SEMICON China - CSTIC - CSTIC 2027 - Keynote & Invited Speakers

Conference Plenary Speakers (2027)

	Dr. Hanming Wu Professor, Zhejiang University, China Academician of Chinese Academy of Engineering, China	DRAM Evolution and Challenges in Cloud Era Dr. Chao Zhao Senior Fellow and VP of CXMT Fellow of the European Academy of Sciences (EurASc)

	Prof. Mikael Östling Professor, KTH Royal Institute of Technology, Sweden	3D Integration Technologies Enable Broad Innovations in Designs and Manufacturing of Advanced Chips and IC Systems Dr. Andy Chen Chairman, Piotech, Inc., China

Partial List of Confirmed Distinguished CSTIC 2027 Keynote & Invited Speakers

	Stanley Seungchul (S.C) Song, Google, US	Ghavam Shahidi, IBM, USA

	TBD Guilei Wang, Beijing Superstring Academy of Memory Technology	Peiwen Li, National Chiao-Tung University

	Chao Xiang, The University of Hong Kong	Yaoyu Tao, Peking University

	Mott Memristors-based Spiking Neurons for Neuromorphic Sensory Electronics Bowen Zhu, Westlake University	Xiwen Liu, The Hong Kong University of Science and Technology (Guangzhou)

	Xiuyan Li, Shanghai Jiao Tong University	Jiuren Zhou, Xidian University

	Xuefei Li, Huazhong University of Science and Technology	Qingzhu Zhang, Institute of Semiconductors, Chinese Academy of Sciences

	Jun-Wei Luo, Institute of Semiconductors, Chinese Academy of Sciences	As Small as it Gets: Challenges and Strategies in EUV Photoresists for Future Technology Nodes Ekinci Yasin, Paul Scherrer Institute (PSI)

	Peter Hu, KLA	Robert Eklund, Mycronic

	First Analytical Defect Propagation Model in Grapho-Epitaxy of Directed Self-Assembly Xianhe Liu, Fudan University	Physical Model Based EUV and DUV Source-Mask co-Optimization with Built-in Hot Spot Evaluation and Mitigation Qiang Wu, Fudan University

	The Use of 193 nm Immersion Lithography for 5 nm and more Advanced Technology Nodes, the Role of SMO Yanli Li, Fudan University	Plasma Etch and Advanced Pattering in Advanced DRAM Technology Juhani Xiang, CXMT

	HAR Dielectric Etching: Challenges & Solutions Jiankun Zhang, NAURA	The Art of ICP Etch for 3D Era Yuping Ren, AMEC

	Recent Advances in ICP Etching Systems for Next-Generation Advanced Node Device Fabrication Zheng Tao, Leuven Instruments	The Uniformity Control for Atomic Layer Deposition Technology Dongmei Zhai, STIC

	AI-Driven Closed-Loop Manufacturing for High-Aspect-Ratio Plasma Etching: From Inverse Recipe Design to Nondestructive Virtual Metrology Lang Chen, Peking University	Advanced Plasma Diagnostics and Modeling: From Fundamental Plasma Physics to Plasma Etching XinPei Lu, Huazhong University of Science and Technology

	AI and Atomic-Scale Simulation-Driven Optimization for Multi-Material Dry Etching Zhigang Wang, MRDI	HAR Dielectric Etching: Challenges & Solutions Ying Guo, Donghua University

	Multi-Scale Modeling of Cryogenic Etching: From Plasma Kinetics to Surface Reaction Dynamics Quanzhi Zhang, Dalian University of Technology	A Mechanistic Study of HBr Etch-Gas Adsorption in a Plasma Etching Chamber Qinzhen Hao, YMTC

	Sean Seutter, Applied Materials	High-Mobility Indium-Based Oxide Thin Films: Process and Device Technology Shen Hu, Fudan University

	Development of Low-Temperature Supercritical Fluid Processes for Silicon-Germanium Gate-All-Around Transistors Dunbao Ruan, Fuzhou University	Hf-Vased Ferroelectric Poly-Si Channel FET for NAND Application Xiaolei Wang, IMECAS

	TBD Peng Zhao, Peking University	Investigation of Electron Transport in Subthreshold and Transition Regions of Oxide Semiconductor Transistors by Magneto-Transport Measurements Mengwei Si, Shanghai Jiao Tong University

	AI-Enabled Digital Engineering for Process Development and Productivity Enhancement in Semiconductor Manufacturing Weijun Luo, Lam Research	Latest Progress, Prospects and Challenges on Bulk AlN Crystal Growth by PVT Method Liang Wu, Ultratrend Technologies Co. Ltd

	TBD Xiaona Zhu, Fudan University	HKMG Key Process in SiGe Channel Device Xiao Yu, Xian University of Electronic Science and Hangzhou Research InstituteTechnolog

	Indium Phosphide Membrane on Silicon (IMOS) Technology and Its Monolithic Integrated Optical Receiver Jianou Huang, Zhejiang University	Virtual Metrology and FDC Early Warning for Semiconductor Smart Manufacturing Ningmu Zou, Nanjing University

	TBD Shumin Wang, Anji Microelectronics	Liming Zhang, ANST (Shenzhen) Co., Ltd.

