* to designate invite talk - 30 min      
  to designate regular talk - 20 min

Monday, June 26, 2023 Shanghai International Convention Center
Meeting Room:

Session I: 3D and Advanced Packaging Technologies
Session Chair: Xing Wu
13:30-13:35 Opening Remarks
  Xing Wu
*13:35-14:05 Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration
  Len Tedeschi, Applied Materials
*14:05-14:35 Development of 3D Embedding Glass Wafer Fan-Out Technology
  Daquan Yu, Xiamen University, China
14:35-14:55 Integrating High Frequency Radar Chip using Laminated Substrate Transitions for System-in-Package Design
Boping Wu, JCET Group Co., Ltd.
14:55-15:15 Electromagnetic interference shielding solution for System-in-Package
  Jiongjiong Gu, JCET Group Co., Ltd.
15:15-15:35 Coffee Break

Session II: Novel Packaging Materials and Process
Session Chair:
*15:35-16:05 TBD
  Zhiwei Liu, University of Electronic Science and Technology of China
*16:05-16:35 TBD
  Ping Liu, University of Shanghai for Science and Technology
16:35-16:55 Printable Copper Sintering Paste for High-Power Die-Attach Application
  Li Ma, Indium corporation
16:55-17:15 Rough Ni PPF for Mold Adhesion Improvement
  Weigang Wu, Dupont Electronic Materials
17:15-17:35 Rough Silver for Lead-Frame Reliability
  Fai-Lung Ting, Dupont Electronic Materials

Tuesday, June 27, 2023 Shanghai International Convention Center
Meeting Room:

Session III: Inspection, Test and Reliable
Session Chair:
*9:00-9:30 TBD
  Yanhong Tian, Harbin Institute of Technology
9:30-9:50 A Negative-Tone Photosensitive Polyimide (PSPI) Material for Semiconductor Packaging Applications
  Peng Li, Jinan ShengQuan (SQ) New Materials Limited
9:50-10:10 A Simulation Study on the Thermal Effectiveness of Graphene-Based Films in Intelligent Power Modules
  Jie Bao, Huangshan University
Poster Session:
  Effects of different catalysts on epoxy molding compound
  Yangyang Duan, Jiangsu Hua Hai Cheng Ke Advanced Material Co. Ltd
  Improvement of Via Profile through the Structure Design in a 12-inch Wafer
  Lu Wang, Shanghai Huali Microelectronics Corporation
  Reason for the failure of PDMS packaging to cure on reduced graphene oxide films
  Xu Ran, East China Normal University