SearchResult

1. Michael Yi / 易义军

   ...the SPTS China sales team in 2013, he was principal process engineer...

   Basic page - 2020-06-23 11:01:50.0

2. Dustin Ho / 何文彬

   ...than 20 technical papers, holds 32 patents, and has presented at num...

   Basic page - 2020-06-03 10:30:15.0

3. Jun Ma / 马骏

   ...eveloped by PMISH in 2019: EFILM300SS/DS® standalone film thickn...

   Basic page - 2020-06-10 16:01:57.0

4. Boyu Dong / 董博宇

   ... Beijing Overseas Talents in 2013 Awarded Beijing Capital Labor meda...

   Basic page - 2020-06-04 10:32:17.0

5. Mr. Terrance Lee

   ...terials, Inc. Terrance has over 30 years of experience in the Semico...

   Basic page - 2020-06-12 17:19:32.0

6. 李健民 / Jianmin Li

   ...emory market trend •  3D NAND packaging technology • ...

   Basic page - 2020-06-04 14:31:17.0

7. Actel Niu / 牛风举

   ...、STMicro、华为技术有限公司等从事集成电路设计工作，2003年出版技术专著《基于IP复用的数字IC设计技术》。

   Basic page - 2020-06-08 10:03:08.0

8. Dr. Yifan Guo / 郭一凡 博士

   ...nd reliability analysis and has 30 years of research and manufacturi...

   Basic page - 2020-06-10 16:56:51.0

9. Yupeng Xu / 徐玉鹏

   ...通过各类传感器（声/光/电/热/位置等等）获取信息，预测到2023年全球将每年消耗1万亿颗传感器，人均超过100颗，传感芯片(MEMS ...

   Basic page - 2020-06-10 17:03:07.0

10. Max.Cai / 蔡维伽

    ...ention recently in the scope of 3D integrated packaging. When it com...

    Basic page - 2020-06-10 16:22:45.0