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1. Jinping Ao / 敖金平

   ...in 2022. He published more than 300 papers in international journals...

   Basic page - 2023-12-28 11:01:46.0

2. Dr. Peng Bai

   ...hnology Development. During his 31 years at Intel, Dr. Bai led Intel...

   Basic page - 2025-02-27 15:37:29.0

3. Dr. Jun Yuan

   ...8nm, 20nm, 10nm, 8nm, 5nm, 4nm, 3nm) by improving chip Power-Perform...

   Basic page - 2024-03-16 10:44:10.0

4. Prof. Runsheng Wang

   ...ted over 20 US patents and over 30 Chinese patents. His current rese...

   Basic page - 2023-12-11 14:11:43.0

5. Tan Chee Keong / 陈子强

   ...科技大学（广州），任职于功能枢纽先进材料学域。目前发表SCI文章35余篇，参与会议口头报告80余次，已授权美国专利2项，曾承担及参与多项...

   Basic page - 2024-05-27 14:36:27.0

6. 袁瑞成

   ...程师 2. 搭建以金刚石材料运用的检验中心平台，验证了理论预测的3ω超高热导体系检验仪器对金刚石热导率高精度检验 3. 金刚石材料从热学...

   Basic page - 2024-05-24 11:56:14.0

7. Xiongjie Ding / 丁雄杰

   ...rovincial projects; authorized 23 patents; published 14 papers and 2...

   Basic page - 2023-12-14 10:51:47.0

8. Haojie Li / 李浩杰

   ...材料加工毕业， 8年晶体磨抛加工老工程师，专注碳化硅磨抛材料开发3年。

   Basic page - 2023-12-26 16:18:09.0

9. Weiwei He / 和巍巍

   ...or Association, Director of the 3rd Generation Semiconductor R&D...

   Basic page - 2024-01-17 16:01:47.0

10. Dr.Qingqing Duan

    ...orporation     2019 .03-Prensent Engineer Advanced Module ...

    Basic page - 2023-12-15 13:47:48.0