Conference Plenary Speakers (2027)
           
3D Integration Technologies Enable Broad Innovations in Designs and Manufacturing of Advanced Chips and IC Systems
Dr. Guangquan Lu
Chairman, Piotech, Inc., China 		 

 
           
Partial List of Confirmed Distinguished CSTIC 2027 Keynote & Invited Speakers
           
TBD
Chao Zhao, Beijing Superstring Academy of Memory Technology (SAMT) 		 
Peiwen Li, National Chiao-Tung University  
           
Chao Xiang, The University of Hong Kong  
Yaoyu Tao, Peking University  
           
As Small as it Gets: Challenges and Strategies in EUV Photoresists for Future Technology Nodes
Ekinci Yasin, Paul Scherrer Institute (PSI) 		 
The Art of ICP Etch for 3D Era
Yuping Ren, AMEC 		 
           
AI-Driven Closed-Loop Manufacturing for High-Aspect-Ratio Plasma Etching: From Inverse Recipe Design to Nondestructive Virtual Metrology
Lang Chen, Peking University
Advanced Plasma Diagnostics and Modeling: From Fundamental Plasma Physics to Plasma Etching
XinPei Lu, Huazhong University of Science and Technology






TBD
Peng Zhao, Peking University









2D materials devices
Yee Sin Ang, Singapore University of Technology and Design (SUTD) 		 
Near Zero-Power MOEMS Sensors Enabled by a Phase Transition
Kaicheng Dong, Tsinghua University 		 
           
Deep-Level Defects and Defect-Enabled Property Engineering in Low-Dimensional Semiconductors
Penghong Ci, Institute of Semiconductors, CAS
Recent Advances in ICP Etching Systems for Next-Generation Advanced Node Device Fabrication
Zheng Tao, Leuven Instruments






TBD
Xiaona Zhu, Fudan University
Investigation of Electron Transport in Subthreshold and Transition Regions of Oxide Semiconductor Transistors by Magneto-Transport Measurements
Mengwei Si, Shanghai Jiao Tong University