Symposium Chair: Prof. Cheng Zhuo, Zhejiang University, China


** to designate keynote talk - 30 min      
* to designate invite talk - 25 min
  to designate regular talk - 15 min

Sunday, March 22, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Function Room 4


Session I: AI-Driven Manufacturing Innovation
Session Chair: Zheyu Yan
**13:30-14:00 TBD
  Chiayen Li, 晶合集成
*14:00-14:25 The Silicon Backbone of Intelligence: How Semiconductors Are Powering the Next Era of AI
  Diana Khlan, Chips Weekly by Diana
*14:25-14:50 Large Model-Driven Co-Optimization of IC Design and Manufacturing
  Qi Sun, Zhejiang University
14:50-15:05 Coffee Break
 
*15:05-15:30 Unlocking the Power of Semiconductor Data: Driving Innovation through Advanced Analytics
  Guohao Wang, ZetaTech
15:30-15:45 Semiconductor Manufacturing Innovation for Energy-Efficient AI Data Center
  Pengfei Lyu, Lam Research
15:45-16:00 Physical-Data Hybrid Modeling in Advanced Semiconductor Manufacturing
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
16:00-16:15 Real-Time Virtual Metrology Modeling for Etch Rate Prediction
  Guangyao Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
   
16:30-18:00 Panel Discussion(Meeting Room: Pudong Ballroom 1)
   

Monday, March 23, 2026 Kerry Hotel Pudong,Shanghai
Meeting Room: Function Room 4

Session II: AI-Enabled EDA and DFM
Session Chair: Ye Lu
**09:00-09:30 Pushing the Limits of Graph Learning for Scalable and Accurate Circuit Design
  Tsung-Yi Ho, The Chinese University of Hong Kong, CUHK
*09:30-09:55 System Technology Co-Optimization (STCO) of 2.5D/3D IC Interconnects for Unleashing AI Potential
  Bo Pu, DeTooLIC Technology co., Ltd.
*09:55-10:20 EDA in the Era of AI: What Large Models Bring to Chip Design?
  Qiang Xu, The Chinese University of Hong Kong, CUHK
10:20-10:35 Trifocusnet: A Triple-Branch Focus-Attention Network for Hotspot Detection in LELE Double Patterning Process
  Wenxi Zhuang, Fujian Jinhua Integrated Circuit Co.,Ltd
10:35-10:50 Coffee Break
   

Session III: AI for TCAD and Device Optimization
Session Chair: Peng Huang
*10:50-11:15 Memristor-based Computing-in-Memory Chip Co-Design for Edge AI
  Xingsheng Wang, Huazhong University of Science and Technology
*11:15-11:40 A Model-driven DTCO with Machine Learning Enhancements
  Lining Zhang, Peking University
11:40-11:55 DiffusionTCAD: Joint Multi-Physics Field Synthesis for Real-Time Surrogate Device Simulation
  Xulin Zhang, Zhejiang University
11:55-12:10 BAYESIAN LEARNING FOR STRUCTURE AND RECIPE OPTIMIZATION WITH LIMITED DATA AND MIXED VARIABLES
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
12:10-12:25 Emulation of Intensity-Dependent Neuronal Firing Latency Using a HfOx-Based Volatile Memristor
  Xiaqing Fu, Zhejiang University
12:25-13:30 Lunch Break
   

Session IV: Advanced Circuit Design and Technology Co-Optimization
Session Chair: Xingsheng Wang
*13:30-13:55 AI-Assisted Radio-Frequency Integrated Circuits
  Chenhao Chu, ETH Zürich
*13:55-14:20 Re-thinking LLM Systems Beyond DRAM: Near-Storage Computing for Inference and Retrieval
  Weihong Xu, Zhejiang University
*14:20-14:45 AI-enabled Layout-Mask-Wafer Co-Optimization
  Hao Geng, ShanghaiTech University
14:45-15:00 Design Analysis and Wafer Process Optimization of Flicker-Noise for 0.152µM PMIC Chips
  Wen-Sheng Xu, UNISOC (Shanghai) Technologies Co., Ltd.
15:00-15:15 Module-based Single-frequency FBAW Filter Design for mmWave Band (24.25–27.5 GHz)
  Xian Ji, IWA SYSTEMS INC
15:15-15:30 Coffee Break
   

