Chiplet Packaging and Testing Forum
| Date: | Friday, June 17, 2022 |
| Time: | 09:20-12:00 |
| Venue: | New Tech Stage, 2.1H National Exhibition and Convention Center (NECC) Shanghai |
The industry never stops exploring new technologies to stay on the Moore's law track. Chiplet gain rapid adoption in recent years. According to Omdia's forecast, the global Chiplet market will reach $5.8 billion by 2024, and will grow to $57 billion by 2035.
Chiplet can break through bottlenecks such as performance and yield of large die, and reduce the complexity and cost of chip design. Top chip manufacturers are already shipping multiple chiplet-based designs. Foundries and OSATs are also actively promoting advanced packaging technology to seize the market and ensure future competitive positions.
To achieve die stacking and high-density interconnection, Chiplet requires a high level of packaging technology. Are those entrants able to differentiate low-cost and high-performance packaging solutions from the competition? With the increasing complexity of chip architecture and manufacturing process, how to ensure that each chiplets integrated into the system works normally? How will ATE suppliers face the challenges brought about by this? What is the value of the "UCIe" standard announced by ten chip industry giants in March this year to the domestic industry chain? How will it affect the ecological landscape of Chiplet?
Join us at Chiplet Packaging and Testing Technology Forum, where industry experts will discuss the new opportunities and challenges that Chiplet brings to the entire semiconductor industry chain.
Contact Us:
Jenny Jiang
Tel: 021-60278573
Email: [email protected]