| Date: | 08:45-10:15 on March 24, 2026 |
| Venue: | 3F, Kerry Hotel Pudong, Shanghai |
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Speaker 1: Dr. Cheng Qi, Technical Expert, Shanghai Huali Microelectronics, China Biography: Dr. Cheng, Qi received the Ph.D degree from University of Missouri, Columbia, U.S.A. in electrical and computer engineering. He holds several patents and has published more than 10 international journal or conference papers.He is currently a technical expert in Shanghai Huali Microelectronics. He served as many critical roles of process R&D in semiconductor industry. His expertise includes process and equipment co-optimization of ICP, CCP and special etch, advanced patterning and advanced process integration. He also has strong experience of strategic planning and technical roadmap design for top wafer fabrication equipment (WFE) company to drive revenue growth and increase market share in new domain. |
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Speaker 2: Mr. Zheng Tao, Vice President of etching product center, Leuven Instruments, China Biography: Mr. Zheng Tao serves as the vice president of etching product center at Leuven Instruments. He leads the research projects for the development of Chimera 300mm ICP etch systems for advanced node of logic and memory devices. His research focus is on process technology and integration, advanced patterning, ion beam etch technology and plasma physics. Prior to joining Leuven Instruments, he was PMTS in advanced patterning department of imec for over 10 years. Prior to that, he worked for AMEC, Sony, UMCi, Lam research in the field of plasma etch and process development since year 2000. Mr. Zheng Tao received his bachelor degree in Chemistry from Fudan University, China. He holds more than 30 patents and has published ~10 academic papers in international journals and conferences. |
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Abstract:
Part I Plasma dry etch 等离子体干法刻蚀 |