| * | to designate invite talk - 30 min | |||
| to designate regular talk - 20 min |
Monday, June 26, 2023 Shanghai International Convention Center
Meeting Room:
Session I: 3D and Advanced Packaging Technologies
Session Chair: Xing Wu
| 13:30-13:35 | Opening Remarks |
| Xing Wu | |
| *13:35-14:05 | Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration |
| Len Tedeschi, Applied Materials | |
| *14:05-14:35 | Development of 3D Embedding Glass Wafer Fan-Out Technology |
| Daquan Yu, Xiamen University, China | |
| 14:35-14:55 | Integrating High Frequency Radar Chip using Laminated Substrate Transitions for System-in-Package Design |
| Boping Wu, JCET Group Co., Ltd. | |
| 14:55-15:15 | Electromagnetic interference shielding solution for System-in-Package |
| Jiongjiong Gu, JCET Group Co., Ltd. | |
| 15:15-15:35 | Coffee Break |
Session II: Novel Packaging Materials and Process
Session Chair:
| *15:35-16:05 | TBD |
| Zhiwei Liu, University of Electronic Science and Technology of China | |
| *16:05-16:35 | TBD |
| Ping Liu, University of Shanghai for Science and Technology | |
| 16:35-16:55 | Printable Copper Sintering Paste for High-Power Die-Attach Application |
| Li Ma, Indium corporation | |
| 16:55-17:15 | Rough Ni PPF for Mold Adhesion Improvement |
| Weigang Wu, Dupont Electronic Materials | |
| 17:15-17:35 | Rough Silver for Lead-Frame Reliability |
| Fai-Lung Ting, Dupont Electronic Materials | |
Tuesday, June 27, 2023 Shanghai International Convention Center
Meeting Room:
Session III: Inspection, Test and Reliable
Session Chair:
| *9:00-9:30 | TBD |
| Yanhong Tian, Harbin Institute of Technology | |
| 9:30-9:50 | A Negative-Tone Photosensitive Polyimide (PSPI) Material for Semiconductor Packaging Applications |
| Peng Li, Jinan ShengQuan (SQ) New Materials Limited | |
| 9:50-10:10 | A Simulation Study on the Thermal Effectiveness of Graphene-Based Films in Intelligent Power Modules |
| Jie Bao, Huangshan University | |
| Poster Session: | |
| Effects of different catalysts on epoxy molding compound | |
| Yangyang Duan, Jiangsu Hua Hai Cheng Ke Advanced Material Co. Ltd | |
| Improvement of Via Profile through the Structure Design in a 12-inch Wafer | |
| Lu Wang, Shanghai Huali Microelectronics Corporation | |
| Reason for the failure of PDMS packaging to cure on reduced graphene oxide films | |
| Xu Ran, East China Normal University | |