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1. Ripley David

   ...rom Iowa State University in 1992 and his M.S. EE degree from Nation...

   Basic page - 2016-01-27 14:44:24.0

2. 黄博

   ...MMIC 代工，与国外 Skyworks 公司合作成功开发 0.25 um ED-modepHEMT 用于 iPhone 6 手机上，并...

   Basic page - 2016-02-04 17:55:40.0

3. 刘国友

   ...封装测试线等的建设。荣获1项国家级、8项省部级奖励，拥有授权专利23项，发表论文30余篇。

   Basic page - 2016-01-27 14:55:13.0

4. 陈马看 / Makan chen

   ...en joined ABB Semiconductors in 2004 with main duty on Design, Manuf...

   Basic page - 2020-01-07 16:20:18.0

5. Michael Zhuang

   ...学位。1991年获得上海交通大学复合材料专业工学硕士学位。1992年赴美国麻省理工学院（MIT）攻读博士学位，1996年获电子材料博士学...

   Basic page - 2016-01-27 15:09:19.0

6. Gan Feng

   ...esident for R&D of Epiworld 2003年毕业于中科院半导体所博士学位，后就职于德国、日本多家科研机构，...

   Basic page - 2016-01-28 10:17:53.0

7. Thieme Tom

   ...l packaging technologies. Since 2010 Tom is with LayTec and contribu...

   Basic page - 2016-01-27 15:20:22.0

8. Min Jeung Cho

   ...bile, IoT including automotive. 20 years working experience in Memor...

   Basic page - 2016-02-03 11:40:47.0

9. 梁胜

   ...anaging director of the office,02 Major Project of National Science ...

   Basic page - 2016-02-05 22:11:04.0

10. 魏少军

    ... to China in 1995. From 1998 to 2005, he worked for Datang Telecom T...

    Basic page - 2016-01-27 18:05:09.0