	Applications of Ion Beam Technology in Planarization for Advanced Nodes Lei Guo, Leuven Instruments	Weiye Zhang, Zhiren Polishing Material Company

	Precise Topography Control and Defect Mitigation in Advanced Cu Barrier Metal and Hybrid Bonding CMP Yi Guo, Qnity Electronics	AI-enabled Full-Lifecycle of CMP Materials: Assisted R&D, Quality Control and Troubleshooting in Manufacturing Zilong Liu

	Comprehensive Strategy for Efficient Suppression of Copper Arc Defects in Wet Stripping and Cleaning Processes Haibo Hu, ACM Microelectronics	Advances in CMP Materials and Processes: A Data and Model Driven Approach Yiran Liu, Shanghai Institute of IC Materials

	Critical Control of Hybrid Bonding Interface Quality: Surface Defect Evolution and Precision Cleaning Technology Post Hong Yan, Hangzhou SemCleanLink Technology Co., Ltd	From Photons to Heat: CMP Bridging the "Last Nanometer" of CPO-used Substrates and High-Thermal-Conductivity Heat-Dissipation Templates Pinhui Hsieh, JINAN OPTOELECTRONICS CO., LTD.

	TBD Leo Lin, KINIK Company	Macro/Micro, Square/Circular: New Challenges of Chemical Mechanical Polishing Lei Guo, Hwatsing Technology Co., Ltd

	A Noval Combined CMP‑Wet Planarization Process for EMC/DAF/Cu Composite Interfaces for 2.5D Bridge Chip Xingchen Mu, JCET Group Co., Ltd.	TBD Jie Cheng, China University of Mining and Technology-Beijing

	Ceria-Mediated Photochemical Oxidation for Chemical Mechanical Polishing Yuhang Qi, Hebei University of Technology	Yu Huang, HUAWEI

	Challenges and Perspectives in Future LSI Logic Test Generation Xiaoqing Wen, Kyushu Institute of Technology	Jiliang Zhang, Nanjing University of Posts and Telecommunications

	Gang Qu, University of Maryland, USA	Jing Ye, CASTEST Co., Ltd.

	Cheng Liu, North China Electric Power University	Patrick Lo, AFM

	Jiang Xia, JCET China	Peng Zhao, Peking University

	Shen Liu	Wenzhong Bao, Fudan University

	AI Drived Advanced IC Equipment and Fab Line Evolution Chen Wang, Tsinghua University	Deep-Level Defects and Defect-Enabled Property Engineering in Low-Dimensional Semiconductors Penghong Ci, Institute of Semiconductors, CAS

	2D materials devices Yee Sin Ang, Singapore University of Technology and Design (SUTD)	Near Zero-Power MOEMS Sensors Enabled by a Phase Transition Kaicheng Dong, Tsinghua University

	Nan Qi, IOSCAS	Ming Hu, BOE

	Zhiqiang Xiao, BEMC	Shichang Li, Shengjisheng Semiconductor Technology

	Yuyan Wang, Tsinghua University	Peng Wu, Peking University

	Zhaoqiang Bai, Beijing Superstring Academy of Memory Technology	Qingyang Du, Zhijiang Lab

	Advanced Semiconductor Bonding and Integration: Technologies and Applications Chao Guo, ISABERS GROUP	Improved Morphology Uniformity of High-Refractive-Index Slanted Gratings via One-Step LEUVEN Instruments RIBS Etching for Mass Production of AR Waveguides Si Chen, Leuven Instruments

	Challenges of Silicon Photonics and Electronic-Photonic Integration Technology Jin Guo, Chongqing United Microelectronics Center(CUMEC)	Novel Metal and Dielectric Film Deposition Technologies for Advanced 3D Devices Xun Gu, AMEC

	Spin Qubits based on Semiconductor Quantum Dot Hai-Ou Li, University of Science and Technology of China	Yujie Wang, Institute of Computing Technology, Chinese Academy of Sciences

	Yuanqing Cheng, Beihang University	An Zou, Shanghai Jiao Tong University

	Zhe Jiang, Southeast University	Shuyao Cheng, Chinese Academy of Sciences

	Agentic DTCO/STCO in VirtualFab for Path-Finding and Design Space Exploration Chen Shen, Shanghai Peifeng Tunan Semiconductor Co., Ltd.	Machine Learning Applications in Semiconductor TCAD Simulation Zhenhua Wu, Zhejiang University

	Rongmei Chen, Peking University	Multi-Agent-Driven High-Speed Memory Design and Verification: From Specifications to Layout, SI/PI Analysis, and ECO Jimin Wen, Xpeedic Co., Ltd.