SearchResult

1. Song Bai / 柏松

   ...，1975年10月生。1997年本科毕业于北京大学物理系。2003年获美国匹兹堡大学物理专业博士学位，读博期间主要从事宽禁带半导体材料及...

   Basic page - 2020-06-23 10:59:28.0

2. Ganming Zhao / 赵甘鸣

   ...ology support on foundry, DRAM, 3D NAND, CIS and emerging memory to ...

   Basic page - 2020-06-12 14:57:28.0

3. Dr. Carlos Mazure

   ...m since July 2014. IEEE Fellow, 34 years of experience in Semiconduc...

   Basic page - 2019-03-15 17:27:38.0

4. Bennini Fouad

   ...eer, Dr. Ing. Bennini has over 13 years’ national and international ...

   Basic page - 2019-01-28 10:10:39.0

5. Filippo Di Giovanni

   ...nder severe mission profiles. HU3PAKTM is a small-outline SMD power ...

   Basic page - 2020-06-12 11:00:53.0

6. Panel Discussion

   ...ost wanted technologies for AI? 3. What will be the next big thing(s...

   Basic page - 2019-01-24 15:32:00.0

7. Dr. Klaus Schuegraf

   ...y's non-volatile NAND flash and 3D memory road map and directed the ...

   Basic page - 2019-01-11 17:21:13.0

8. Dr. Nuo Xu

   ...evices Meeting (IEDM), IEEE SOI-3D-Sub-threshold (S3S) Conference, I...

   Basic page - 2019-01-11 17:37:11.0

9. Joint Session: Symposium II, Symposium VIII and Symposium IX-AI

   ...huang Lin & Wenjian Yu **10:30-11:00 How to Successfully Overcom...

   Basic page - 2019-02-28 11:40:48.0

10. Joint Session: Symposium II and Symposium III-Lithography/Etch

    ...rs: Kafai Lai & Ying Zhang 13:30-13:35 Opening Remarks   Ka...

    Basic page - 2019-02-14 15:10:15.0