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Conference Plenary Speakers (2025)
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From the Nanometer Scale to Light Years
Dr. Edmundo A. Gutiérrez D., General Director, INAOE, Mexico
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Partial List of Confirmed Distinguished CSTIC 2025 Keynote & Invited Speakers
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Backside Power Delivery Network using BPR and Nano Through Silicon Via
Peng Zhao, IMEC
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Defects Characterization and Their Impact on the Stability of Oxide Semiconductor Devices and 2T0C DRAM Cell
Mengwei Si, Shanghai Jiao Tong University
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The integration and process challenges and solutions for advanced technology nodes
David Xiao
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Challenges and latest developments on photo resisters for advanced logic and memory technology nodes
Allen Chang, JSR
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Patterning challenges and perspectives solutions in advanced DRAM technology nodes
Hongbo Sun, Beijing Chaoxian Memory Research Institute
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The pattern solutions for GAAFET
Min Xu, Fudan University
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Challenges of Inductively Coupled Plasma Applications
Hu Zhou, AMEC
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Latest new results and developments of TSV for advanced 3DIC applications
Chao Lv, Beijing NAURA Technology Group Co., Ltd.
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Advanced plasma patterning for compound semiconductors
Jianzong Wang, Beijing NAURA Technology Group Co., Ltd.
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Pulsing Plasma Application for Advanced Dry Etch Process
Zhongwei Jiang, Beijing NAURA Technology Group Co., Ltd.
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Ion Beam Etching as a Patterning Solution for Memory Applications
Kaidong Xu, Jiangsu Leuven Instruments Co., Ltd.
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Effects of ALE Capabilities and DC Pulsing in Microwave ECR Plasma on Etching Processes for Cutting-Edge Logic LSI
Masaru Izawa, Hitachi High-Tech Corporation
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Inline Non-contacting Measurement of Effective Work Function
Zheng Zou, GHS Semiconductor Co. Ltd.
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Material and process advances in extending BEOL Cu metalization and beyond
George Wu, GHS Semiconductor Co. Ltd.
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TBD
Xiabing Lou, Suzhou Origin Materials Technology Co,. Ltd.
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Grinding and Chemical Mechanical Polishing Applications in Advanced Packaging
Xinchun Lu, Hwatsing Technology Co.,Ltd
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Post Metal CMP Cleaning Technology Processes and Materials
Guanghong Luo, Yantai Xianhua Polymer Materials Ltd.
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FPGA-based Test Platform for 56-Gbps NRZ Digital ICs and Systems
Dave Keezer, Eastern Institute for Advanced Study (EIAS), China
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Wearable ultrasound technology for deep-tissue monitoring
Hongjie Hu, Peking University
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Advancing material innovations to seamlessly integrate flexible sensors with rigid chips
Yuqing Zheng, Peking University
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Nanoelectromechanical Switches for Energy-Efficient Logic
Jinchi Han, Peking University
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Integration of 2D semiconductor based transistors for advanced logic nodes
Yuanyuan Shi, University of Science and Technology of China
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Smart Micro-Electromechanical and Nano-Photonic Devices Enabled by a Phase Transition
Kaichen Dong, Tsinghua Shenzhen International Graduate School, Tsinghua University
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Neuromorphic vision sensor
Shi-Jun Liang, Nanjing University
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2D semiconductors and devices
Yeesin Ang, Singapore University of Technology Design
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Energy Intelligent Computing Devices Based on 2D Materials
Heejun Yang, Korea Advanced Institute of Science and Technology
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Neuromorphic computing
Suting Han, Hong Kong Polytechnic
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3D micro-/nano-fabrication for high performance nanophotonics and sensors
Faheng Zang, Shanghai Jiao Tong University
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Hybrid Laser Manufacturing of Flexible and Conformal Electronics
Kaichen Xu, Zhejiang University
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Metal Oxide Based Heterostructured Nanomaterials Prepared by ALD for Effective Gas Sensors
Hong-Liang LU, Fudan University
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Integrated Fabrication and Applications of MEMS Devices on Ultra-thin Cylindrical Substrate
Zhuoqing Yang, Shanghai Jiao Tong University
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Chip tech for life science and medicine
Chang Chen, Shanghai Jiao Tong University
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VC-MTJ Applications
Albert Lee, Inston Tech.
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Spintronic memory design perspective
Hao Cai, Southeast University, China
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IC and MEMS application in gas sensors
Anbo GUO, Semeatech Technology Co., Ltd. and Promisense Electronic Co., Ltd.
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Multi-dimensional mateirals integration for smart sensor chips
Chen Wang, Tsinghua University
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Highly Reliable RRAM Technology Development for Advanced Tech Node
Xiangchao Ma, Beijing InnoMem Technologies Co., Ltd
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Sensing and reliability design in commercial airspace industry
Zhikang Lan, Nanjing Gova Technology Co.,Ltd
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How 3D-IC speed-up High Memory Bandwidth AI Chip
Miao Liu, Cadence (Shanghai)
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AI Empowered Radio-Frequency Power Amplifier Design and Modelling
Jianguo Ma, Zhejiang University
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Open Source Chip: Achievement and Challenges
Yungang Bao, Chinese Academy of Science, Institute of Computing Technology
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