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1. SEMICON China

   ...ut SEMI SEMI connects more than 3,000 member companies and 1.3 milli...

   Basic page - 2025-10-16 14:55:35.0

2. Chiplet Packaging and Testing Forum

   ...d will grow to $57 billion by 2035. Chiplet can break through bottle...

   Basic page - 2022-03-30 17:54:08.0

3. Dr. Yunlong Li

   ...anced BEOL technology, advanced 3D stacking and chiplet technology, ...

   Basic page - 2024-11-19 12:05:24.0

4. Alan Xu

   ...事业部工艺中心技术总监，工作简要描述：组件研发与组件工艺 2013年.12至2015.5 苏州阿特斯阳光电力有限公司副总工程师，工作简要...

   Basic page - 2017-09-14 15:30:22.0

5. Conference of Science & Technology for Integrated Circuits (CSTIC)

   ...gy, advanced memory technology, 3D integration, MEMS technology will...

   Basic page - 2026-05-06 13:06:32.0

6. Dr. Zhijian(George) Lu

   ...emiconductor industry for over 23 years as an IC device maker and an...

   Basic page - 2019-09-26 11:42:46.0

7. Prof. Ru Huang

   ...hored or coauthored five books, 3 book chapters and more than 250 pa...

   Basic page - 2024-02-01 12:56:01.0

8. SEMICON China 2011

   ...ire semiconductor supply chain. 3. Concurrent Top Programs: A. China...

   Basic page - 2017-06-14 16:13:31.0

9. Call for Papers

   ...Submissions Deadline: September 30, 2025   (Extended ...

   Basic page - 2025-09-29 15:32:23.0

10. Dr. Simon M. Sze

    ...was born in Nanking, China in 1936. He received the B. S. degree fro...

    Basic page - 2026-04-21 14:51:43.0