| Conference Plenary Speakers (2027) | |||||
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DRAM Evolution and Challenges in Cloud Era Dr. Chao Zhao Senior Fellow and VP of CXMT, Fellow of the European Academy of Sciences (EurASc) |
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3D Integration Technologies Enable Broad Innovations in Designs and Manufacturing of Advanced Chips and IC Systems Dr. Guangquan Lu Chairman, Piotech, Inc., China |
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| Partial List of Confirmed Distinguished CSTIC 2027 Keynote & Invited Speakers | |||||
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Stanley Seungchul (S.C) Song, Google, US |
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Ghavam Shahidi, IBM, USA |
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TBD Guilei Wang, Beijing Superstring Academy of Memory Technology |
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Peiwen Li, National Chiao-Tung University | ||
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Chao Xiang, The University of Hong Kong |
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Yaoyu Tao, Peking University | ||
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Bowen Zhu, Westlake University |
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Xiwen Liu, The Hong Kong University of Science and Technology (Guangzhou) | ||
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Xiuyan Li, Shanghai Jiao Tong University |
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Jiuren Zhou, Xidian University | ||
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Xuefei Li, Huazhong University of Science and Technology |
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Qingzhu Zhang, Institute of Semiconductors, Chinese Academy of Sciences | ||
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Jun-Wei Luo, Institute of Semiconductors, Chinese Academy of Sciences |
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As Small as it Gets: Challenges and Strategies in EUV Photoresists for Future Technology Nodes Ekinci Yasin, Paul Scherrer Institute (PSI) |
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Peter Hu, KLA |
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Robert Eklund, Mycronic | ||
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Anna Tchikoulaeva, Lasertec Europe |
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A Mechanistic Study of HBr Etch-Gas Adsorption in a Plasma Etching Chamber Qinzhen Hao, YMTC |
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Plasma Etch and Advanced Pattering in Advanced DRAM Technology Juhani Xiang, CXMT |
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HAR Dielectric Etching: Challenges & Solutions Jiankun Zhang, NAURA |
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The Art of ICP Etch for 3D Era Yuping Ren, AMEC |
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Recent Advances in ICP Etching Systems for Next-Generation Advanced Node Device Fabrication Zheng Tao, Leuven Instruments |
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The Uniformity Control for Atomic Layer Deposition Technology Dongmei Zhai, STIC |
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AI-Driven Closed-Loop Manufacturing for High-Aspect-Ratio Plasma Etching: From Inverse Recipe Design to Nondestructive Virtual Metrology Lang Chen, Peking University |
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Advanced Plasma Diagnostics and Modeling: From Fundamental Plasma Physics to Plasma Etching XinPei Lu, Huazhong University of Science and Technology |
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AI and Atomic-Scale Simulation-Driven Optimization for Multi-Material Dry Etching Zhigang Wang, MRDI |
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HAR Dielectric Etching: Challenges & Solutions Ying Guo, Donghua University |
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Multi-Scale Modeling of Cryogenic Etching: From Plasma Kinetics to Surface Reaction Dynamics Quanzhi Zhang, Dalian University of Technology |
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Sean Seutter, Applied Materials |
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High-Mobility Indium-Based Oxide Thin Films: Process and Device Technology Shen Hu, Fudan University |
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Development of Low-Temperature Supercritical Fluid Processes for Silicon-Germanium Gate-All-Around Transistors Dunbao Ruan, Fuzhou University |
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Hf-Vased Ferroelectric Poly-Si Channel FET for NAND Application Xiaolei Wang, IMECAS |
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TBD Peng Zhao, Peking University |
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Investigation of Electron Transport in Subthreshold and Transition Regions of Oxide Semiconductor Transistors by Magneto-Transport Measurements Mengwei Si, Shanghai Jiao Tong University |
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AI-Enabled Digital Engineering for Process Development and Productivity Enhancement in Semiconductor Manufacturing Weijun Luo, Lam Research |
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Latest Progress, Prospects and Challenges on Bulk AlN Crystal Growth by PVT Method Liang Wu, Ultratrend Technologies Co. Ltd |
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TBD Xiaona Zhu, Fudan University |
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HKMG Key Process in SiGe Channel Device Xiao Yu, Xian University of Electronic Science and Hangzhou Research InstituteTechnolog |
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Indium Phosphide Membrane on Silicon (IMOS) Technology and Its Monolithic Integrated Optical Receiver Jianou Huang, Zhejiang University |
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Virtual Metrology and FDC Early Warning for Semiconductor Smart Manufacturing Ningmu Zou, Nanjing University |
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Applications of Ion Beam Technology in Planarization for Advanced Nodes Lei Guo, Leuven Instruments |
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Liming Zhang, ANST (Shenzhen) Co., Ltd. |
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Yu Huang, HUAWEI |
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Xiaoqing Wen, Kyushu Institute of Technology |
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Jiliang Zhang, Nanjing University of Posts and Telecommunications |
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Patrick Lo, AFM |
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Jiang Xia, JCET China |
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Peng Zhao, Peking University |
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Shen Liu |
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Wenzhong Bao, Fudan University |
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AI Drived Advanced IC Equipment and Fab Line Evolution Chen Wang, Tsinghua University |
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Deep-Level Defects and Defect-Enabled Property Engineering in Low-Dimensional Semiconductors Penghong Ci, Institute of Semiconductors, CAS |
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2D materials devices Yee Sin Ang, Singapore University of Technology and Design (SUTD) |
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Near Zero-Power MOEMS Sensors Enabled by a Phase Transition Kaicheng Dong, Tsinghua University |
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Nan Qi, IOSCAS |
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Ming Hu, BOE |
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Zhiqiang Xiao, BEMC |
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Shichang Li, Shengjisheng Semiconductor Technology |
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Yuyan Wang, Tsinghua University |
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Peng Wu, Peking University |
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Zhaoqiang Bai, Beijing Superstring Academy of Memory Technology |
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Qingyang Du, Zhijiang Lab |
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Advanced Semiconductor Bonding and Integration: Technologies and Applications Chao Guo, ISABERS GROUP |
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Improved Morphology Uniformity of High-Refractive-Index Slanted Gratings via One-Step LEUVEN Instruments RIBS Etching for Mass Production of AR Waveguides Si Chen, Leuven Instruments |
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Challenges of Silicon Photonics and Electronic-Photonic Integration Technology Jin Guo, Chongqing United Microelectronics Center(CUMEC) |
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Novel Metal and Dielectric Film Deposition Technologies for Advanced 3D Devices Xun Gu, AMEC |
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Spin Qubits based on Semiconductor Quantum Dot Hai-Ou Li, University of Science and Technology of China |
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Yujie Wang, Institute of Computing Technology, Chinese Academy of Sciences |
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Yuanqing Cheng, Beihang University |
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An Zou, Shanghai Jiao Tong University |
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Zhe Jiang, Southeast University |
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Shuyao Cheng, Chinese Academy of Sciences |
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Chen Shen, Peifeng Tunan Semiconductor |
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Zhenhua Wu, Zhejiang University |
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Rongmei Chen, Peking University |
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