Symposium Chair: Dr. Leo Pang, D2S Inc., USA
| ** | to designate keynote talk - 30 min | |||
| * | to designate invited talk - 20 min | |||
| to designate regular talk - 15 min |
Sunday, March 22, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Function Room 1
Session I: TBD
Session Chair: Ken Wu/Zhongwei Jiang
| 13:30-13:35 | Opening Remarks |
| **13:35-14:05 | Production-Ready Full-Chip Entirely Curvilinear ILT and Curvilinear Masks for DUV |
| Leo Pang, D2S, Inc. | |
| **14:05-14:35 | TBD |
| **14:35-15:05 | TBD |
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| 15:05-15:20 | Coffee Break |
Session II: Keynote Session (2)
Session Chair: Leo Pang/Yayi Wei
| **15:20-15:50 | Why It is Important to Set Up Process Standards and Implement Design-Infrastructure Co-Optimization |
| Qiang Wu, Fudan University | |
| **15:50-16:20 | Negative-Tone Imaging (NTI) Process and Material Technology for ArF Immersion and EUV Lithography |
| Hideaki Tsubaki, FUJIFILM Corporation | |
| 16:30-18:00 | Panel Discussion (Meeting Room: Pudong Ballroom 1) |
Monday, March 23, 2026, Kerry Hotel Pudong, Shanghai
Meeting Room: Function Room 1
Session III: Computational Lithography (3)
Session Chair: Wenzhan Zhou/Weimin Gao
| *8:30-08:55 | Source and Curvy-Mask Optimization with Continuous Tone Quantization |
| Yijiang Shen, Guangdong University of Technology | |
| *08:55-09:15 | Curvilinear Thick-Mask Model under Oblique-Incidence |
| Haofeng Chen, Huazhong University of Science and Technology | |
| *09:15-09:40 | Imaging Performance and Challenges of Hyper NA (0.75 NA) EUV Lithography for Sub-2 nm Nodes |
| Yanli Li, Fudan University | |
| *09:40-10:05 | Simulation investigation of DUV lithography limit: co-optimization of pitch 74nm L/S and large mark patterns |
| Congjian Yi, Tsinghua University | |
| 10:05-10:25 | Coffee Break |
Session IV: OPC and Modeling (3)
Session Chair: Yayi Wei/David Wei
| *10:25-10:50 | Impact of Low-n Absorber on SMO in High-NA EUV Lithography for sub-3 nm Nodes |
| Xianhe Liu, Fudan University | |
| *10:50-11:10 | Intra Overlay Signature Optimization by ForTune RegC to sub 0.5nm for OPO Control in Advanced Logic Process |
| Shuo Liu, Carl Zeiss (Shanghai) Co., Ltd. | |
| *11:10-11:35 | Imaging and resist modeling in photolithography for optical proximity correction |
| Hao Jiang, Huazhong University of Science and Technology | |
| *11:35-12:00 | Random Layout Generation for Middle of Line in Multiple Patterning Technology |
| Xiaojing Su, Institute of Microelectronics, Chinese Academy of Sciences | |
| 12:00-13:30 | Lunch Break |
Session V: Equipment (3)
Session Chair: Shiyuan Liu/George Lu
| **13:30-14:00 | Smarter Photomask Manufacturing: Enhancing SLX Performance and Applying Industry 5.0 Methodology |
| Xueying Hai Young Jin Park, Mycronic | |
| *14:00-14:25 | X-Ray Critical Dimension Metrology for IC Nanostructures at Advanced Nodes |
| Xiuguo Chen, Huazhong University of Science and Technology | |
| *14:25-14:45 | End-to-end Neural Lithography Framework for Wafer-Scale Micro Optics |
| Kaixuan Wei, King Abdullah University of Science and Technology (KAUST) | |
| 14:45-15:15 | Coffee Break |
Session VI: Photoresist (3)
Session Chair: Xiaomin Ma/Motokatsu Imai
| *15:15-15:35 | Optimizing Photoresist Line-Width Roughness via Combined ICP and IBS Process Control |
| Shuo Dong, Jiangsu Leuven Instruments | |
| *15:35-15:55 | Investigation of 193 Resist Polymer Dissolution Behavior through HTE-Assisted HSP |
| Huawei Zhou, Suzhou Lab | |
| Poster Session: Monday, March 23, 16:00-18:00 | |
| Synthesis of a Novel Fluorinated Methacrylate Polymer used in Immersion Photoresist | |
| Xiangfei Zheng, Rui Hong (Suzhou) Electronic Chemicals Co., Ltd | |
| Integrating CFD and SRGAN for Fast Super-Resolution Photoresist Coating Simulation | |
| Chaoyi Zheng, Zhejiang University | |
| Peanut-Shaped Template Guided Directed Self-Assembly for 50-85nm Pitch Dual-Hole Patterning in Advanced Logic Chips | |
| Yue Zhang, Zhangjiang Laboratory | |
| Physics-Informed Neural Networks for Accurate Photoresist Thickness Prediction | |
| Liejie Huang, Zhejiang University | |
| Directed Self-Assembly for Fabricating Rectangular Nanostructures with Tunable Aspect Ratios for Sub-7 nm BEOL Interconnects | |
| Zhhiyong Wu, Zhangjiang Laboratory | |