SEMICON China - CSTIC - CSTIC 2026 - Keynote & Invited Speakers

Conference Plenary Speakers (2026)

	Mr. Aki Fujimura Chairman and CEO, D2S, Inc., USA	Prof. Arokia Nathan Bye-Fellow and Tutor at Darwin College, Cambridge University, UK

	Dr. Zongliang Huo CTO, Yangtze Memory Technology, China	Nondestructive 3D Imaging of ICs for Metrology, Defect Inspection and Reliability Engineering Dr. Ehrenfried Zschech Member, EurASc and ACATECH, Germany

Partial List of Confirmed Distinguished CSTIC 2026 Keynote & Invited Speakers

	Synaptic and Neural Behaviours in A Standard Silicon Transistor Mario Lanza, National University of Singapore	Design Strategies for High-Density CFET-Based SRAM Vita Pi-Ho Hu, National Taiwan University, China

	Backside Power Delivery: an Industry Perspective Han Li, Southest University	Spintronics for Unconventional Computing Qiming Shao, The Hong Kong University of Science and Technology

	TBD Zhe Cheng, Peking University	Subnanosecond 2D Flash Memory Chunsen Liu, Fudan University

	MOS Interfaces of Emerging Channel Materials Mengnan Ke, Yokohama National University, Japan	High Performance Transistor and Memory Based on 2D Materials Jiangbin Wu, Institute of Semiconductors, CAS

	TBD Yiming Sun, Huawei	HfO₂ based FeFET for High Reliability Memory and Compute-in-Memory Applications Kechao Tang, Peking University

	TBD Huihui Li, Changxin	In-Memory Computing for Large Language Model Shaodi Wang, Witmem

	TBD Suting Han, Hong Kong PolyU	X-Ray Critical Dimension Metrology for IC Nanostructures at Advanced Nodes Xiuguo Chen, Huazhong University of Science and Technology

	Imaging and Resist Modeling in Photolithography for Optical Proximity Correction Hao Jiang, Huazhong University of Science and Technology	Production-Ready Full-Chip Entirely Curvilinear ILT and Curvilinear Masks for DUV Leo Pang, D2S, Inc., USA

	Source and Curvy-Mask Optimization with Continuous Tone Quantization Yijiang Shen, Guangdong University of Technology	Negative-Tone Imaging (NTI) Process and Material Technology for ArF Immersion and EUV Lithography Hideaki Tsubaki, FUJIFILM Corporation

	Impact of Low-n Absorber on SMO in High-NA EUV Lithography for sub-3 nm Nodes Xianhe Liu, Fudan University

	Ion Beam Technology for Advanced Patterning of Logic and Memory Devices Cheng Li, Leuven Instruments	Plasma Etch and Defect Reduction Pengkai Xu, HLMC

	IBS Enhanced DRAM technology: The New Patterning Revolution Brought about by New Tools Juhani Xiang, CXMT	Tungsten-Doped Carbon Hard Mask Etch Profile Control for High-Selectivity Channel Hole Etching Nikky Shan, YMTC

	Wet Clean Optimization to Control the Cu Loss in BEOL AIO Process DongMei Zhai, STIC	The Challenge of Etch Process in Advanced Memory Technology Zhonghua Jin, Beijing Superstring Academy of Memory Technology (SAMT)

	Study of Different Selective Etching Methods in Process of Gate-all-around FET Junjie Li, IMECAS	ICP Etch For Advanced Technology Nodes Tao Zhong, Naura

	Synergy of Ion and Highly Reactive Species in Cryogenic Plasma Etching Yingxin Guan, AMEC	Etch Solutions for Advanced Specialty Jim Zhang, Lam Research

	Characterization and Diagnosis of Etch Chamber and Etch Process Based on In Situ Deposition Xiaowei Li, Leuven Instruments	Selective Area Deposition of 2D Semiconductors and Transistor Integration Yuanyuan Shi, University of Science and Technology of China (USTC)

	TBD Xiaojun Zhang, Mtech Financial Technology	High-Performance Optical Transmission Chip Based on Thin-Film Lithium Niobate Liu Liu, Zhejiang University

	TBD Ben Zongbin Wang, Applied Materials Singapore	Low Dimensional Materials and Devices for Advanced Node Technology Han Wang, University of Hong Kong

	TBD Heng Wu, Peking University	TBD Kai Cheng, Enkris Semiconductor

	Application of Aberration-Corrected (AC) STEM for the Failure Analysis of Semiconductor Devices Binhai Liu, Wintech-Nano	TBD Xiaona Zhu, Fudan University

	TBD David Yuan, GHS Semiconductor	Stacked Vertical Flash with Single-Crystal-Si Channel and Its Applications Huilong Zhu, Beijing X2Chip Technologies

	Advanced Interconnects: Better than Cu Yuan Tu, AtomSolve Technology Corp.	Machine Learning in Chemical Mechanical Polishing: Marriage of Convenience or True Love Story? Jiakai Zhou, Hebei University of Technology

