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Chunjun LIU / 刘春俊
...duction had been realized in 2023. He is author and co-author of mor...
Basic page - 2024-12-31 12:05:16.0
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Wentao Wang / 王文韬
...设标准化协会《零碳工业建筑评价标准》编委会委员； JH/CIE 367-2023 编委会常委； 王文韬女士熟悉国内高科技产业政策与动向，...
Basic page - 2025-03-10 13:22:49.0
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Michel Walden
...argets materials. Mike has over 30 years of experience in the semico...
Basic page - 2025-01-16 10:33:50.0
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Dr. Tim Chen / 陈田安
...全球半导体封装材料市场预测 1.2 市场规模增长的驱动展望 1.3 先进制造工艺介绍 二. 半导体封装材料发展现况 2.1 集成电路封装...
Basic page - 2025-02-05 12:19:55.0
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Cody Zhang / 张朝辉
... • 2021 Forbes Asia U30 Elite • 2021 Hurun U30...
Basic page - 2025-03-28 12:24:40.0
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Wei Jiang / 姜伟
...专项等项目/课题19项，参与项目17项。发表SCI/EI收录论文30篇，撰写专著章节1篇，获授权中外发明专利33项，获国家技术发明二等奖...
Basic page - 2025-01-20 14:48:45.0
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Jile JIANG / 蒋继乐
...骨干参与国家科技支撑项目、国家自然科学基金杰青、面上项目、“973”课题多项，担任国际、国内技术委员会委员3项，累计发表论文48篇，其中...
Basic page - 2025-01-23 16:58:35.0
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Dr. Martyn Green
...integrated EFEM and multi-wafer 300mm wafer FOUP cassettes for repro...
Basic page - 2025-01-23 17:00:53.0
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Mario Morales
..., and industry expert with over 30+ years of experience in building ...
Basic page - 2025-02-05 16:37:07.0
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Dr. Yunchun Yang
...ity of California. From July 1993 to February 1998, he worked as an ...
Basic page - 2025-01-24 13:04:38.0
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