University of Science and Technology

TBD
Dawei Gao, Zhejiang ICsprout Semiconductor Co., Ltd.







TBD
Bei Yu, The Chinese University of Hong Kong

TBD
Hongjie Liu, Shenzhen Reexen Technology Co., Ltd.







Research on the application of artificial intelligence in device compact model and technology – circuits co-optimization
Ye Lu, Fudan University
    TBD
Gang Pan, Zhejiang University