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1. Prof. Daniele Lelmini

   ...D from Politecnico di Milano in 2000, and he held visiting positions...

   Basic page - 2018-05-17 10:14:45.0

2. Prof. Wenhui Zhu

   ... Wafer-Level 3D Integration for 20/14nm ICs” which is the 1st Nation...

   Basic page - 2018-05-17 10:18:31.0

3. Prof. Pingqiang Zhou

   ...rom Tsinghua University in 2007, and a Ph.D. degree from the&nb...

   Basic page - 2024-10-28 16:29:52.0

4. Prof. Yanan Sun

   ...hanghai Jiao Tong University in 2009, and the Ph.D. degree in Electr...

   Basic page - 2024-10-29 11:12:07.0

5. Dr. Zhimin Zhu

   ...plication and lithography since 2004 and has 20 more publications in...

   Basic page - 2019-04-22 15:05:05.0

6. Prof. Thomas Otto

   ... Integration •  Since 2008 deputy head of the Fraunhofer-I...

   Basic page - 2018-06-05 15:32:25.0

7. Prof. Peng Zhou

   ...hysics from Fudan University in 2000 and 2005, respectively. He is c...

   Basic page - 2018-06-08 13:18:17.0

8. Mobile Technology Enabled by Semiconductor 2015

   ... EVENTS - History-SEMICON China 2015 - Mobile Technology Enabled by ...

   Basic page - 2017-08-24 10:09:55.0

9. Prof. Yimao Cai

   ...egree from Peking University in 2006. After that he joined R&D c...

   Basic page - 2017-06-14 10:21:35.0

10. Advanced Packaging 2015

    ... EVENTS - History-SEMICON China 2015 - Advanced Packaging var _gaq =...

    Basic page - 2017-08-23 17:27:30.0