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1. Conference of Science & Technology for Integrated Circuits (CSTIC) 2026

   ...gy, advanced memory technology, 3D integration, MEMS technology will...

   Basic page - 2026-04-15 15:52:59.0

2. Steve Jin

   ... in Fan-out WLP development and 3 years development in 3D-IC packagi...

   Basic page - 2026-02-09 15:18:41.0

3. Dr. Wang Yueh

   ...lithography materials more than 30 years. Wang started semiconductor...

   Basic page - 2026-02-13 16:14:54.0

4. Siqun Xiao / 肖思群

   ...as electron microscopy for over 30 years. Mr. Xiao graduated from De...

   Basic page - 2026-02-14 02:29:01.0

5. Guo-Qiang Lo / 卢国强

   ...理至副执行院长（主管研发），任纳米电子/硅光、硅通孔（TSV）-3D先进封装平台、新型存储器（RRAM、MRAM）、硅上氮化镓（GaN-...

   Basic page - 2026-02-27 14:15:35.0

6. Norito Matsumura / 松村贤人

   ...es Division. He has worked over 35 years in TEL and more than 30 yea...

   Basic page - 2026-02-27 14:20:00.0

7. Dr. Harrison Chang / 张欣晴

   ...module, bio-sensing on flexible 3D SiP, smart phone and wearable SiP...

   Basic page - 2026-04-21 17:16:08.0

8. Wendy Zhou / 周妙文

   ...o Wendy Zhou joined Amkor in 2013 and is currently a Senior Director...

   Basic page - 2026-03-02 16:31:55.0

9. Dr. Michael Yu / 俞冠源

   ...om legacy nodes to cutting-edge 3nm process technology. He currently...

   Basic page - 2026-04-24 12:10:54.0

10. Prof. Tibor Grasser

    ...(2008, 2010, 2012, 2014, and 2023), IPFA (2013 and 2014), ESREF (200...

    Basic page - 2026-03-11 16:06:37.0