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Keynote & Invited Speakers(2024)
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TBD
Dr. Peng Bai, Rong Semiconductor
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TBD
Prof. John Robertson, Emeritus Professor of Electronic Engineering at Cambridge University, UK
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MEMS - sustainable technologies for a sustainable world
Dr. Anton Hofmeister, Vice President, General Manager, MEMS and Sensors Group, STMicroelectronics
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TBD
Prof. Tobias Delbruck, Professor in Neuromorphic Engineering, Institute of Neuroinformatics, Switzerland
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Partial List of Confirmed Distinguished CSTIC 2024 Invited Speakers
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Defect tolerant physics-inspired computing in memristor arrays
Can Li, University of Hong Kong
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The Progress and Challenges of Large Scale Integration of Silicon Photonics
Jin Guo, CUMEC
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The effect of stress on HfO2-based ferroelectric thin films
Feng Luo, Nankai University
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do we need 300mm GaN?
Kai Cheng, Enkris Semiconductor,Inc
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Thin Film Atomic Layer Deposition and Selective Processes
Rong Chen, Huazhong University of Science and Technology
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Hetero-integration of Gallium Oxide Enabling Bipolar Design and Thermal Management
Jiandong Ye, Nanjin University
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Tailoring the deposition and composition of advanced oxide and SiCN films to deliver the highest bonding energy for fusion and hybrid bonding applications
Zongbin Wang, Applied Materials
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A Chemistry Perspective of ALD Precursors' Properties
Xiabing Lou, Origin Deposition Materials Co., Ltd
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Design Technology Co-Optimization for Yield and Reliability Enhancement of RRAM Technology Platform
Zhichao Lv, Reliance Memory
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Si based GaN HEMTs/System R&D and the perspective of the technological commercialization
Hongyu Yu, Southen University of Science & Technology
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Advances and Reliability Challenges in Heterogeneous Integration in Chiplet Era: from Solder to Copper to Optical Interconnects
Zhuo-Jie Wu, HFC semiconductor
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Orthorhombic-I (Pbca) Phase: Origin of Anti-ferroelectricity in HfZrO Films
Yi Zhao, School of IC, ECNU
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Integrated Module Approach to Solutions in the Specialty Device Market
Michael Chudzik, Applied Materials
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TBD
Xinchun Lu, Tsinghua University
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Study on the Processing Characteristics and Polishing Technology of Easily Cleavable Gallium Oxide Crystals
Hai Zhou, Yancheng Institute of Technology
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Research on the electro-fenton magnetorheological finishing technology for GAN wafer
Qiusheng Yan, Guangdong University of Technology
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From Good to Great: The Power of Advanced ILD CMP Slurries in Boosting Performance
Juliane Hitzel, Angst Technology (Shenzhen) Co., Ltd
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CMP Technology for More than Moore Innovation
Haedo Jeong, Pusan National University
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CMP characteristics of IGZO thin film with a variety of process parameters
Zeng Ming, Beijing Superstring Academy of Memory Technology
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Heterogeneous Integration Ecosystem: The Critical Path to the Success of 3D SOC(SOH)
Eason Wang, ICLeague
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Assessing the Power-Awareness of VLSI Testing
Xiaoqing Wen, Kyushu Institute of Technology, Japan
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TBD
David Keezer, Eastern Institute for Advanced Study (EIAS) in Ningbo, China
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Doping level detection in Si or SiGe via In-Line Raman Spectroscopy
Roy Pinhassi, Nova Ltd
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Antimonide semiconductor material for infrared sensing
Donghai Wu, Institute of Semiconductors, CAS
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Si based GeSn materials and devices
Chuanbo Li, Minzu University of China
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A GHz Silicon-based Width Extensional Mode MEMS Resonator with high Q
Jinling Yang, Institute of Semiconductors, CAS
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XOI materials
Xin Ou, Shanghai Institute of Microsystem and Information Technology, CAS
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Acoustic Devices
Songsong Zhang, Chengdu Xiansheng Technology/SITRI
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Lamb Acoustic Wave Device for RF applications: Ready for Prime Time Challenges and Applications?
Songbin Gong, Spectron Tech/UIUC
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Photonics
Ting Hu, Shanghai University
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Universal Materails and Device Integration Technology for Future Chips
Chen Wang, Tsinghua University
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NEMS based on novel vdW heterostrucutres
Zheng HAN, Shanxi University
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High-mobility 2D P-type semiconductor materials
Xiang Chen, Nanjing University of Science & Technology
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Atomically sharp interface of van der Waals heterostructures enabled high-performance electronic devices
Lihong Bao, Institute of Physics, CAS
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Symmetry-Breaking-Induced Emergent Non-linear Phenomena at Van der Waals Heterostructures
Hongtao YUAN, Nanjing University
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Controllable preparation of wafer-scale two-dimensional van der Waals heterostructures
Libo Gao, Nanjing University
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Advancing 3D Nano-electronic Systems through Innovations in BEOL-Compatible Oxide Semiconductor Technology
Gong Xiao, National University of Singapore (NUS)
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Spectral sensor devices for on-line measurement in the process industry
Ray Saupe, Fraunhofer ENAS
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TBD
Xunzhao Yin, Zhejiang University
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Algorithm and Hardware Codesign for Brain-inspired Neuromorphic Computing
Aili Wang, Zhejiang University
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Ultra-broadband RF Front-end SoC using 0.18um CMOS Technology
Jianguo Ma, Zhejiang Lab
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Logic Synthesis based on Semi-tensor Product of Matrices
Zhufei Chu, Ningbo University
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Efficient and Robust Hardware for Neural Networks
Grace Li Zhang, Technical University of Darmstadt
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TBD
Yu-Guang Chen, National Central University
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Photonic-Electronic Design Automation
Jiang Xu, Hongkong University of Science and Technology
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Design Technology Co-Optimization Methods for Advanced Logic Nodes
Xingsheng Wang, Huazhong University of Science and Technology
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TBD
Yongfu Li, Shanghai Jiao Tong University
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Machine Learning for Device Modeling (MLDM) in the DTCO Eco-system
Lining Zhang, Peking University
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Diffusive/Quantum Carrier Transport and Multiphysics Simulation Methods of Advanced Electronic/Optoelectronic Device
Wenchao Chen, Zhejiang University
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Ultra Low Power Connectivity SoC for IoT
Peter Gammel, UBILITE
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TBD
Puneet Gupta, University of California at Los Angeles
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In-memory Computing and Dynamic Vision Sensors: Recipes for tinyML in Internet of Video Things
Arindam Basu, Hongkong City University
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Neuromorphic Audio Edge Intelligence
Shih-Chii Liu, University of Zurich and ETH Zurich
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TBD
Mario Lanza, KAUST
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TBD
Mark Lu, Semitronix Corporation
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TBD
Dong Ni, Zhejiang University
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TBD
Shaodi Wang, WITMEM Co. Ltd
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TBD
Cimang Lu, Flash Billion
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TBD
Daniele Ielmini, Politecnico Di Milano
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TBD
Yu Han, Empyrean Technology Co., Ltd.
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TBD
Xiangshui Miao, Huazhong University of Science and Technology
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TBD
Dawei Gao, Zhejiang ICsprout Semiconductor Co., Ltd.
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TBD
Bei Yu, The Chinese University of Hong Kong
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TBD
Hongjie Liu, Shenzhen Reexen Technology Co., Ltd.
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Research on the application of artificial intelligence in device compact model and technology – circuits co-optimization
Ye Lu, Fudan University
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TBD
Gang Pan, Zhejiang University
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