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  1. Jun Ma / 马骏

    ...eveloped by PMISH in 2019: EFILM300SS/DS® standalone film thickn...

    Basic page - 2020-06-10 16:01:57.0

  2. Boyu Dong / 董博宇

    ... Beijing Overseas Talents in 2013 Awarded Beijing Capital Labor meda...

    Basic page - 2020-06-04 10:32:17.0

  3. Mr. Terrance Lee

    ...terials, Inc. Terrance has over 30 years of experience in the Semico...

    Basic page - 2020-06-12 17:19:32.0

  4. 李健民 / Jianmin Li

    ...emory market trend •  3D NAND packaging technology • ...

    Basic page - 2020-06-04 14:31:17.0

  5. Actel Niu / 牛风举

    ...、STMicro、华为技术有限公司等从事集成电路设计工作,2003年出版技术专著《基于IP复用的数字IC设计技术》。

    Basic page - 2020-06-08 10:03:08.0

  6. Dr. Yifan Guo / 郭一凡 博士

    ...nd reliability analysis and has 30 years of research and manufacturi...

    Basic page - 2020-06-10 16:56:51.0

  7. Yupeng Xu / 徐玉鹏

    ...通过各类传感器(声/光/电/热/位置等等)获取信息,预测到2023年全球将每年消耗1万亿颗传感器,人均超过100颗,传感芯片(MEMS ...

    Basic page - 2020-06-10 17:03:07.0

  8. Max.Cai / 蔡维伽

    ...ention recently in the scope of 3D integrated packaging. When it com...

    Basic page - 2020-06-10 16:22:45.0

  9. Dr. Wei Li / 李炜 博士

    ...上海硅产业投资有限公司2015年12月成立起任副总裁;2019年3月起任上海硅产业集团股份有限公司执行副总裁;曾担任新傲科技总经理助理、...

    Basic page - 2020-06-15 10:28:00.0

  10. Pete Ling

    ...strategic customers. January 2003 - March 2010: Senior Key Accounts ...

    Basic page - 2020-06-10 17:39:01.0