Prof. Mark Huang
Shenzhen University, China

Mark Huang holds Ph.D. degree in Polymer Chemistry from The Institute of Chemistry, Chinese Academy of Science. He was a Postdoctoral Fellow at National University of Singapore from 1996 to 1998. He was a Material Engineer at Yizheng Chemical Fiber Company, Jiangsu, China from 1991 to 1993, a Senior Process Engineer at Hitachi Chemical Asia/Pacific, a Principal Engineer at Micron Semiconductor Asia from 2001 to 2008 and a Principle Member of Technical Staff at StatschipPAC and Institute of Microelectronics from 2009 to 2010 and Director of Technology Development at SFS Group-Unisteel Technology Group Company from 2011 to 2014. Dr. Huang severed Speed Wireless Technology as CTO being in charge of TSV fabrication from 2014-2018 and now is a Distinguished Professor of Shenzhen University focusing on Advanced IC packaging Materials and Assembly Technology.

He expertises in IC packaging materials (underfill, encapsulants, die-attach film/paste etc) and has been a key technical contributor to the R & D and implementation of advanced assembly technologies inclusive of Flip Chip in Package (FCIP), System in Packaging / Multi Chip Package (SiP/MCP), Wafer Level Chip Scale Package (WLCSP), Cu-Pillar Interconnection, Through Silicon Via (TSV), Fan-out Panel -Level-Packaging (FOPLP), Untra-thin Wafer Processing and Cost-viable packaging solutions. He has published over 70 technical papers and holds 60 U.S. patents and 2 Singapore patent plus more than 50 China patents . His research interests include 3D-IC integration, TSV fabrication and assembly as well as materials-oriented research and development.

Dr. Huang holds China Oversea National Expert Title since 2016.