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Siqun Xiao 肖思群 Sr. Director, Applied Materials 高级总监，应用材料公司 |
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讲师简介 / Speaker Bio Siqun Xiao is a Senior Director of Process Support Engineering at Applied Materials China, and he is responsible for company's China Process Support Engineering Department of the Process Diagnostic and Control Products. Other than Applied Materials, he also held various positions at KLA-Tencor, ThermoFisher/FEI and Nanometrics, working in the field of wafer defect inspection and metrology, as well as electron microscopy for over 30 years. Mr. Xiao graduated from Department of Materials Science and Engineering of Zhejiang University. He received his Dipl. Ing, in Metallurgy from RWTH Aachen and Dr. rer. nat. in physics from University of Gottingen. He was a postdoctoral fellow at the National Center for Electron Microscopy, Lawrence Berkeley Lab USA. 摘要 / Abstract As semiconductor chips continue to shrink in design rule to boost performance and computing power, new challenges emerge in ensuring chip quality and reliability. The increasing adoption of novel structures and architectures together with new materials intensify the need for advanced process control. This evolution demands higher-resolution detection and metrology systems capable of inspecting 3D structures, identifying deeply buried defects and calibrating processes with accurate and precise measurements. These systems must also capture and characterize nanometer sized defects, both surface and embedded, while supporting massive metrology for CD uniformity, on-device overlay, and edge placement error. To meet these demands, chipmakers need solutions that deliver high resolution, high throughput, and optimized cost of ownership. In this presentation, Applied Materials will showcase its comprehensive process control portfolio, designed to empower manufacturers with the tools needed for profitability, high yield, and reliability, while accelerating time to market and maintaining high productivity. |
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