Session V: Devices, Test, and Manufacturing Applications
Session Chair: Weihong Xu
15:30-15:45 Machine Learning Driven Full Spectrum Analysis for Process Enhancement
  Yuyang Sun, Lam Research
15:45-16:00 Machine Learning for Process Uniformity Optimization
  Wenting Wu, Lam Research
16:00-16:15 Data-Driven Root Cause Analysis for Semiconductor Device Unrepeatable Issue
  Jingqi Wang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
16:15-16:30 Data-Driven Assessment of Health Status for Semiconductor Equipment
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
16:30-16:45 Reliable and Cost-effective Solutions for Specialty Technologies in Automotive
  Jiayu Sun, Lam Research
16:45-17:00 Maximizing Scan Test Throughput- Integrating Tessent SSN with the Advantest V93000 Across the Silicon Lifecycle
  Kevin YAN, ADVANTEST
17:00-17:15 Temperature Control of Esc Under Cold Wafer Chucking Disturbance Using Modern Two Degrees-of-Freedom Controller Design
  Yuanzhe Zhao, Advanced Micro-Fabrication Equipment Inc. China
   
Poster Session: Monday, March 23, 16:00-18:00
  Maximize Equipment Capacity By EI Products And Digital Twins
  Jeremy Wu, Lam Research
  Explainable Machine Learning for CFP-LDMOS: Mechanism Analysis and Electrical Performance Prediction via XGBoost and SHAP
  Yiting Ye, Zhejiang University
  Parameter Optimization for Plasma Etching Profiles Using Machine Learning and Bayesian Optimization
  Ziyao Luo, Shanghai Huali Integrated Circuit Corporation
  An ICP Process Prediction Method Based on the Ae-Transformer Neural Network
  Tingyang Qin, Nanjing University
  Toward Accelerated Device Development: A DNN-CNN Approach for DEMOS Breakdown Voltage Prediction
  Yan Pan, Zhejiang University
  A Transformer-Driven Wafer Map Classification Approach for Generalizable Wafer Quality Control
  Gangjiang Li, Semi-Tech Co., Ltd.,
  Predictions and Optimizations for Thin-Film Property in CESL Process by CGAN
  Weijianxiong Ren, Zhejiang University
  A Deep Learning-Based Surrogate Model for LOCOS Etch Process TCAD Simulation using a Conditional Variational Autoencoder
  Qipei Zhang, Zhejiang University
  Intelligent Semiconductor Manufacturing: Process Optimization and Quality Enhancement Based on Data and Algorithms
  Xiaolan Duan, Shanghai Huali Integrated Circuit Corporation
  Mixture-of-Experts Collaboration for Intelligent OQA Management Ecosystem
  Jinjin Li, Shanghai Huali Integrated Circuit Corporation
  Wat Data Generation with Classifier-Free Guided Diffusion Model for Semiconductor Process Prediction
  Liangyao Deng, Zhejiang University
  Research on a Data-Augmentation-Based Neural-Network Model Methodology for Electrical-Parameter Prediction of 40nm MOSFETs
  Fan Yang, Nanjing University
  Inline Anomaly Detection System Based on Historical Data Trends
  Shijia Yan, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(XMC)
  A Cost-Efficient Reinforcement Learning Framework for Semiconductor Process Recipe Optimization
  Lin Fu, Zhejiang University
  A Multi-Scale Simulation Tool for Semiconductor Fabrication Modeling
  Sisi Liu, Advanced Micro-Fabrication Equipment Inc.China (AMEC)
  Stacking Ensemble Learning For Predicting Thickness and Refractive Index of SiCOH Film
  Jinxu Liu, Zhejiang University
  A Learning-Based Method for High-Performance Tracking Control in Semiconductor Manufacturing
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
  Performance Assessment-Based Adaptive Optimization Of PID Control in Semiconductor Manufacturing
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China
  Performance Assessment-Based Adaptive Optimization Of PID Control in Semiconductor Manufacturing
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China
  Smith Predictor-Based Adaptive Sliding Mode Control Scheme for Semiconductor Temperature Regulation
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China
  Depth-Aware Vision Transformer for High Aspect Ratio SEM Image Segmentation and CD Metrology
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
  Reinforcement Learning-Based Wafer Predictive Pickup Scheduling Optimization
  Shangwei Zhao, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
  Feature Extraction Methods in Semiconductor Manufacturing Systems
  Zhihui Ji, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
  Adaptive Semiconductor Process Optimization Based On Batch Bayesian Optimization
  Kai Zhang, Advanced Micro-Fabrication Equipment Inc. China (AMEC)
  CMOS Image Sensor Fixed Pattern Noise Performance Optimization and Mechanism Analysis
  Jiajie Kang, Shanghai Huali Integrated Circuit Corporation