Keynote & Invited Speakers(2024)
Dr. Peng Bai, Rong Semiconductor
Prof. John Robertson, Emeritus Professor of Electronic Engineering at Cambridge University, UK

MEMS - sustainable technologies for a sustainable world
Dr. Anton Hofmeister, Vice President, General Manager, MEMS and Sensors Group, STMicroelectronics

Prof. Tobias Delbruck, Professor in Neuromorphic Engineering, Institute of Neuroinformatics, Switzerland

Partial List of Confirmed Distinguished CSTIC 2024 Invited Speakers

Defect tolerant physics-inspired computing in memristor arrays
Can Li, University of Hong Kong

  The Progress and Challenges of Large Scale Integration of Silicon Photonics
Jin Guo, CUMEC
The effect of stress on HfO2-based ferroelectric thin films
Feng Luo, Nankai University
  do we need 300mm GaN?
Kai Cheng, Enkris Semiconductor,Inc
Thin Film Atomic Layer Deposition and Selective Processes
Rong Chen, Huazhong University of Science and Technology

Hetero-integration of Gallium Oxide Enabling Bipolar Design and Thermal Management
Jiandong Ye, Nanjin University

Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications
Zongbin Wang, Applied Materials

A Chemistry Perspective of ALD Precursors' Properties
Xiabing Lou, Origin Deposition Materials Co., Ltd

Design Technology Co-Optimization for Yield and Reliability Enhancement of RRAM Technology Platform
Zhichao Lv, Reliance Memory

Si based GaN HEMTs/System R&D and the perspective of the technological commercialization
Hongyu Yu, Southen University of Science & Technology

Advances and Reliability Challenges in Heterogeneous Integration in Chiplet Era: from Solder to Copper to Optical Interconnects
Zhuo-Jie Wu, HFC semiconductor

Orthorhombic-I (Pbca) Phase: Origin of Anti-ferroelectricity in HfZrO Films
Yi Zhao, School of IC, ECNU

Integrated Module Approach to Solutions in the Specialty Device Market
Michael Chudzik, Applied Materials

Xinchun Lu, Tsinghua University

Study on the Processing Characteristics and Polishing Technology of Easily Cleavable Gallium Oxide Crystals
Hai Zhou, Yancheng Institute of Technology

Research on the electro-fenton magnetorheological finishing technology for GAN wafer
Qiusheng Yan, Guangdong University of Technology

From Good to Great: The Power of Advanced ILD CMP Slurries in Boosting Performance
Juliane Hitzel, Angst Technology (Shenzhen) Co., Ltd

CMP Technology for More than Moore Innovation
Haedo Jeong, Pusan National University
CMP characteristics of IGZO thin film with a variety of process parameters
Zeng Ming, Beijing Superstring Academy of Memory Technology
Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH)
Eason Wang, ICLeague

Assessing the Power-Awareness of VLSI Testing
Xiaoqing Wen, Kyushu Institute of Technology, Japan

David Keezer, Eastern Institute for Advanced Study (EIAS) in Ningbo, China

Doping level detection in Si or SiGe via In-Line Raman Spectroscopy
Roy Pinhassi, Nova Ltd

Antimonide semiconductor material for infrared sensing
Donghai Wu, Institute of Semiconductors, CAS

Si based GeSn materials and devices
Chuanbo Li, Minzu University of China

A GHz Silicon-based Width Extensional Mode MEMS Resonator with high Q
Jinling Yang, Institute of Semiconductors, CAS

XOI materials
Xin Ou, Shanghai Institute of Microsystem and Information Technology, CAS
    Acoustic Devices
Songsong Zhang, Chengdu Xiansheng Technology/SITRI
Lamb Acoustic Wave Device for RF applications: Ready for Prime Time Challenges and Applications?
Songbin Gong, Spectron Tech/UIUC
Ting Hu, Shanghai University
Universal Materails and Device Integration Technology for Future Chips
Chen Wang, Tsinghua University
NEMS based on novel vdW heterostrucutres
Zheng HAN, Shanxi University
High-mobility 2D P-type semiconductor materials
Xiang Chen, Nanjing University of Science & Technology
Atomically sharp interface of van der Waals heterostructures enabled high-performance electronic devices
Lihong Bao, Institute of Physics, CAS
  Symmetry-Breaking-Induced Emergent Non-linear Phenomena at Van der Waals Heterostructures
Hongtao YUAN, Nanjing University
Controllable preparation of wafer-scale two-dimensional van der Waals heterostructures
Libo Gao, Nanjing University
Advancing 3D Nano-electronic Systems through Innovations in BEOL-Compatible Oxide Semiconductor Technology
Gong Xiao, National University of Singapore (NUS)
Spectral sensor devices for on-line measurement in the process industry
Ray Saupe, Fraunhofer ENAS
Xunzhao Yin, Zhejiang University
Algorithm and Hardware Codesign for Brain-inspired Neuromorphic Computing
Aili Wang, Zhejiang University
Ultra-broadband RF Front-end SoC using 0.18um CMOS Technology
Jianguo Ma, Zhejiang Lab
Logic Synthesis based on Semi-tensor Product of Matrices
Zhufei Chu, Ningbo University

Efficient and Robust Hardware for Neural Networks
Grace Li Zhang, Technical University of Darmstadt

Yu-Guang Chen, National Central University

Photonic-Electronic Design Automation
Jiang Xu, Hongkong University of Science and Technology

Design Technology Co-Optimization Methods for Advanced Logic Nodes
Xingsheng Wang, Huazhong University of Science and Technology

Yongfu Li, Shanghai Jiao Tong University

Machine Learning for Device Modeling (MLDM) in the DTCO Eco-system
Lining Zhang, Peking University

Diffusive/Quantum Carrier Transport and Multiphysics Simulation Methods of Advanced Electronic/Optoelectronic Device
Wenchao Chen, Zhejiang University

Ultra Low Power Connectivity SoC for IoT
Peter Gammel, UBILITE

Puneet Gupta, University of California at Los Angeles
In-memory Computing and Dynamic Vision Sensors: Recipes for tinyML in Internet of Video Things
Arindam Basu, Hongkong City University
Neuromorphic Audio Edge Intelligence
Shih-Chii Liu, University of Zurich and ETH Zurich

Mario Lanza, KAUST

Mark Lu, Semitronix Corporation

Dong Ni, Zhejiang University

Shaodi Wang, WITMEM Co. Ltd

Cimang Lu, Flash Billion

Daniele Ielmini, Politecnico Di Milano

Yu Han, Empyrean Technology Co., Ltd.

Xiangshui Miao, Huazhong University of Science and Technology

Dawei Gao, Zhejiang ICsprout Semiconductor Co., Ltd.

Bei Yu, The Chinese University of Hong Kong

Hongjie Liu, Shenzhen Reexen Technology Co., Ltd.

Research on the application of artificial intelligence in device compact model and technology – circuits co-optimization
Ye Lu, Fudan University
Gang Pan, Zhejiang University