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1. 王锦龙

   ...s for ultra-thin, miniature and 3D assembly. Most of the MIS package...

   Basic page - 2016-02-23 12:06:39.0

2. Leopold Beer

   ...roduct Planning. Since March 2013 he holds the position of Regional ...

   Basic page - 2016-02-02 10:59:16.0

3. Rajeev Rajan

   ... at Qualcomm.He holds more than 35 patents and is a co-author of the...

   Basic page - 2016-02-02 12:12:00.0

4. 濱田公守

   .... He was a TPC chair of ISPSD2013 and a vice-chairperson of EVTeC &a...

   Basic page - 2016-02-05 15:54:12.0

5. 马国伟

   ...T and diode,  led to  33% increase in  chip current&n...

   Basic page - 2016-02-17 17:57:06.0

6. Desi Rhoden

   ...emiconductor industry with over 30 years experience in a broad range...

   Basic page - 2016-02-18 18:16:00.0

7. 彭洁

   ...为积极推动并主导NB-IOT这一极具商用潜力的蜂窝物联网技术进入3GPP R13标准，同时联合合作伙伴全力构建从芯片、模组、终端、解决方...

   Basic page - 2016-02-23 14:19:45.0

8. Dr. Frank Wischmeyer

   ...e applications. From 2002 to 2013 he was Managing Director of Epigre...

   Basic page - 2016-02-25 14:35:02.0

9. Steve Kelley

   ...n Kelley joined Amkor in May 2013 as the President and CEO, and is a...

   Basic page - 2016-02-26 19:06:48.0

10. 刘国旭

    ...onference papers and holds over 30 patents in the fields of LED and ...

    Basic page - 2016-03-04 11:24:22.0