	The Manufacture of Ultra-Clean and Ultra-Flat Silicon Wafers Hui Wang, Zhonghuan Advanced Semiconductor Material Co., Ltd	Nanobubbles: a Sustainable Technology in Semiconductor Cleaning Lijuan Zhang, Shanghai Advanced Research Institute, Chinese Academy of Sciences

	Emerging CMP Solutions for Advanced Packaging Jae-Dong Lee, KC Tech	Integrated Strategy for High Efficiency and Low Defect Wafer Planarization Processes Lifei Zhang, Tsinghua University, China

	Atomic-Level Material Removal Mechanism of Copper in Chemical Mechanical Polishing Jiang Liang, Southwest Jiaotong University, China	TBD Shoutian Li, Anji Microelectronics, China

	TBD Weili Liu, Shanghai Institute of Microsystem and Information Technology	TBD Ping Zhou, Dalian University of Technology

	Strategy and Demonstration of FPGA-based Automated Test above 100 Gbaud per Lane David Keezer, Eastern Institute of Technology, Ningbo, China	Reliability and Test Challenges for Multi-Core Cyber-Physical Systems Zebo Peng, Linköping University

	Piezoelectric Micromachined Ultrasonic Transducers for Advanced Sensing Applications Yipeng Lu, Peking University	Wide Bandgap Semiconductor for Power Management in Future Society Jin Wei, Peking University

	Water Based Photodetector and Chips Shi-Sheng Lin, Zhejiang University	1T FDSOI-based >1000fps Image Sensor with In-pixel Computing Peng Huang, Peking University

	Multi-functional Sensing Technology for Self-Powered Microsystems Xiaosheng Zhang, University of Electronic Science and Technology of China	2D Materials in Post-Moore Electronics-Energy Devices: From Atomic Interfaces to Intelligent Systems Lin Jiang, Shanghai University

	Thermal Managenment of Chiplet Yunna Sun, Shanghai Jiao Tong University	Batch EPI Technology for 3D DRAM Si/SiGe Superlattice Haoran Shi, Xingyuanchi Co Ltd

	Artificial Intelligence for 2D Materials and Devices Yong Xie, Xidian University/ICMM-CSIC	An Ultra-High Vacuum (UHV) Device for Josephson Junction Fabrication Baosheng Du, Suzhou Youlun Vacuum Equipment Technology Co.,Ltd

	Universal Mateials Integration for Cross Dimensional Devices Chen Wang, Tsinghua University	Wearable Ultrasound Technologies for Deep-Tissue Monitoring Hongjie Hu, Peking University

	(Sc)AlN based Piezoelectric MEMS for Ultrasonic Sensing Bowen Sheng, Peking University	Wafer-Scale Heterogeneous Integration XOI for Power, Photonic, & Acoustic Devices Shibin Zhang, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences

	Wet Process Equipment and Temporary De-bonding Technology Liping LI, TAZMO Japan	Next-Generation RF Filter Technologies for 6G and Wi-Fi 8 Chengjie Zuo, University of Science and Technology of China

	3D-Structured Photodetectors based on 2D Materials Tao Deng, Beijing Jiaotong University	Opportunities for Energy Saving by Implementation of WBG Power Devices Mikael Östling, Royal Institute of Technology (KTH)

	Near Zero Power MEMS Sensors Enabled by a Phase Transition Kaichen Dong, Tsinghua University Shenzhen	Multisensor MEMS Approach to Structural Health Monitoring (SHM) for Liquid Hydrogen Tanks in Aviation — An Implementation Example Ray Saupe, Fraunhofer ENAS

	TBD Ulf Schlichtmann, Technical University of Munich, Germany	Challenges and Considerations for Ultra-Large-Scale Full-Chip Power Integrity Signoff Ji Li, Shanghai LEDA Technology

	TBD Wenjian Yu, Tsinghua University	TBD Manuel Delgado Restituto, Institute of Microelectronics of Seville, Spain

	TBD Runjie Zhang, PHLEXING	AI for Hardware Formal Verification Hongce Zhang, Hong Kong University of Science and Technology (Guangzhou)

	TBD Yuzhe Ma, HKUST (Guangzhou)	Advances in Curvilinear Mask Optimization Bei Yu, The Chinese University of Hong Kong

	TBD Qi Sun, Zhejiang University	TBD Wei Yan, Peking University

	TBD Yi Zhao, Zhuhai Silicon Core Carbon Cloud Technology	TBD Tianyu Jia, Peking University

	TBD Zhiang Wang, Fudan University	TBD Hailong Yao, University of Science and Technology Beijing

	Pushing the Limits of Graph Learning for Scalable and Accurate Circuit Design Tsung-Yi Ho, The Chinese University of Hong Kong	TBD Xingsheng Wang, Huazhong University of Science and Technology

	TBD Qiang Xu, The Chinese University of Hong Kong	TBD Guohao Wang, ZetaTech

	TBD Hao Geng, ‌ShanghaiTech University	A Model-driven DTCO with Machine Learning Enhancements Lining Zhang, Peking University

	The Silicon Backbone of Intelligence: How Semiconductors Are Powering the Next Era of AI Diana Khlan, Chips Weekly by Diana