Symposium VII: Advanced Packaging and Process Integration

Symposium Committee

Prof. Xing Wu
Chair 		East China Normal University
   
Dr. Steve X. Liang
Co-Chair
   
Dr. Yifan Guo
Co-Chair 		Yibu Semiconductor
   
Dr. Huili Fu
Co-Chair 		HiSilicon
   
Dr. Mark Huang
Member 		Shenzhen University, China
   
Prof. Mingliang Huang
Member 		Dalian University of Technology, China
   
Prof. Kuan-Neng Chen
Member 		National Chiao Tung University
   
Dr. Shin-Puu Jeng
Member 		Director, TSMC
   
Prof. Wenhui Zhu
Member 		Central South University
   
Mr. John Rowland
Member 		Spreadtrum


   
Dr. John Yuanlin Xie
Member 		Altera Corp., CA, USA
   
Dr. Roy Yu
Member 		IBM, Watson Research Center, USA
   
Dr. Yishao Lai
Member 		ASE, Taiwan, China
   
Dr. Jing Shi
Member 		Oracle, USA
   
Dr. Young Do Kweon
Member 		Samsung, Korea
   
Dr. Renzhe Zhao
Member 		Huawei, China
   
Dr. Hong SHI
Member 		Xilinx
   
Dr. Tim Bao
Member 		Air Products and Chemicals, Inc.
   
Dr. Tim Chen
Member 		Yantai Darbond Technology Co., Ltd.
   
Dr. Daniel Lu
Member 		Henkel
   
Dr. Wang Su
Member 		Sinyang Semiconductor
   
Prof. Horng-Show (Frank) Koo
Member 		University into Taipei University of Marine Technology (TUMT)


Dr. Daquan Yu
Member 		Xiamen Sky Semiconductor Co., Ltd.
   
Dr. Minghai Wang
Member 		CTO of Bonotec Electronic Materials
   

Symposium VII: Advanced Packaging and Process Integration

As conventional dimensional scaling faces physical limits, advanced packaging and process integration have taken center stage in driving performance enhancement and system diversification. This session addresses the critical convergence of heterogeneous integration, advanced interconnects, and co-optimized process flows for next-generation integrated circuits.

We welcome original contributions on 3D/2.5D integration, chiplet , hybrid bonding, TSVs, co-packaged optics (CPO), fan-out packaging, and SiP solutions. The session also emphasizes process integration challenges involving novel materials, thermal and power integrity, and ESD.