Symposium V: CMP and Post-Polish Cleaning
Symposium Committee
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Dr. Xinping Qu Chair |
Fudan University, China |
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Dr. Yuchun Wang Co-Chair |
Anji Microelectronics, China |
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Dr. Jingxun Fang Co-Chair |
Huali Microelectronics Corporation, China |
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Dr. Kuochun WU Co-Chair |
Cabot Microelectronics, Asia |
|
Dr. Paul-Chang Lin Member |
SMIC, China |
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Dr. David P. Huang Member |
Intel, USA |
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Dr. Jin-Goo PARK Member |
Hanyang University, Korea |
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Dr. Kailiang ZHANG Member |
Tanjin University of Science & Technology, China |
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Dr. Mahadevaiyer KRISHNAN Member |
IBM, USA |
|
Dr. Shoutian Li Member |
Anji Microelectronics, China |
|
Dr. XinChun Lu Member |
Tsinghua University , China |
|
Dr. Wen-Chiang Tu Member |
Applied Materials, USA |
|
Dr. Chao-Chang Arthur Chen Member |
NTUST, Taiwan, China |
|
Dr. Baoguo Zhang Member |
Hebei University of Technology, China |
|
Dr. Yonggen He Member |
GrandiT Co., Ltd., China |
Symposium V: CMP and Post-Polish Cleaning
CMP has been an enabling technology in IC manufacturing since early 1990s, and the technology continues to play critical roles with increasing applications. Our CMP knowledge at the fundamental level often reveals refreshing insights as we approach the sub-20nm or even sub-10nm technology node in the shrinking geometry while we also stack up the IC in the 3D dimension. CSTIC CMP session (Session V) is a forum for the scientists and engineers to share all the aspects of CMP fundamentals, the latest progress in CMP equipment, CMP related materials, new CMP applications, process optimization, reliability and yield improvement. Topics include but are not limited to the following:
1. CMP fundamentals and modeling
2. Equipment and metrology for process control and defect reduction
3. Consumables including abrasive particles, slurries, pads, conditioning disks, CMP cleaning chemicals, and brushes, etc
4. CMP and post CMP cleaning process optimization in front end, middle end, back end, and various substrates such as silicon wafers and wafer reclaiming
5. Emerging applications for 3D IC’s such as FinFET, 3D NAND, hybrid bonding, TSV, MEMS, and advanced packaging