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1. Grand Opening Keynote

   ...ednesday, March 25, 2026 Time: 13:00-16:30 Venue: Shanghai Ballroom ...

   Basic page - 2025-12-08 16:50:25.0

2. Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)

   ...uesday, March 24, 2026 Time: 09:30-17:00 Venue: Pudong Ballroom 1, 3...

   Basic page - 2025-12-09 15:05:17.0

3. Prof. Yungang Bao

   ...aculty Award of the year for 2013 and the winner of CCF-IEEE CS Youn...

   Basic page - 2024-09-29 11:21:53.0

4. Prof. Jianguo Ma

   ...reless Components Letters in 2003 –2005; He was the member for IEEE ...

   Basic page - 2025-03-06 16:52:23.0

5. Dr. Guanghong Luo

   ...rials. Up-to-day, he has issued 3 China Patents, one of which has be...

   Basic page - 2024-09-29 11:40:39.0

6. Prof. Zebo Peng

   ...ogram Chair for ETS 2007 and 2013, and General Co-Chair for ITC-Asia...

   Basic page - 2025-09-03 11:33:04.0

7. SEMICON/FPD China 2023 Date Change Notice

   尊敬的展商，您好！ 受新冠疫情影响，SEMICON/FPD 2023原定展期面临较大的不确定性。为了符合政府疫情防控政策，保障广大展商、观...

   Basic page - 2022-12-08 17:25:27.0

8. Dr. Wuping Liu

   ...h Product Business Group, AMEC 23-year experience in semiconductor i...

   Basic page - 2023-03-24 12:37:15.0

9. Allen Lee

   ...D Center AMD Allen Lee has over 30 years' experience in semiconducto...

   Basic page - 2020-12-16 13:42:12.0

10. 2022 Exhibition Date Change Notice

    ...rom March 16-18, 2022 to March 23-25, 2022. Venue remains unchanged,...

    Basic page - 2021-06-16 12:38:09.0