
* | to designate invite talk - 30 min | |||
to designate regular talk - 20 min |
Monday, June 26, 2023 Shanghai International Convention Center
Meeting Room:
Session I: 3D and Advanced Packaging Technologies
Session Chair: Xing Wu
13:30-13:35 | Opening Remarks |
Xing Wu | |
*13:35-14:05 | Processing Innovations to Address the Manufacturing Challenges of Heterogeneous Integration |
Len Tedeschi, Applied Materials | |
*14:05-14:35 | Development of 3D Embedding Glass Wafer Fan-Out Technology |
Daquan Yu, Xiamen University, China | |
14:35-14:55 | Integrating High Frequency Radar Chip using Laminated Substrate Transitions for System-in-Package Design |
Boping Wu, JCET Group Co., Ltd. | |
14:55-15:15 | Electromagnetic interference shielding solution for System-in-Package |
Jiongjiong Gu, JCET Group Co., Ltd. | |
15:15-15:35 | Coffee Break |
Session II: Novel Packaging Materials and Process
Session Chair:
*15:35-16:05 | TBD |
Zhiwei Liu, University of Electronic Science and Technology of China | |
*16:05-16:35 | TBD |
Ping Liu, University of Shanghai for Science and Technology | |
16:35-16:55 | Printable Copper Sintering Paste for High-Power Die-Attach Application |
Li Ma, Indium corporation | |
16:55-17:15 | Rough Ni PPF for Mold Adhesion Improvement |
Weigang Wu, Dupont Electronic Materials | |
17:15-17:35 | Rough Silver for Lead-Frame Reliability |
Fai-Lung Ting, Dupont Electronic Materials | |
Tuesday, June 27, 2023 Shanghai International Convention Center
Meeting Room:
Session III: Inspection, Test and Reliable
Session Chair:
*9:00-9:30 | TBD |
Yanhong Tian, Harbin Institute of Technology | |
9:30-9:50 | A Negative-Tone Photosensitive Polyimide (PSPI) Material for Semiconductor Packaging Applications |
Peng Li, Jinan ShengQuan (SQ) New Materials Limited | |
9:50-10:10 | A Simulation Study on the Thermal Effectiveness of Graphene-Based Films in Intelligent Power Modules |
Jie Bao, Huangshan University | |
Poster Session: | |
Effects of different catalysts on epoxy molding compound | |
Yangyang Duan, Jiangsu Hua Hai Cheng Ke Advanced Material Co. Ltd | |
Improvement of Via Profile through the Structure Design in a 12-inch Wafer | |
Lu Wang, Shanghai Huali Microelectronics Corporation | |
Reason for the failure of PDMS packaging to cure on reduced graphene oxide films | |
Xu Ran, East China Normal University |